公开(公告)号：US07448132B2

公开(公告)日：2008-11-11

申请号：US11537754

申请日：2006-10-02

Applicant: Joel R. Goergen

Inventor： Joel R. Goergen

IPC: H01K3/10

CPC classification number: H05K3/4688 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09354 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number of signaling paths across the backplane at speeds of 2.5 Gbps or greater, as well as distribution of significant amounts of power to router components. The disclosed techniques and features allow relatively thick (e.g., three- or four-ounce copper) power distribution planes to be combined with large numbers of high-speed signaling layers in a common backplane. Using traditional techniques, such a construction would not be possible because of the number of layers required and the thickness of the power distribution layers. The disclosed embodiments use novel layer arrangements, material selection, processing techniques, and panel features to produce the desired high-speed layers and low- noise high-power distribution layers in a single mechanically stable board.

Abstract translation: 所公开的板制造技术和设计特征使得能够构建用于路由器等的可靠的，高层次的和经济的背板，其需要以2.5Gbps或更高的速度跨越背板的大量信令路径，以及 作为路由器组件的大量功率分配。 所公开的技术和特征允许相对较厚（例如，三或四盎司铜）功率分配平面与公共背板中的大量高速信号层组合。 使用传统技术，由于需要的层数和配电层的厚度，这种结构将是不可能的。 所公开的实施例使用新颖的层布置，材料选择，处理技术和面板特征来在单个机械稳定的板中产生期望的高速层和低噪声大功率分配层。

公开(公告)号：US07390192B2

公开(公告)日：2008-06-24

申请号：US11461504

申请日：2006-08-01

Applicant: Ernest F. J. Graetz

Inventor： Ernest F. J. Graetz

IPC: H05K7/20

CPC classification number: H05K1/0263 ,  H01R12/52 ,  H05K1/14 ,  H05K2201/044

Abstract: An electronic system comprises a system board, one or more cards adapted to couple to the system board, wherein the system board transfers signals to and from the one or more cards, at least one electrically conductive plate, and one or more connectors coupled to the at least one electrically conductive plate to or from the one or more cards. A plurality of power supplies and voltages may be used. A measurement point on the at least one electrically conductive plate may be used to exert additional control over the plurality of power supplies.

Abstract translation: 电子系统包括系统板，适于耦合到系统板的一个或多个卡，其中系统板向一个或多个卡，至少一个导电板和耦合到该板的一个或多个连接器传送信号 至少一个导电板到或来自一个或多个卡。 可以使用多个电源和电压。 可以使用至少一个导电板上的测量点对多个电源施加额外的控制。

公开(公告)号：US20080073116A1

公开(公告)日：2008-03-27

申请号：US11984176

申请日：2007-11-14

Applicant: Yuji Sakai

Inventor： Yuji Sakai

IPC: H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC classification number: G06F1/185 ,  G06F1/20 ,  H01L23/3735 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/14 ,  H05K7/205 ,  H05K2201/044 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A semiconductor device includes a module board mounting thereon an electric component and including a plug at an edge of the module board, and a mount board including thereon a socket adapted to said plug on a surface portion of the mount board for mounting thereon the module board via said plug, wherein the mount board includes therein a heat radiation layer in contact with a bottom surface of the socket, wherein the socket comprises a heat radiation guide plate in contact with a side surface of the socket.

Abstract translation: 半导体器件包括：模块板，其安装在电气部件上，并且在模块板的边缘处包括插头;以及安装板，其上安装有用于在所述安装板的表面部分上安装所述模块板的所述插头的插座 通过所述插头，其中所述安装板包括与所述插座的底表面接触的散热层，其中所述插座包括与所述插座的侧表面接触的散热导板。

公开(公告)号：US20080069494A1

公开(公告)日：2008-03-20

申请号：US11861766

申请日：2007-09-26

Applicant: Stefano Oggioni ,  Bert Offrein

Inventor： Stefano Oggioni ,  Bert Offrein

IPC: G02B6/12

CPC classification number: H05K1/147 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/0067 ,  H05K2201/0108 ,  H05K2201/044 ,  H05K2201/048 ,  H05K2201/09127 ,  H05K2201/2009

Abstract: An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be broken along a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.

