公开(公告)号：US07785113B2

公开(公告)日：2010-08-31

申请号：US11885262

申请日：2006-10-27

Applicant: Masanori Mizoguchi

Inventor： Masanori Mizoguchi

IPC: H01R12/00

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection of the second connecting member is inserted in the through-hole of the first connecting member, through the small aperture in the pad, bending the pad and the portion of the insulating film under the pad, along the direction of insertion of the conductive projection, so that the pad is pressed onto the conductive projection due to elastic force of the pad and the insulating film bent.

Abstract translation: 一种电连接结构，其允许降低高度并易于拆卸，其中第一连接构件包括柔性基底，该柔性基底包括柔性绝缘膜，至少一个导电垫在其至少一侧上形成，导电电路图案从 衬垫，在衬垫内的平面位置处形成通过其厚度的通孔，以及形成在衬垫内的平面位置并与通孔连通的小孔，第二连接构件包括形成在 至少一个侧面，与形成在第二连接构件的内部或第二连接构件上的导电电路图案电连接，其中电连接形成为使得第二连接构件的导电突起插入第一连接构件的通孔中 连接构件，通过垫中的小孔，弯曲垫和绝缘f的部分 沿着导电突起的插入方向在衬垫下面，使得由于焊盘的弹性力和绝缘膜弯曲而将焊盘压在导电突起上。

公开(公告)号：US20100212937A1

公开(公告)日：2010-08-26

申请号：US12160718

申请日：2006-02-13

Applicant: Masayoshi Kondo ,  Toshio Komiyatani

Inventor： Masayoshi Kondo ,  Toshio Komiyatani

IPC: H05K1/00 ,  H05K13/00

CPC classification number: H05K3/4617 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/423 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2203/068 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: According to the present invention, there is provided a process for manufacturing a circuit board wherein a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected, comprising, as a first step, bonding the conductor pad with the conductor post by thermocompression under predetermined first conditions while the first and the second substrates are arranged such that the conductor pad faces the conductor post through the interlayer adhesive; thermocompressing the first substrate and the second substrate under predetermined second conditions while the conductor pad is bonded with the conductor post; and thermocompressing the first substrate and the second substrate under predetermined third conditions while the conductor pad is bonded with the conductor post, wherein the first, the second and the third conditions are different from each other.

Abstract translation: 根据本发明，提供了一种制造电路板的方法，其中具有导体柱的第一基板和具有用于接纳导体柱的导体焊盘的第二基板通过层间粘合剂层压，并且导体柱和 电导体焊盘电连接，包括作为第一步骤，在预定的第一条件下通过热压接将导体焊盘与导体柱接合，同时布置第一和第二基板，使得导体焊盘通过层间粘合剂面对导体柱; 在导体焊盘与导体柱接合的同时，在预定的第二条件下热压第一衬底和第二衬底; 以及在所述导体焊盘与所述导体柱接合的同时在预定的第三条件下热压所述第一基板和所述第二基板，其中所述第一，第二和第三条件彼此不同。

公开(公告)号：US07772501B2

公开(公告)日：2010-08-10

申请号：US11448717

申请日：2006-06-08

Applicant: Susumu Ueda ,  Shuichi Arimura

Inventor： Susumu Ueda ,  Shuichi Arimura

IPC: H05K1/03

CPC classification number: H05K1/028 ,  H05K1/0313 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/0141 ,  H05K2201/0394 ,  H05K2201/09909

Abstract: A flexible printed circuit board (FPC) is disclosed which can eliminate the need for forming through holes and ensure the strength required for mounting components. The FPC has a metal foil layer formed only on one side of an insulating layer via an adhesive layer. The FPC is configured such that the insulating layer and the adhesive layer are partially removed, and the surface of the metal foil layer on the side from which the insulating layer and the adhesive layer have been removed is flattened. In a region from which the insulating layer and the adhesive layer have been removed, an overcoat layer for reinforcing the metal foil layer is provided along the metal foil layer on a surface opposite to the flattened surface. A drive IC is mounted on a first metal foil face of the metal foil layer and on a second metal foil face which is the flattened surface of the metal foil layer, and is provided with electrical conduction by the metal foil layer. To form the FPC, the insulating layer and the metal foil layer can be directly affixed to each other without using the adhesive layer.

