公开(公告)号：US07122124B2

公开(公告)日：2006-10-17

申请号：US10906682

申请日：2005-03-02

Applicant: Dyi-Chung Hu ,  Chih-Kung Huang ,  Chien-Nan Wu

Inventor： Dyi-Chung Hu ,  Chih-Kung Huang ,  Chien-Nan Wu

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC classification number: H05K1/028 ,  H01L21/4846 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/064 ,  H05K3/244 ,  H05K3/383 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2203/0574 ,  H01L2924/00

Abstract: A method of fabricating a film carrier is provided. The method comprises the steps of providing a film; forming a metallic layer on the film, patterning the metallic layer by etching to form a plurality of metallic leads; and, patterning the film by etching to form a plurality of openings so that processing time and manufacturing cost are reduced.

Abstract translation: 提供了一种制造薄膜载体的方法。 该方法包括提供薄膜的步骤; 在所述膜上形成金属层，通过蚀刻图案化所述金属层以形成多个金属引线; 并且通过蚀刻来图案化膜以形成多个开口，从而减少了处理时间和制造成本。

公开(公告)号：US20060086535A1

公开(公告)日：2006-04-27

申请号：US11258068

申请日：2005-10-26

Applicant: Yukihiro Ueno

Inventor： Yukihiro Ueno

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/427 ,  H05K1/116 ,  H05K3/184 ,  H05K3/426 ,  H05K2201/0166 ,  H05K2201/09736 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A plating resist film 2 is formed on a wiring board substrate 1 as a core material of a multilayer printed wiring board, then a through-hole 3 is formed, and through-hole conductor 4 is formed along the wall surface of the through-hole 3 and the through-hole surface of the plating resist film 2, so that protrusion portion 4a is formed in the through-hole conductor 4. The plating resist film 2 is then stripped off and a panel plating layer 5 is formed on the surface of the wiring board substrate 1 and the through-hole conductor 4 so that the through-hole 4 and the panel plating layer 5 are connected with the protrusion 4a coated, and thus the connection area can be increased.

Abstract translation: 在作为多层印刷电路板的芯材的布线基板1上形成电镀抗蚀剂膜2，然后形成通孔3，并且沿着通孔的壁面形成通孔导体4 3和电镀抗蚀剂膜2的通孔表面，使得突出部分4a形成在通孔导体4中。 然后剥离电镀抗蚀剂膜2，并且在布线板基板1和通孔导体4的表面上形成面板镀层5，使得通孔4和面板镀层5与 突起4a被涂覆，从而可以增加连接面积。

公开(公告)号：US06620735B2

公开(公告)日：2003-09-16

申请号：US09990070

申请日：2001-11-21

Applicant: Stefan Pinter ,  Holger Hoefer

Inventor： Stefan Pinter ,  Holger Hoefer

IPC: H01L21302

CPC classification number: H05K3/4697 ,  H01L21/3043 ,  H01L21/3046 ,  H01L21/31105 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/642 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K3/0044 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2203/025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A method for processing substrates, in which a photoresist layer is applied and structured on their surface. By blasting the substrate with particles, recesses are put into the surface of the substrate in those areas not covered by photoresist.

公开(公告)号：US06593255B1

公开(公告)日：2003-07-15

申请号：US09705353

申请日：2000-11-03

Applicant: Ernest L. Lawton ,  Vedagiri Velpari ,  William B. Rice ,  Walter J. Robertson ,  Bruce E. Novich ,  Xiang Wu ,  Kami Lammon-Hilinski

Inventor： Ernest L. Lawton ,  Vedagiri Velpari ,  William B. Rice ,  Walter J. Robertson ,  Bruce E. Novich ,  Xiang Wu ,  Kami Lammon-Hilinski

IPC: B32B900

CPC classification number: B32B9/00 ,  C03C25/00 ,  C03C25/10 ,  C03C25/26 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2964 ,  Y10T442/20 ,  Y10T442/3049

Abstract: A fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals. A reinforced laminate comprising: (a) at least one matrix material; and (b) at least one fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 0.2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals.

