公开(公告)号：US06661674B2

公开(公告)日：2003-12-09

申请号：US09915682

申请日：2001-07-26

Applicant: Johannes Franciscus Adrianus Reniers

Inventor： Johannes Franciscus Adrianus Reniers

IPC: H05K114

CPC classification number: H05K3/366 ,  H01R12/52 ,  H05K2201/048 ,  H05K2201/09172

Abstract: In a system having two printed circuit boards, each printed circuit board is provided with at least one electrical contact element for electrically interconnecting the printed circuit boards. One of the electrical contact elements includes at least one electroconductive pin formed from one of the printed circuit boards, while the other electrical contact element is formed by at least one recess in the other printed circuit board, a wall of the recess being covered with an electrically conducting layer.

Abstract translation: 在具有两个印刷电路板的系统中，每个印刷电路板设置有用于电连接印刷电路板的至少一个电接触元件。 电接触元件中的一个包括由一个印刷电路板形成的至少一个导电针，而另一个电接触元件由另一个印刷电路板中的至少一个凹部形成，凹部的壁被覆盖有 导电层。

公开(公告)号：US20030067060A1

公开(公告)日：2003-04-10

申请号：US10299504

申请日：2002-11-18

Inventor： David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

IPC: H01L023/495

CPC classification number: H05K1/141 ,  H01L23/5385 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/19041 ,  H05K1/147 ,  H05K3/305 ,  H05K3/4084 ,  H05K2201/048 ,  H05K2203/049 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49204 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A routing element for use with a multichip module. The routing element includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a multichip module substrate. The conductive traces may be carried upon a single surface of the routing element substrate, internally by the routing element substrate, or include externally and internally carried portions. The routing element also includes a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.

Abstract translation: 用于多芯片模块的路由元件。 路由元件包括承载导电迹线的衬底，该衬底提供比由多芯片模块衬底提供的电路更多的电路径或更短的电路径。 导电迹线可以在路由元件衬底的单个表面上承载，在内部由路由元件衬底承载，或者包括外部和内部承载的部分。 路由元件还包括位于其每个导电迹线的每一端处的接触焊盘，以便于将每个导电迹线电连接到衬底的对应端子或多芯片模块的半导体器件的对应接合焊盘。 还公开了多芯片模块，以及用于设计路由元件的方法和使用路由元件的方法。

公开(公告)号：US06496384B1

公开(公告)日：2002-12-17

申请号：US09957782

申请日：2001-09-21

Applicant: Jorge Morales ,  Cesar Avitia

Inventor： Jorge Morales ,  Cesar Avitia

IPC: H05K336

CPC classification number: H05K3/366 ,  H05K3/403 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09645 ,  H05K2203/0455 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A circuit board assembly and method of fabricating an assembly are provided. The assembly preferably comprises a first circuit board defining an aperture and a second circuit board having an edge. The first circuit board has at least one conductive feature proximate the aperture, and the second circuit board has at least one conductive feature proximate the edge. Each board has at least one circuit trace in electrical communication with its respective conductive feature. The conductive features of the boards are placed in electrical communication with each other by way of the edge of the second board being disposed in the aperture of the first board. A solder joint can be disposed on the assembly so as to connect the first and second boards.

Abstract translation: 提供一种制造组件的电路板组件和方法。 组件优选地包括限定孔的第一电路板和具有边缘的第二电路板。 第一电路板具有邻近孔的至少一个导电特征，并且第二电路板具有邻近边缘的至少一个导电特征。 每个电路板具有与其各自的导电特征电连通的至少一个电路迹线。 板的导电特征通过设置在第一板的孔中的第二板的边缘彼此电连通。 可以在组件上设置焊接接头，以便连接第一和第二板。

公开(公告)号：US06429547B1

公开(公告)日：2002-08-06

申请号：US09456529

申请日：1999-12-08

Applicant: Hiroaki Muroi ,  Kazuo Yanagida ,  Masanori Matsuda

Inventor： Hiroaki Muroi ,  Kazuo Yanagida ,  Masanori Matsuda

IPC: H02J900

CPC classification number: H05K1/141 ,  G04G15/00 ,  H01M2/1055 ,  H01M2/1066 ,  H01M2/20 ,  H05K3/0052 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10136 ,  Y10T307/625 ,  Y10T307/872

Abstract: A time switch includes a circuit board equipped with a time switch circuit operated by a commercial power source, a battery board to which a back-up battery for supplying a back-up power to the circuit board in case of an interruption of a power supply from the commercial power source is mounted, and a casing in which the circuit board and the battery board are mounted. The battery board is a member separated from the circuit board, or integrally formed with the circuit board by way of an easy-to-break portion having a relatively weak mechanical strength. Thus, the battery board can be detached from the circuit board so that the back-up battery is disposed apart from the circuit board.

Abstract translation: 时间开关包括配备有由商用电源操作的时间切换电路的电路板，电池板，在电源中断的情况下，备用电池用于向电路板提供备用电力 安装有商用电源的壳体和安装有电路基板和电池基板的壳体。 电池板是与电路板分离的构件，或者通过具有较弱机械强度的容易断裂部分与电路板一体形成。 因此，可以将电池板与电路板分离，使备用电池与电路板分开。

公开(公告)号：US5629839A

公开(公告)日：1997-05-13

申请号：US527315

申请日：1995-09-12

Applicant: Gerard A. Woychik

Inventor： Gerard A. Woychik

IPC: H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K1/11 ,  H01R9/09

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K3/3442 ,  H05K3/403

Abstract: A mounting for a solderable component module (SCM.TM.) interconnect includes an elongated trench or blind via for receiving an edge of the module. The interconnect may be adjusted to reduce the parasitic inductance associated with the connection of the SCM interconnect and the motherboard. Preferably, the design of the finger connectors associated with the SCM interconnect or other board module can be adjusted to reduce parasitic inductance. Alternatively, the capacitance associated with the SCM interconnect or motherboard may be adjusted. The SCM interconnect preferably includes finger connectors which have a rectangular shape. The finger connectors preferably have a shape wherein the length is greater than the width and have an enhanced thickness which reduces parasitic inductance. The finger connectors are spaced close together.