Abstract translation: 公开了一种柔性印刷电路板（FPC），其可以消除形成通孔的需要并确保安装部件所需的强度。 FPC具有通过粘合剂层仅在绝缘层的一侧形成的金属箔层。 FPC被构造为使得绝缘层和粘合剂层被部分去除，并且金属箔层在绝缘层和粘合剂层已被去除的一侧的表面变平。 在去除了绝缘层和粘合剂层的区域中，沿着与扁平表面相对的表面上的金属箔层设置用于加强金属箔层的外涂层。 驱动IC安装在金属箔层的第一金属箔表面上，在金属箔层的平坦表面的第二金属箔表面上，并被金属箔层导电。 为了形成FPC，绝缘层和金属箔层可以直接彼此固定而不使用粘合剂层。

公开(公告)号：US20100188823A1

公开(公告)日：2010-07-29

申请号：US12753329

申请日：2010-04-02

Applicant: ANTTI IIHOLA ,  TIMO JOKELA

Inventor： ANTTI IIHOLA ,  TIMO JOKELA

IPC: H05K1/14

CPC classification number: H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

Abstract translation: 该出版物公开了一种制造电子模块的方法，其中制造从绝缘材料片（1）开始。 在片材（1）中形成至少一个凹部（2），并延伸通过绝缘材料层（1）至相对表面（1a）上的导电层。 将部件（6）设置在凹部中，其接触表面朝向导电层，并且部件（6）附接到导电层。 之后，从导电图案形成导电图案（14），所述导电图案封闭凹部，所述导电图案与设置在凹部中的部件（6）的至少一些接触区域或接触突起电连接。

公开(公告)号：US07757929B2

公开(公告)日：2010-07-20

申请号：US11426298

申请日：2006-06-23

Applicant: Donald A. Ice ,  Darin James Douma

Inventor： Donald A. Ice ,  Darin James Douma

IPC: B23K31/02

CPC classification number: G02B6/4246 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924 ,  H05K2203/302

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract translation: 公开了使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括具有与第二部分分离的第一部分的电绝缘壳体和由电绝缘壳体彼此电隔离的多个导体。 多个导体中的每一个可以形成相对于第一部分被限制在固定位置的电触点和从第二部分延伸的接触点。 电触点对准并焊接到从光学子组件的后端突出的引线。 接触点可以连接到PCB上的电焊盘。

公开(公告)号：US07753489B2

公开(公告)日：2010-07-13

申请号：US11236361

申请日：2005-09-27

Applicant: Koji Imai ,  Hirosumi Ito

Inventor： Koji Imai ,  Hirosumi Ito

IPC: B41J2/14

CPC classification number: H05K3/361 ,  B41J2/14072 ,  H01L2924/0002 ,  H05K3/28 ,  H05K3/321 ,  H05K2201/0394 ,  H01L2924/00

Abstract: A wiring pattern having a plurality of terminal lands and leads independently respectively connected therewith is formed on one face of an insulator of a flexible wiring substrate. The insulator is provided with through-holes whereby the terminal lands are exposed on the other side. The terminal lands are electrically connected and fixed on the other face of the insulator by joining with the head terminals of the inkjet head with conductive adhesive, through the through-holes. Isolation between the leads and terminal lands arranged on the one side thereof from the conductive adhesive is provided by the insulator.

