公开(公告)号：US20130230755A1

公开(公告)日：2013-09-05

申请号：US13410857

申请日：2012-03-02

Applicant: Gary Dimmock

Inventor： Gary Dimmock

IPC: H01M10/48 ,  H05K1/00

CPC classification number: H05K1/028 ,  H01M2/1016 ,  H01M2/1061 ,  H01M2/1077 ,  H01M2/202 ,  H01M2/22 ,  H01M2/266 ,  H01M10/486 ,  H05K1/118 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10151

Abstract: A flexible cable with a substrate divided into at least two sections is disclosed. The first section includes a first electrically conductive track and a first attach pad, while the section includes a second and third electrically conductive tracks, as well as a second attach pad. The first section is disposed on the second section to align the attach pads and connect the first electrically conductive track to the third electrically conductive track. The resulting flexible cable can be used with a low profile electrical device.

Abstract translation: 公开了一种具有分为至少两个部分的基板的柔性电缆。 第一部分包括第一导电轨道和第一附接垫，而该部分包括第二和第三导电轨道以及第二附接垫。 第一部分设置在第二部分上以对准附接垫并将第一导电轨道连接到第三导电轨道。 所得到的柔性电缆可以与低调的电气设备一起使用。

公开(公告)号：US08434223B2

公开(公告)日：2013-05-07

申请号：US13487435

申请日：2012-06-04

Applicant: Martin John McCaslin ,  Szu-Han Hu ,  Alex Enriquez Cayaban ,  Voon Yee Ho

Inventor： Martin John McCaslin ,  Szu-Han Hu ,  Alex Enriquez Cayaban ,  Voon Yee Ho

IPC: H01R43/00

CPC classification number: G11B25/043 ,  G11B33/1406 ,  G11B33/1426 ,  H01L23/367 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/056 ,  H05K2203/302 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T428/24273 ,  H01L2924/00

Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.

Abstract translation: 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。

公开(公告)号：US20130062631A1

公开(公告)日：2013-03-14

申请号：US13231915

申请日：2011-09-13

Applicant: CHIA-CHI LIU

Inventor： CHIA-CHI LIU

IPC: H01L33/52

CPC classification number: H01L33/52 ,  F21K9/232 ,  F21V3/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H05K1/0278 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/09036 ,  H05K2201/09063 ,  H01L2924/00

Abstract: A light emitting module includes a carrier unit, a substrate unit, and a light emitting unit. The carrier unit includes at least one carrier body, and the carrier body has a mounting portion. The substrate unit includes at least one bendable substrate. The bendable substrate includes a plurality of substrate portions and a plurality of bending portions, the substrate portions are disposed on the mounting portion of the carrier body, and each bending portion is disposed between every two corresponding substrate portions. The light emitting unit includes a plurality of light emitting groups respectively disposed on the substrate portions, and each light emitting group includes at least one light emitting element electrically connected to each corresponding substrate portion. Because the substrate portions can be disposed on different planes after bending the substrate portions, thus light sources respectively generated by the light emitting elements can be projected toward different directions.

Abstract translation: 发光模块包括载体单元，基板单元和发光单元。 载体单元包括至少一个载体主体，载体主体具有安装部分。 衬底单元包括至少一个可弯曲的衬底。 可弯曲基板包括多个基板部分和多个弯曲部分，基板部分设置在载体主体的安装部分上，并且每个弯曲部分设置在每两个对应的基板部分之间。 发光单元包括分别设置在基板部分上的多个发光组，并且每个发光组包括电连接到每个对应的基板部分的至少一个发光元件。 因为基板部分可以在弯曲基板部分之后设置在不同的平面上，因此由发光元件分别产生的光源可以向不同的方向投影。

公开(公告)号：US08345431B2

公开(公告)日：2013-01-01

申请号：US12317754

申请日：2008-12-29

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.

公开(公告)号：US08236616B2

公开(公告)日：2012-08-07

申请号：US13020410

申请日：2011-02-03

Applicant: Takao Yamazaki

Inventor： Takao Yamazaki

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/5387 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/92225 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00015 ,  H01L2224/0401

Abstract: There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package.

Abstract translation: 提供了一种廉价的半导体器件，可以堆叠商业和质量保证（检查）的芯片尺寸封装，并且具有小的共平面度值和高安装可靠性。 一种半导体器件，其中柔性电路基板粘附到半导体封装的横向侧的至少一部分，并且位于半导体封装的焊球侧的柔性电路基板在内部的区域内折叠 的半导体封装的边缘。

公开(公告)号：US08213125B2

公开(公告)日：2012-07-03

申请号：US13214120

申请日：2011-08-19

Applicant: Martin John McCaslin ,  Szu-Han Hu ,  Alex Enriquez Cayaban ,  Voon Yee Ho

Inventor： Martin John McCaslin ,  Szu-Han Hu ,  Alex Enriquez Cayaban ,  Voon Yee Ho

IPC: G11B5/55

CPC classification number: G11B25/043 ,  G11B33/1406 ,  G11B33/1426 ,  H01L23/367 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/056 ,  H05K2203/302 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T428/24273 ,  H01L2924/00

Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.

