公开(公告)号：US07663891B2

公开(公告)日：2010-02-16

申请号：US11431097

申请日：2006-05-10

Applicant: Hirokazu Tanaka ,  Hiroyuki Ishibashi

Inventor： Hirokazu Tanaka ,  Hiroyuki Ishibashi

IPC: H05K7/00

CPC classification number: H05K1/0203 ,  H05K1/0201 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/202 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09972 ,  H05K2201/2036 ,  H05K2203/1316

Abstract: In a lead frame board, while a heat radiation wall member formed by a resin having a relatively high thermal conductivity is provided in a low heat-resistance heat generating component mounting region where a low heat-resistance heat generating component is mounted, heat block wall members formed by resins having relatively low thermal conductivities are provided in a high heat-resistance heat generating component mounting region where a high heat-resistance heat generating component is mounted and in a non-heat generating component mounting region where a non-heat generating component is mounted. Thus, heat block is performed between the low heat-resistance heat generating component mounting region and the high heat-resistance heat generating component mounting region and non-heat generating component mounting region, and a heat radiation function is enhanced in the low heat-resistance heat generating component.

Abstract translation: 在引线框架板中，在安装有低耐热性发热部件的低耐热发热部件安装区域中设置由具有较高导热性的树脂形成的散热壁部件，但是热阻壁 在具有较高耐热发热部件的高耐热发热部件安装区域和非发热部件安装区域中设置具有较低热导率的树脂构成的部件， 被安装。 因此，在低耐热性发热部件安装区域和高耐热发热部件安装区域和非发热部件安装区域之间进行热阻，并且在低耐热性下提高散热功能 发热部件。

公开(公告)号：US20090305513A1

公开(公告)日：2009-12-10

申请号：US12455938

申请日：2009-06-08

Applicant: Boris Kobrin

Inventor： Boris Kobrin

IPC: H01L21/30 ,  B05D5/06 ,  B05D1/32

CPC classification number: H05K3/1258 ,  H05K3/1275 ,  H05K2201/09045 ,  H05K2203/0143 ,  H05K2203/0522 ,  H05K2203/0568 ,  H05K2203/1173

Abstract: Embodiments of the invention relate to a method of functional materials deposition using a polymer template fabricated on a substrate. Such template forms an exposed and masked areas of the substrate material, and can be fabricated using polymer resists or Self-assembled monolayers. Deposition is performed using an applicator, which is fabricated in the shape of cylinder or cone made of soft elastomeric materials or laminated with soft elastomeric film. Functional materials, for example, metals, semiconductors, sol-gels, colloids of particles are deposited on the surface of applicator using liquid immersion, soaking, contact with wetted surfaces, vapor deposition or other techniques. Then wetted applicator is contacted the surface of the polymer template and rolled over it's surface. During this dynamic contact functional material is transferred selectively to the areas of the template. Patterning of functional material is achieved by lift-off of polymeric template after deposition. According to another embodiment, where self-assembled monolayers are used as template, selective deposition of functional materials is achieved either due to low surface energy of SAM or reactivity of terminal groups.

Abstract translation: 本发明的实施方案涉及使用在基底上制造的聚合物模板进行功能材料沉积的方法。 这种模板形成基底材料的暴露和掩蔽的区域，并且可以使用聚合物抗蚀剂或自组装单层制造。 使用施用器进行沉积，该施加器被制造成由柔性弹性体材料制成的圆筒或圆锥体形状，或者与柔性弹性体膜层压。 功能材料，例如金属，半导体，溶胶凝胶，粒子的胶体沉积在施涂器的表面上，使用液浸，浸泡，接触湿润表面，气相沉积或其它技术。 然后湿润的涂抹器与聚合物模板的表面接触并在其表面上滚动。 在该动态接触期间，功能材料被选择性地转移到模板的区域。 功能材料的图案化是通过在沉积后剥离聚合物模板来实现的。 根据另一个实施方案，其中使用自组装单层作为模板，功能材料的选择性沉积由于SAM的低表面能或端基的反应性而实现。

公开(公告)号：US07605467B2

公开(公告)日：2009-10-20

申请号：US11530692

申请日：2006-09-11

Applicant: Yoshio Fujii ,  Hiroshi Fukumoto ,  Shinpei Ogawa ,  Yoshinori Yokoyama

Inventor： Yoshio Fujii ,  Hiroshi Fukumoto ,  Shinpei Ogawa ,  Yoshinori Yokoyama

IPC: H01L23/12

CPC classification number: H05K3/3436 ,  B81B7/007 ,  B81C2203/019 ,  H01L23/04 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0284 ,  H05K1/141 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10666 ,  H05K2203/1147 ,  Y02P70/613 ,  H01L2924/00

Abstract: An upper sealing ring and a lower sealing ring are adhered by sealing solder. The width of tip end of sealing projection is narrower than the width of the lower sealing ring. Therefore, the sealing solder is placed on lower sealing ring and on the side surface of upper sealing ring. Further, an upper connection pad and a lower connection pad are adhered by connecting solder. The width of a tip end of a connection projection is narrower than the width of lower connection pad. Therefore, the connecting solder is placed on the lower connection pad and on the side surface of upper connection pad. Thus, a package is provided, which attains satisfactory electrical connection and hermetic seal after solder joint of the upper and lower substrates.