Abstract translation: 公开了一种包括柔性连接电缆和对准能力的电光模块。 电光器件可以焊接在诸如玻璃的透明衬底或包括其中导电迹线被设计的光波导的衬底上，形成电光模块。 当将这种电光模块插入并对准印刷电路板时，包括导电迹线和焊盘（称为柔性电缆）的基板的外部部分朝向PCB的安装平面向下弯曲，允许建立 这些焊盘和PCB之间的电气连接。 衬底可以沿着预先形成的凹槽断裂，并且衬底的外部部分可被移除，使得柔性电缆部分到位。

公开(公告)号：US20080030286A1

公开(公告)日：2008-02-07

申请号：US11755791

申请日：2007-05-31

Applicant: Myun-Joo Park ,  Jae-jun LEE

Inventor： Myun-Joo Park ,  Jae-jun LEE

IPC: H01P5/12

CPC classification number: H05K1/0216 ,  G11C7/1006 ,  H05K1/0237 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/09727 ,  H05K2201/09781

Abstract: A semiconductor memory device includes memory modules which have memories and a data bus which transfers data to the memory modules, in which the data bus comprises a low frequency band data pass unit which removes the high frequency component of the data and sends the data to the memory modules. The low frequency band data pass unit comprises a plurality of stubs which are connected to the data bus in parallel and are formed as printed circuit board (PCB) patterns. The low frequency band data pass unit comprises a plurality of plates that are connected to the data bus in parallel and are formed as PCB patterns. The low frequency band data pass unit has a shape in which parts having a wide width and parts having a narrow width are alternately connected. Therefore, without adding a separate passive device, the semiconductor memory device reduces the high frequency noise of data transferred through a data bus such that the voltage margin of the data improves, the cost for passive devices such as capacitors, is reduced, and the process for attaching the passive devices is simplified.

Abstract translation: 半导体存储器件包括具有存储器的存储器模块和将数据传送到存储器模块的数据总线，其中数据总线包括一个低频带数据传递单元，该单元去除数据的高频分量并将数据发送到 内存模块 低频带数据传送单元包括并联连接到数据总线并形成为印刷电路板（PCB）图案的多个短截线。 低频带数据传送单元包括并联连接到数据总线并形成为PCB图案的多个板。 低频带数据传送单元具有宽度宽的部分和宽度窄的部分交替连接的形状。 因此，在不添加单独的无源器件的情况下，半导体存储器件减少通过数据总线传送的数据的高频噪声，从而数据的电压裕度提高，诸如电容器等无源器件的成本降低，并且该过程 用于安装无源器件简化了。

公开(公告)号：US07327024B2

公开(公告)日：2008-02-05

申请号：US10998798

申请日：2004-11-24

Applicant: Ljubisa Dragoljub Stevanovic ,  Eladio Clementa Delgado ,  Michael Joseph Schutten ,  Richard Alfred Beaupre ,  Michael Andrew De Rooij

Inventor： Ljubisa Dragoljub Stevanovic ,  Eladio Clementa Delgado ,  Michael Joseph Schutten ,  Richard Alfred Beaupre ,  Michael Andrew De Rooij

IPC: H01L23/52

CPC classification number: H01L24/49 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/0061 ,  H05K3/361 ,  H05K2201/044 ,  H05K2201/0715 ,  H05K2201/10189 ,  H05K2201/10287 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power module includes a substrate that includes an upper layer, an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern and is configured for receiving power devices. The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect that includes first and second electrically conductive layers and an insulating layer disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections connect a top side of the power devices to the second electrically conductive layer of the laminar interconnect.

Abstract translation: 功率模块包括包括上层，电绝缘体和热耦合层的衬底。 上层包括导电图案，并且被配置为用于接收功率器件。 电绝缘体设置在上层和热耦合层之间。 热耦合层被配置为热耦合到散热器。 功率模块还包括至少一个层状互连，其包括第一和第二导电层以及设置在第一和第二导电层之间的绝缘层。 层状互连的第一导电层电连接到衬底的上层。 电连接将功率器件的顶侧连接到层状互连的第二导电层。

公开(公告)号：US20080007895A1

公开(公告)日：2008-01-10

申请号：US11818447

申请日：2007-06-13

Applicant: Takahiro Shimoirisa ,  Atsumi Kawata ,  Fusaaki Kozawa

Inventor： Takahiro Shimoirisa ,  Atsumi Kawata ,  Fusaaki Kozawa

IPC: H02B1/00

CPC classification number: H05K1/14 ,  H05K7/1408 ,  H05K9/0062 ,  H05K2201/044 ,  H05K2201/2018

Abstract: The present invention is provided a structure for mounting a printed board in which each connector that is attached to each of a plurality of sub printed boards, which are juxtaposed to one another with respect to a main printed board secured to a metal backboard, is inserted into each of a plurality of connectors that are juxtaposed to one another on the main printed board so that the sub printed boards are mounted on the main printed board by the connector connections. Parts of both ends of an area in proximity to a semiconductor-device mounted area on each of the sub printed boards ate pinched between a first metal frame and a second metal frame so that each of the sub printed boards are secured.