Abstract translation: 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。

公开(公告)号：US08154884B2

公开(公告)日：2012-04-10

申请号：US12423078

申请日：2009-04-14

Applicant: Chung-Chuan Lin

Inventor： Chung-Chuan Lin

IPC: H05K9/00

CPC classification number: H05K1/0215 ,  H05K1/0224 ,  H05K1/0259 ,  H05K1/0393 ,  H05K3/4084 ,  H05K2201/056 ,  H05K2201/09354 ,  H05K2201/09681 ,  Y10T29/5313

Abstract: An electronic device includes a circuit board and an electrostatic protection structure. The circuit board has a top surface and a bottom surface opposite to the top surface. The electrostatic protection structure is positioned on the top surface of the circuit board. The electrostatic protection includes an insulating layer and a conducting layer coating on the insulating layer. Four ground terminals are formed on the bottom surface of the circuit board. The insulating layer includes a main portion and four first connecting portions extending from the main portion. The conducting layer on the four first connecting portion are connected to the four first ground terminal.

Abstract translation: 电子设备包括电路板和静电保护结构。 电路板具有与顶表面相对的顶表面和底表面。 静电保护结构位于电路板的顶表面上。 静电保护包括在绝缘层上的绝缘层和导电层涂层。 四个接地端子形成在电路板的底面上。 绝缘层包括主要部分和从主要部分延伸的四个第一连接部分。 四个第一连接部分上的导电层连接到四个第一接地端子。

公开(公告)号：US20120069584A1

公开(公告)日：2012-03-22

申请号：US13234642

申请日：2011-09-16

Applicant: Hideo Kawabe ,  Yoichi Toriumi ,  Kenichi Kabasawa ,  Tatsuya Suzuki ,  Hirokazu Imai ,  Masatoshi Ueno

Inventor： Hideo Kawabe ,  Yoichi Toriumi ,  Kenichi Kabasawa ,  Tatsuya Suzuki ,  Hirokazu Imai ,  Masatoshi Ueno

IPC: F21V21/00 ,  B32B37/00 ,  B32B38/00 ,  H05K1/02

CPC classification number: H05K1/189 ,  F21V19/003 ,  F21Y2103/33 ,  F21Y2115/10 ,  G02B21/084 ,  H05K3/0064 ,  H05K2201/056 ,  H05K2201/10106 ,  Y10T156/1043

Abstract: A flexible substrate includes a stripe-shaped substrate main body portion; a comb-like portion composed of a plurality of protrusions that extends from one end in the direction perpendicular to the longitudinal direction of the substrate main body portion, in the direction perpendicular to the longitudinal direction; and electronic devices that are arranged on the plurality of protrusions, respectively, in which the substrate main body portion and the comb-like portion are bendable.

Abstract translation: 柔性基板包括条形基板主体部分; 在与所述纵向方向垂直的方向上，从与所述基板主体部的长度方向垂直的方向的一端延伸的多个突起构成的梳状部， 以及分别布置在基板主体部分和梳状部分可弯曲的多个突起上的电子设备。

公开(公告)号：US20110317366A1

公开(公告)日：2011-12-29

申请号：US13170554

申请日：2011-06-28

Applicant: Keita FUKUTANI ,  Kuniaki Mamitsu

Inventor： Keita FUKUTANI ,  Kuniaki Mamitsu

IPC: H05K7/20 ,  H05K13/00

CPC classification number: H05K1/028 ,  H01L23/4012 ,  H01L23/473 ,  H01L23/5387 ,  H01L23/5389 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/0061 ,  H05K3/4632 ,  H05K7/20927 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/10166 ,  Y10T29/49002 ,  H01L2924/00

Abstract: In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

Abstract translation: 在电路板到冷却器的固定结构中，电路板包括布线部分，电连接到布线部分的电子部件和将布线部分和电子部件嵌入其中的绝缘基材。 绝缘基材包括其中嵌入电子部件的嵌入部分和在嵌入部分之间具有柔性的弯曲部分。 冷却器具有沿第一方向排列的固定部。 电路板在弯曲弯曲部分时固定在冷却器上。 弯曲部分与一个固定部分的端部相对，并且每个嵌入部分保持在相邻的两个固定部分之间，使得嵌入部分的相对表面与相邻的两个固定部分的表面紧密接触。

公开(公告)号：US08020281B2

公开(公告)日：2011-09-20

申请号：US12193734

申请日：2008-08-19

Applicant: Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

Inventor： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

IPC: H05K13/04

CPC classification number: H05K3/361 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2203/0278 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/5313 ,  Y10T29/53174

Abstract: The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.

Abstract translation: 本发明涉及一种用于将柔性印刷电路板（PCB）接合到打印头组件的接合装置。 打印头组件包括打印头托架和由托架承载的喷墨打印头。 接合装置包括支撑结构组件和布置在支撑结构组件上的第一加热器组件，以可沿着第一路径移动并且构造成将柔性PCB结合到打印头。 弯曲机构布置在支撑结构上，并被构造成弯曲粘合的PCB。 第二加热器组件布置在支撑结构组件上以可沿着第二路径移动并且被配置为将弯曲的PCB接合到打印头托架。 控制系统控制加热器组件和弯曲机构的操作。