Abstract translation: 通过密封焊料粘合上密封环和下密封环。 密封突起的前端的宽度比下密封圈的宽度窄。 因此，密封焊料放置在下密封环和上密封圈的侧表面上。 此外，通过连接焊料粘附上连接焊盘和下连接焊盘。 连接突起的前端的宽度比下连接焊盘的宽度窄。 因此，连接焊料被放置在下连接焊盘和上连接焊盘的侧表面上。 因此，提供了一种封装，其在上下基板的焊点之后获得令人满意的电连接和气密密封。

公开(公告)号：US20090227153A1

公开(公告)日：2009-09-10

申请号：US12409955

申请日：2009-03-24

Applicant: Victor ZADEREJ ,  David L. BRUNKER ,  Phillip J. DAMBACH

Inventor： Victor ZADEREJ ,  David L. BRUNKER ,  Phillip J. DAMBACH

IPC: H01R9/24

CPC classification number: H01R43/24 ,  H01P1/04 ,  H01P3/02 ,  H01R12/724 ,  H01R13/405 ,  H01R13/6461 ,  H01R13/6474 ,  H05K1/024 ,  H05K3/107 ,  H05K3/308 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10893 ,  Y10S439/931 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.

Abstract translation: 包含一个或多个分组的元件通道连杆传输线的基座连接器被看到具有电介质体和旨在接触相对的触点或迹线的两个相对的接触端。 电介质体具有S形构造，使得支撑在其上的传输线至少一个方向改变，从而允许使用这种连接器来互连在两个不同平面中的元件。 传输线包括在框架内延伸并且限定形成在电介质体上的相对的导电表面的槽，它们由中间的气隙隔开。

公开(公告)号：US20090223701A1

公开(公告)日：2009-09-10

申请号：US11994115

申请日：2006-05-11

Applicant: Yuichi Idomoto ,  Yasuhiro Okuda

Inventor： Yuichi Idomoto ,  Yasuhiro Okuda

IPC: H05K1/03 ,  B32B3/26 ,  B32B3/10 ,  B05D5/12 ,  B29C67/20

CPC classification number: H05K3/0014 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/42 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09045 ,  H05K2201/09845 ,  H05K2203/0108 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24504

Abstract: A porous resin substrate and a manufacturing method thereof. The substrate comprises a porous resin film having at least one functional part including electrodes or circuits, or both of them, and the porous resin film has a height-altered part, the height of which is different from the height of the functional part.

Abstract translation: 一种多孔树脂基板及其制造方法。 基板包括具有至少一个包括电极或电路的功能部件或两者的多孔树脂膜，并且多孔树脂膜具有高度改变部分，其高度不同于功能部件的高度。

公开(公告)号：US07554795B2

公开(公告)日：2009-06-30

申请号：US11597880

申请日：2005-06-03

Applicant: Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

Inventor： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

IPC: H01G9/15

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: An electronic component has an element, a pair of terminal portions which are disposed on the element, and an external covering material which covers a part of the terminal portions and the element. The electronic component is configured such that inclined portions are disposed on corner portions of a bottom surface and side surfaces of the external covering material, and the terminal portions are protruded from corner portions where the inclined portions and the bottom surface of the external covering material intersect.

Abstract translation: 电子部件具有元件，设置在元件上的一对端子部分和覆盖端子部分和元件的一部分的外部覆盖材料。 电子部件被构造成使得倾斜部分设置在外包覆材料的底表面和侧表面的角部上，并且端子部分从外部覆盖材料的倾斜部分和底表面相交的角部突出 。

公开(公告)号：US20090133909A1

公开(公告)日：2009-05-28

申请号：US12266795

申请日：2008-11-07

Applicant: Gary P. Blenkhorn

Inventor： Gary P. Blenkhorn

IPC: H05K1/02 ,  H05K3/12 ,  H01L21/336

CPC classification number: H05K3/1258 ,  H05K3/0023 ,  H05K3/1275 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/1545 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: Methods are disclosed for manufacturing electronic devices (e.g., transistors, and etc.), solar arrays, optical display arrays, portions of such devices and arrays, and the like. Utilizing a scrape coating and/or a tip printing process, various electronic and solar arrays are manufactured.