Abstract translation: 在柔性布线基板的绝缘体的一个面上形成具有多个端子台和独立分别连接的引线图案。 绝缘体设置有通孔，由此端子台面在另一侧露出。 通过通孔与导电粘合剂与喷墨头的头端部接合，将端子台电连接并固定在绝缘体的另一面上。 通过绝缘体提供从导电性粘合剂一侧隔开设置在其一侧的引线与端子台。

公开(公告)号：US07742312B2

公开(公告)日：2010-06-22

申请号：US11773279

申请日：2007-07-03

Applicant: Te-Wei Li

Inventor： Te-Wei Li

IPC: H05K7/00

CPC classification number: H05K1/144 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/40 ,  H04M1/0277 ,  H05K1/16 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2201/0999 ,  H05K2201/10303 ,  H05K2203/161 ,  Y10T428/31504 ,  Y10T428/31551

Abstract: An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.

Abstract translation: 提供了一种电子设备和制造方法。 该电子设备包括：衬底，用作形成在衬底的外表面上的天线层的图案化导电层，与用于发送或接收无线信号的印刷电路板（PCB）电连接，其中衬底放置在 图案导电层和PCB。 图案化导电层可以通过连接片通过基板中的孔与PCB电连接。 基板可以是电子设备的壳体。

公开(公告)号：US20100134991A1

公开(公告)日：2010-06-03

申请号：US12320523

申请日：2009-01-28

Applicant: Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

Inventor： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The prevent invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.

Abstract translation: 芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种嵌入式芯片的印刷电路板及其制造方法。 本发明提供了一种芯片嵌入式印刷电路板，其包括：绝缘层，其嵌入在上部设置有柱的芯片，通过绝缘层形成的通孔，形成在要连接到柱的绝缘层的上部的上部图案;以及 形成在绝缘层的与通孔连接的下部的通孔和下部图案及其制造方法。

公开(公告)号：US20100110590A1

公开(公告)日：2010-05-06

申请号：US12588797

申请日：2009-10-28

Applicant: Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

Inventor： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

IPC: G11B5/60

CPC classification number: G11B13/04 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10537 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  H05K2203/0361

Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

Abstract translation: 具有电路的悬挂板包括导电图案，包括布置在具有电路的悬挂板的表面侧上的滑块，并安装有磁头，磁头与导电图案电连接; 以及发光装置，其配置在具有电路的电路的背面侧并与导电图形电连接，其中导电图案包括设置在具有电路的悬挂板的表面上的第一端子，并与磁性电连接 头; 以及设置在所述悬挂板的后表面上并具有电路并与所述发光装置电连接的第二端子。

公开(公告)号：US20100101084A1

公开(公告)日：2010-04-29

申请号：US12257688

申请日：2008-10-24

Applicant: John Guzek ,  Yonggang Li

Inventor： John Guzek ,  Yonggang Li

IPC: H05K3/06

CPC classification number: H05K1/0296 ,  C25D5/02 ,  C25D5/34 ,  H01L23/49541 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K1/09 ,  H05K1/181 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/02 ,  H05K3/045 ,  H05K3/107 ,  H05K3/108 ,  H05K3/188 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/09727 ,  H05K2203/0542 ,  Y10T29/49156 ,  H01L2924/00

Abstract: In some embodiments, same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) is presented. In this regard, a method is introduced including patterning a first density region of a laminated substrate surface using LPP, patterning a second density region of the laminated substrate surface using SAP, and plating the first and second density regions of the laminated substrate surface, wherein features spanning the first and second density regions are directly coupled. Other embodiments are also disclosed and claimed.

Abstract translation: 在一些实施例中，提出使用混合激光投影图案化（LPP）和半添加剂图案化（SAP）的相同层微电子电路图案化。 在这方面，引入了一种方法，包括使用LPP图案化层叠基板表面的第一密度区域，使用SAP对叠层基板表面的第二密度区域进行图案化，以及电镀层叠基板表面的第一和第二密度区域，其中 跨越第一和第二密度区域的特征直接耦合。 还公开并要求保护其他实施例。