Abstract translation: 一种织物，其包含至少一根纤维束，其包含多根纤维，并且在所述至少一条纤维束的至少一个表面上具有树脂相容的涂料组合物，其中所述至少一条纤维束具有更大的空气喷射输送阻力值 通过具有直径为2毫米的内部空气喷射室的针气喷嘴单元确定的每克质量的绞线的100,000克力和具有274米长度的绞线进给速度的20厘米长度的喷嘴出口管 分钟，气压310千帕。 一种增强层压板，包括：（a）至少一种基体材料; 和（b）至少一种织物，其包含至少一根包含多根纤维并且在所述至少一根纤维束的至少一个表面上具有树脂相容性涂料组合物的纤维束，其中所述至少一根纤维束具有空气喷射 运输阻力通过具有直径为0.2毫米的内部空气喷射室的针空气喷嘴单元和在一根股线上具有20厘米长度的喷嘴出口管确定的每克质量的股线的大于100,000克力的运输阻力值 进料速度为274米/分钟，空气压力为310千帕。

公开(公告)号：US20020123285A1

公开(公告)日：2002-09-05

申请号：US09783538

申请日：2001-02-15

Inventor： David E. Dana ,  Vedagiri Velpari ,  Langqiu Xu ,  Charles Kahle ,  Bruce Novich

IPC: B32B005/02 ,  B32B003/00 ,  B32B009/00 ,  D03D015/00 ,  D03D025/00 ,  B32B015/16

CPC classification number: H05K1/0373 ,  C03C25/47 ,  H05K1/036 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2203/127 ,  Y10T442/20 ,  Y10T442/30 ,  Y10T442/3455

Abstract: The present invention provides an electronic support comprising: (A) at least one woven fiber reinforcement material formed from at least one fiber free of basalt glass; and (B) at least one matrix material in contact with at least a portion of the at least one reinforcement material, the at least one matrix material comprising at least one non-fluorinated polymer and at least one inorganic filler, wherein the at least one inorganic filler comprises at least one non-hydratable, lamellar inorganic solid lubricant having a high electrical resistivity and wherein the at least one inorganic filler comprises at least 6 weight percent of a total combined weight of the at least one inorganic filler and the at least one matrix material on a total solids basis.

Abstract translation: 本发明提供一种电子支撑体，包括：（A）由至少一种不含玄武岩纤维的纤维形成的至少一种编织纤维增强材料; 和（B）与所述至少一种增强材料的至少一部分接触的至少一种基质材料，所述至少一种基质材料包含至少一种非氟化聚合物和至少一种无机填料，其中所述至少一种 无机填料包含至少一种具有高电阻率的不可水合的层状无机固体润滑剂，并且其中所述至少一种无机填料占至少一种无机填料和至少一种无机填料的总重量的至少6重量％ 基体材料。

公开(公告)号：US20020085888A1

公开(公告)日：2002-07-04

申请号：US09783540

申请日：2001-02-15

Inventor： Vedagiri Velpari ,  Charles B. Greenberg ,  Bruce E. Novich

IPC: B23B035/00

CPC classification number: H05K3/0047 ,  C03C25/47 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2203/127 ,  Y10T408/03 ,  Y10T408/44 ,  Y10T408/455

Abstract: The present invention provides a method of forming an aperture in an electronic support, comprising: (A) positioning an electronic support in registry with an aperture forming device; and (B) forming an aperture at least partially through the electronic support with the aperture forming device while dispensing a fluid stream comprising at least one solid lubricant, proximate the aperture forming device during at least a position of the forming, such that the at least one solid lubricant contacts at least a portion of an interface between the aperture forming device and the electronic support.

Abstract translation: 本发明提供了一种在电子支架中形成孔的方法，包括：（A）将电子支架定位成与孔形成装置成对准; 和（B）至少部分地通过所述孔形成装置通过所述电子支撑件形成孔，同时在所述成形的至少一个位置期间分配包括至少一种固体润滑剂的流体流，所述至少一种固体润滑剂在所述孔形成装置附近，使得至少 一个固体润滑剂接触孔形成装置和电子支架之间的界面的至少一部分。

公开(公告)号：US06379569B1

公开(公告)日：2002-04-30

申请号：US09255839

申请日：1999-02-23

Applicant: Marc Rouberol

Inventor： Marc Rouberol

IPC: H01B1300

CPC classification number: H05K3/067 ,  C03C17/23 ,  C03C17/245 ,  C03C17/2453 ,  C03C2217/211 ,  C03C2217/231 ,  C03C2217/24 ,  C03C2217/241 ,  C03C2218/152 ,  C03C2218/33 ,  H01L31/1884 ,  H05K3/061 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0326 ,  Y02E10/50 ,  Y10S134/902

Abstract: The invention relates to a process for chemically etching a layer (2) having electrical conduction properties, on a transparent substrate (1) of the glass type. It includes at least one step of depositing a mask (3) comprising at least one hot-melt ink on the layer to be etched.