Abstract translation: 公开了用于制造电子器件（例如，晶体管等），太阳能阵列，光学显示阵列，这种器件和阵列的部分等的方法。 利用刮擦涂层和/或尖端印刷工艺，制造各种电子和太阳能阵列。

公开(公告)号：US20090086436A1

公开(公告)日：2009-04-02

申请号：US12293151

申请日：2007-03-22

Applicant: Claus Peter Kluge

Inventor： Claus Peter Kluge

IPC: H05K7/20

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21V29/71 ,  F21V29/713 ,  F21V29/75 ,  F21V29/763 ,  F21V29/86 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28F2215/10 ,  H01L23/15 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L25/162 ,  H01L33/642 ,  H01L33/648 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/09045 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: A carrier body for electrical or electronic component elements or circuits, the carrier body being electrically nonconductive or virtually nonconductive. In order to simplify the carrier body while at the same time providing extremely improved heat dissipation, the invention process that the carrier body is provided integrally with heat-dissipating or heat-supplying cooling elements.

Abstract translation: 用于电气或电子部件元件或电路的载体主体，该载体主体是非导电的或几乎不导电的。 为了简化承载体，同时提供极大改善的散热，本发明的方法是将载体主体与散热或供热的冷却元件一体地设置。

公开(公告)号：US20090051602A1

公开(公告)日：2009-02-26

申请号：US12185341

申请日：2008-08-04

Applicant: Dae Seong Jeon ,  Sang Woo Bae ,  Jae Suk Sung

Inventor： Dae Seong Jeon ,  Sang Woo Bae ,  Jae Suk Sung

IPC: H01R13/46 ,  H01Q1/38 ,  B05D5/12

CPC classification number: H05K9/0045 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/426 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09481 ,  H05K2201/0999

Abstract: There is provided a case structure having a conductive pattern and a method of manufacturing the same. A case structure having a conductive pattern according to an aspect of the invention includes a case having at least one via hole formed therein; at least conductive pattern formed on an outer surface of the case; and a conductive via formed within the via hole and electrically connecting the at least one conductive pattern to a board inside the case.

Abstract translation: 提供具有导电图案的壳体结构及其制造方法。 根据本发明的一个方面的具有导电图案的壳体结构包括：形成有至少一个通孔的壳体; 至少导电图案形成在外壳的外表面上; 以及形成在所述通孔内的导电通孔，并且将所述至少一个导电图案电连接到所述壳体内的板。

公开(公告)号：US20090042320A1

公开(公告)日：2009-02-12

申请号：US12193415

申请日：2008-08-18

Applicant: David Xuan-Qi Wang ,  Mehrdad M. Moslehi ,  Somnath Nag

Inventor： David Xuan-Qi Wang ,  Mehrdad M. Moslehi ,  Somnath Nag

IPC: H01L21/66

CPC classification number: B01D1/22 ,  H01L21/02617 ,  H01L21/6715 ,  H01L22/12 ,  H01L31/035281 ,  H01L31/046 ,  H01L31/1872 ,  H01L31/1892 ,  H01L31/202 ,  H05K1/0284 ,  H05K3/046 ,  H05K3/1258 ,  H05K3/207 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0126 ,  H05K2203/0528 ,  H05K2203/308 ,  Y02E10/50 ,  Y02P70/521

Abstract: Methods here disclosed provide for selectively coating the top surfaces or ridges of a 3-D substrate while avoiding liquid coating material wicking into micro cavities on 3-D substrates. The substrate includes holes formed in a three-dimensional substrate by forming a sacrificial layer on a template. The template includes a template substrate with posts and trenches between the posts. The steps include subsequently depositing a semiconductor layer and selectively etching the sacrificial layer. Then, the steps include releasing the semiconductor layer from the template and coating the 3-D substrate using a liquid transfer coating step for applying a liquid coating material to a surface of the 3-D substrate. The method may further include coating the 3-D substrate by selectively coating the top ridges or surfaces of the substrate. Additional features may include filling the micro cavities of the substrate with a filling material, removing the filling material to expose only the substrate surfaces to be coated, coating the substrate with a layer of liquid coating material, and removing said filling material from the micro cavities of the substrate.

Abstract translation: 这里公开的方法提供了选择性地涂覆3-D衬底的顶表面或脊，同时避免液体涂覆材料吸收到3-D衬底上的微腔中。 衬底包括通过在模板上形成牺牲层而形成在三维衬底中的孔。 模板包括具有在柱之间的柱和沟槽的模板衬底。 这些步骤包括随后沉积半导体层并选择性地蚀刻牺牲层。 然后，该步骤包括从模板中释放半导体层并使用用于将液体涂覆材料施加到3-D衬底的表面的液体转移涂覆步骤涂覆3-D衬底。 该方法还可以包括通过选择性地涂覆衬底的顶部脊或表面来涂覆3-D衬底。 附加特征可以包括用填充材料填充衬底的微腔，去除填充材料以仅暴露待涂覆的衬底表面，用一层液体涂覆材料涂覆衬底，以及从微孔中移除所述填充材料 的基底。