Abstract translation: 本发明提供了一种用于安装印刷电路板的结构，其中插入相对于固定到金属背板的主印刷板彼此并列的多个次印刷电路板中的每一个附接的每个连接器被插入 在主印刷电路板上彼此并置的多个连接器中的每一个连接器中，通过连接器连接将副印刷电路板安装在主印刷电路板上。 在每个副印刷电路板上靠近半导体器件安装区域的区域的两端的部分被夹在第一金属框架和第二金属框架之间，使得每个副印刷电路板被固定。

公开(公告)号：US20070279846A1

公开(公告)日：2007-12-06

申请号：US11757716

申请日：2007-06-04

Applicant: Yen-Po Yu

Inventor： Yen-Po Yu

IPC: H05K5/00

CPC classification number: H05K1/18 ,  H05K1/0266 ,  H05K1/0269 ,  H05K2201/044 ,  H05K2201/09936 ,  H05K2201/10106 ,  H05K2201/10189

Abstract: A motherboard including a circuit board, a connecting device and an illumination device is provided. The connecting device and the illumination device are disposed on the circuit board, The illumination device includes at least one lighting element. The lighting element and the connecting device are disposed on the same side of the circuit board.

Abstract translation: 提供了包括电路板，连接装置和照明装置的主板。 连接装置和照明装置设置在电路板上。照明装置包括至少一个照明元件。 照明元件和连接装置设置在电路板的同一侧。

公开(公告)号：US20070139063A1

公开(公告)日：2007-06-21

申请号：US11313333

申请日：2005-12-21

Applicant: Xingjian Cai ,  Xiao-Ming Gao ,  Qing-Iun Chen

Inventor： Xingjian Cai ,  Xiao-Ming Gao ,  Qing-Iun Chen

IPC: G01R31/02

CPC classification number: H05K7/1458 ,  H05K1/0215 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/025 ,  H05K1/14 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/0792 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10196

Abstract: An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels; a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel; and an impedance matching terminal electrically coupled to the stub and to a ground. A process comprising providing a printed circuit board including a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels, and a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel and being designed to receive a signal from a component attached to the printed circuit board; and coupling an impedance matching terminal to the stub and to a ground.

Abstract translation: 一种装置，包括具有前侧和后侧的印刷电路板，并且其中具有多个导电层，每个导电层包括一个或多个信号通道; 从前侧延伸到后侧的短截线，短截线电耦合到至少一个信号通道; 以及电阻耦合到短截线和接地的阻抗匹配端子。 一种包括提供包括前侧和后侧的印刷电路板的工艺，其中包括多个导电层，每个导电层包括一个或多个信号通道，以及从前侧向后侧延伸的短截线 短截线被电耦合到至少一个信号通道并且被设计成从附接到印刷电路板的部件接收信号; 并将阻抗匹配端子耦合到短截线和接地。

公开(公告)号：US20070134968A1

公开(公告)日：2007-06-14

申请号：US11560763

申请日：2006-11-16

Applicant: Hyun-Jin CHOI ,  Young-Chan CHO

Inventor： Hyun-Jin CHOI ,  Young-Chan CHO

IPC: H01R13/62

CPC classification number: H05K7/1459 ,  G06F13/409 ,  G11C5/04 ,  G11C5/063 ,  H05K1/0296 ,  H05K2201/044 ,  H05K2201/09236

Abstract: Disclosed herein is a printed circuit board facilitating expansion of number of memory modules and memory system including the same. The printed circuit board of the present invention includes a plurality of slots and a plurality of controller terminals. Each of slots disposed in locations ranging from a 2n−1+1th location to a 2nth location with respect to the controller terminals includes 2k−n module terminals connected to the module terminals of slots ranging from the slot disposed in the first location to a slot disposed in a 2n−1th location. In the printed circuit board and memory system including the printed circuit board according to the present invention, dummy modules are not required to expand the number of memory modules. Further, according to the printed circuit board of the present invention, the expansion of the number of memory modules is facilitated.

Abstract translation: 这里公开了一种便于扩展存储器模块数量和包括其的存储器系统的印刷电路板。 本发明的印刷电路板包括多个槽和多个控制器端子。 设置在相对于控制器端子的从2n-1 + 1位置到第2n位置的位置中的每个槽包括连接到从设置在第一位置的槽到槽的槽的模块端子的2k-n模块端子 放置在第2n位。 在包括根据本发明的印刷电路板的印刷电路板和存储器系统中，不需要虚拟模块来扩展存储器模块的数量。 此外，根据本发明的印刷电路板，容易扩大存储器模块的数量。