Abstract translation: 本发明涉及在玻璃类型的透明基板（1）上化学蚀刻具有导电特性的层（2）的方法。 它包括在待蚀刻层上沉积包含至少一种热熔油墨的掩模（3）的至少一个步骤。

公开(公告)号：US20020030178A1

公开(公告)日：2002-03-14

申请号：US09905052

申请日：2001-07-12

Inventor： Hiroshi Samukawa

IPC: C09K013/00 ,  H01L021/302 ,  H01L021/461

CPC classification number: C08J7/12 ,  C08J2379/08 ,  G03F7/40 ,  G03F7/405 ,  H05K3/002 ,  H05K3/28 ,  H05K3/4614 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2203/0783 ,  H05K2203/0793

Abstract: The disclosure relates to methods and solutions for precisely and rapidly etching a polyimide resin layer. Etching solutions of the present invention include 3-65% by weight of a diol containing 3 to 6 carbon atoms or a triol containing 4 to 6 carbon atoms, 10-55 % by weight of an alkali compound and water in an amount of 0.75-3.0 times the amount of the alkali compound, and can be used at 65null C. or more to rapidly etch a polyimide resin layer having an imidation degree of 50-98 % without unfavorably affecting the working atmosphere. Even if the resin layer is completely imidated after etching, the etching pattern of the resulting resin layer is not deformed with a decreased contamination by impurity ions as compared with those obtained using conventional etching solutions.

Abstract translation: 本公开涉及用于精确且快速蚀刻聚酰亚胺树脂层的方法和解决方案。 本发明的蚀刻溶液包括3-65重量％的含有3-6个碳原子的二醇或含有4-6个碳原子的三醇，10-55重量％的碱金属化合物和0.75- 碱性化合物的量的3.0倍，可以在65℃以上使用，能够迅速地蚀刻酰亚胺化度为50-98％的聚酰亚胺树脂层，而不会对工作气氛产生不利影响。 即使树脂层在蚀刻后完全酰亚胺化，与使用常规蚀刻溶液的那些相比，所得树脂层的蚀刻图案也不会随着杂质离子的污染减少而变形。

公开(公告)号：US06261414B1

公开(公告)日：2001-07-17

申请号：US09185575

申请日：1998-11-04

Applicant: Yoshihisa Kato ,  Takekazu Adachi ,  Mamoru Murata

Inventor： Yoshihisa Kato ,  Takekazu Adachi ,  Mamoru Murata

IPC: D21H1326

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B5/28 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/048 ,  C08J5/24 ,  C08J2361/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/12569 ,  Y10T428/31594 ,  Y10T428/31725

Abstract: The present invention relates to a method of producing a laminate base material useful for preparing a prepreg or a laminate for electronic equipment such as printed board. The method comprises the steps of: (1) preparing a slurry comprising para-aramid fibers and curable phenolic resin fibers; (2) preparing a sheet from said slurry; (3) adding a resin binder to said sheet so as to bond the fibers with each other, thereby to form a combined non-woven fabric and (4) compressing said non-woven fabric under heating. According to the present invention, a prepreg or laminate is obtained which has an improved high-frequency characteristics and much less warp.

Abstract translation: 本发明涉及一种制备用于制备诸如印刷电路板之类的电子设备的预浸料或层压材料的层压基材的方法。 该方法包括以下步骤：（1）制备包含对位芳族聚酰胺纤维和可固化酚醛树脂纤维的浆料;（2）从所述浆料制备片材;（3）向所述片材中加入树脂粘合剂以粘合纤维 从而形成组合的无纺织物，（4）在加热下压缩所述无纺布。根据本发明，获得了具有改善的高频特性和更少翘曲的预浸料或层压材料 。

公开(公告)号：US6121171A

公开(公告)日：2000-09-19

申请号：US56864

申请日：1998-04-08

Applicant: Tsutomu Takahashi ,  Hiroaki Kumada

Inventor： Tsutomu Takahashi ,  Hiroaki Kumada

IPC: C08J5/04 ,  C08J5/18 ,  C08L77/10 ,  H05K1/02 ,  H05K1/03 ,  B32B27/34

CPC classification number: C08J5/18 ,  C08J5/04 ,  C08L77/10 ,  H05K1/0366 ,  C08J2377/10 ,  H05K1/024 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249958 ,  Y10T442/3854 ,  Y10T442/3878 ,  Y10T442/3894

Abstract: Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300.degree. C. of within .+-.50.times.10.sup.-6 /.degree.C. The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.

Abstract translation: 提供了包含对位芳族聚酰胺的连续相和低介电常数树脂相的复合膜，所述膜的介电常数在1MHz不大于3.2，线性热膨胀系数在200至300℃ 在+/- 50×10 -6 /℃以内。复合膜具有低介电常数，良好的机械强度，均匀的结构，重量轻和线性热膨胀系数低的特性，并且该膜可用作 用于柔性印刷电路板的基底。