Abstract translation: 用于可焊接部件模块（SCM TM）互连的安装件包括用于接收模块边缘的细长沟槽或盲孔。 可以调整互连以减少与SCM互连和主板的连接相关联的寄生电感。 优选地，可以调节与SCM互连或其他板模块相关联的手指连接器的设计以减少寄生电感。 或者，可以调整与SCM互连或主板相关联的电容。 SCM互连优选地包括具有矩形形状的指状连接器。 手指连接器优选地具有其长度大于宽度并且具有增强的厚度的形状，其减小寄生电感。 手指连接器相互间隔开。

公开(公告)号：US5422764A

公开(公告)日：1995-06-06

申请号：US138292

申请日：1993-10-15

Applicant: Bill McIlvanie

Inventor： Bill McIlvanie

IPC: G11B21/02 ,  G11B5/48 ,  G11B21/00 ,  G11B33/12 ,  H05K3/36 ,  G11B5/012

CPC classification number: G11B33/122 ,  G11B21/00 ,  G11B5/4846 ,  H05K3/363 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K3/366

Abstract: A disk drive has an electrical interconnect for coupling one or more conductors provided on an actuator arm to a flexible connector. The interconnect consists of one or more tabs extending beyond a peripheral edge of the actuator arm and one or more slots formed on the flexible connector to receive the tabs. After the tabs are inserted into the corresponding slots, the tabs and flexible connector define L-shaped joints. Solder beads are deposited in these L-shaped joints to electrical couple the actuator arm to the flexible connector.

Abstract translation: 磁盘驱动器具有用于将设置在致动器臂上的一个或多个导体耦合到柔性连接器的电互连。 互连由一个或多个突片延伸超过致动器臂的周边边缘以及形成在柔性连接器上的一个或多个槽以接收突片。 在将突片插入到相应的槽中之后，突片和柔性连接器限定L形接头。 焊珠沉积在这些L形接头中，以将致动器臂电耦合到柔性连接器。

公开(公告)号：US2958013A

公开(公告)日：1960-10-25

申请号：US60591656

申请日：1956-08-20

Applicant: ARTHUR ANSLEY MFG CO

Inventor： ANSLEY ARTHUR C

IPC: H01R12/55 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K3/366 ,  H05K1/14 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

公开(公告)号：US20190254166A1

公开(公告)日：2019-08-15

申请号：US16261679

申请日：2019-01-30

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Pengkai JI ,  Jianhong ZENG ,  Yu ZHANG ,  Shouyu HONG ,  Jinping ZHOU ,  BAU-RU LU

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/142 ,  H02M3/07 ,  H02M3/158 ,  H02M3/33576 ,  H05K1/0216 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10545

Abstract: The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.

公开(公告)号：US20190252840A1

公开(公告)日：2019-08-15

申请号：US16394365

申请日：2019-04-25

Applicant: AMAZON TECHNOLOGIES, INC.

Inventor： James Siminoff ,  Mark Siminoff

IPC: H01R33/94 ,  H05K5/00 ,  H01R33/945 ,  H05K3/36 ,  H01R12/70 ,  H01R33/97 ,  H01R13/639 ,  H05K5/02 ,  H05K1/14 ,  H01R31/06 ,  H01R13/622

CPC classification number: H01R33/94 ,  H01R12/707 ,  H01R12/7088 ,  H01R12/714 ,  H01R13/622 ,  H01R13/6397 ,  H01R13/748 ,  H01R31/065 ,  H01R33/72 ,  H01R33/9456 ,  H01R33/971 ,  H05K1/144 ,  H05K3/368 ,  H05K5/0052 ,  H05K5/0069 ,  H05K5/0073 ,  H05K5/0247 ,  H05K5/069 ,  H05K2201/041 ,  H05K2201/048 ,  H05K2201/10318 ,  H05K2201/10356 ,  H05K2201/2018

Abstract: A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.

公开(公告)号：US20190103692A1

公开(公告)日：2019-04-04

申请号：US15945775

申请日：2018-04-05

Applicant: TE CONNECTIVITY CORPORATION

Inventor： John Joseph Consoli ,  Chad William Morgan ,  Matthew Jeffrey Sypolt

IPC: H01R12/73 ,  H01R13/6582 ,  H01R13/6585 ,  H01R13/6477 ,  H05K1/14 ,  H01R13/631 ,  H01R13/40 ,  H01R13/502 ,  H01R13/56 ,  H05K7/14

CPC classification number: H01R12/737 ,  H01R12/91 ,  H01R13/40 ,  H01R13/502 ,  H01R13/562 ,  H01R13/631 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/6582 ,  H01R13/6585 ,  H01R13/6587 ,  H05K1/14 ,  H05K7/1417 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/10325

Abstract: An electrical connector for a circuit card assembly including a PCB includes a mating housing having a mating end movable relative to the PCB and contact modules coupled to the mating housing including signal contacts having a mating conductor, a mounting conductor and a flexible conductor. The flexible conductor is flexible to allow relative movement of the mating conductor relative to the mounting conductor. The flexible conductor has a bent portion changing shape. The contact modules have ground contacts providing electrical shielding for the signal contacts. The ground contacts include covers extending along and providing shielding along at least one side of the bent portion of the corresponding signal contact.