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    Electromagnetic bandgap structure and printed circuit board
    51.
    发明授权
    Electromagnetic bandgap structure and printed circuit board 失效
    电磁带隙结构和印刷电路板

    公开(公告)号：US08598468B2

    公开(公告)日：2013-12-03

    申请号：US13437254

    申请日：2012-04-02

    Applicant: Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

    Inventor： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

    IPC: H01R12/04 ,  H05K1/11

    CPC classification number: H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

    Abstract: An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.

    Abstract translation: 一种电磁带隙结构，包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板，其中所述第一缝合通孔将所述第一缝合通孔的一部分通过平面 表面在一个导电板的上方或下方，并且第二缝合通孔通过允许第二缝合通孔的一部分通过不同于平面的平面表面连接一个导电板到另一个导电板，通过该平面 第一缝合通孔的部分被连接，两个平面被放置在相同的方向上，基于导电板。

    Parts made of electrostructural composite material
    52.
    发明授权
    Parts made of electrostructural composite material 有权
    由电结构复合材料制成的零件

    公开(公告)号：US08581103B2

    公开(公告)日：2013-11-12

    申请号：US12746338

    申请日：2008-12-09

    Applicant: Jesus Aspas Puertolas

    Inventor： Jesus Aspas Puertolas

    IPC: H05K1/09 ,  B32B3/12 ,  E04C2/52

    CPC classification number: H05K3/103 ,  H05K1/142 ,  H05K3/281 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/09236 ,  H05K2201/09681 ,  H05K2201/10287

    Abstract: A ridge structural part made of laminated composite material incorporates electrically conducting cables, the structural part includes at least two structural layers including fibers held in place by a thermosetting or thermoplastic matrix, at least one conducting network layer located between two of the at least two structural layer, the at least one conducting network layer including a network of electrically conducting cables, said electrically conducting cables being arranged throughout said structural part in a substantially regular manner and being electrically insulated from said two structural layers by a dielectric material. The structural part also includes electrical connections, to which electrically conducting cables of the at least one network layer are electrically connected so as to form an electrical network by assembling several structural parts.

    Abstract translation: 由层压复合材料制成的脊结构部分包含导电电缆，结构部分包括至少两个结构层，包括通过热固性或热塑性基体保持在适当位置的纤维，至少一个导电网络层位于至少两个结构 所述至少一个导电网络层包括导电电缆网络，所述导电电缆以基本规则的方式布置在所述结构部分中，并且通过电介质材料与所述两个结构层电绝缘。 结构部分还包括电连接，至少一个网络层的导电电缆电连接到该电连接，以便通过组装若干结构部件形成电网。

    METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCING SCHEME FOR IMPROVED PERFORMANCE AND REDUCED COST
    54.
    发明申请
    METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCING SCHEME FOR IMPROVED PERFORMANCE AND REDUCED COST 有权
    用于制造具有改进性能和降低成本的混合参考方案的高速陶瓷模块的方法

    公开(公告)号：US20130252379A1

    公开(公告)日：2013-09-26

    申请号：US13621242

    申请日：2012-09-15

    Applicant: IBM Corporation

    Inventor： Wiren D Becker ,  Jinwoo Choi ,  Tingdong Zhou

    IPC: H01L21/768

    CPC classification number: H01L21/76838 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19051 ,  H01L2924/3011 ,  H05K1/0253 ,  H05K3/4629 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/10674 ,  H01L2924/00

    Abstract: A multi-layered ceramic package comprises: a signal layer with identified chip/device area(s) that require a supply of power; and a voltage power (Vdd) layer and a ground (Gnd) layer disposed on opposite sides directly above or below and adjacent to the signal layer and providing a first reference mesh plane and a second reference mesh plane configured utilizing a hybrid mesh scheme. The hybrid mesh scheme comprises: a full dense mesh in a first area directly above or below the identified chip/device area(s); a half dense mesh in a second area that is above or below the edge(s) of the chip/device area; and a wider mesh pitch in all other areas The Vdd traces are aligned to run parallel and adjacent to signal lines in those other areas. Wider traces are provided within the mesh areas that run parallel and adjacent to signal lines.

    Abstract translation: 多层陶瓷封装包括：具有需要供电的识别芯片/器件区域的信号层; 以及设置在信号层正上方或下方并相邻的相对侧上的电压功率（Vdd）层和接地（Gnd）层，并提供使用混合网格方案配置的第一参考网格平面和第二参考网格平面。 混合网格方案包括：在识别的芯片/设备区域的正上方或下方的第一区域中的全密度网格; 在芯片/设备区域的边缘的上方或下方的第二区域中的半密度网格; 和所有其他区域中的较宽的网格间距Vdd迹线对齐以与其他区域的信号线平行并相邻。 在与信号线平行且相邻的网格区域内提供更宽的轨迹。

    Printed wiring board
    55.
    发明授权
    Printed wiring board 有权
    印刷电路板

    公开(公告)号：US08541692B2

    公开(公告)日：2013-09-24

    申请号：US12432122

    申请日：2009-04-29

    Applicant: Shigeo Nara

    Inventor： Shigeo Nara

    IPC: H05K1/11 ,  H05K1/03

    CPC classification number: H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09681

    Abstract: There is provided a printed wiring board, including: plural first conductive patterns arranged adjacently in a first direction and separated by first gaps; plural conductive pattern rows comprising the plural first conductive patterns, adjacent conductive pattern rows being offset from each other in the first direction by a second gap; a conductive pattern group comprising the plural conductive pattern rows arranged adjacently in a second direction that intersects the first direction and separated by third gaps; plural second conductive patterns that are smaller than the first conductive patterns and that connect, in the first direction, each of the plural first conductive patterns to first conductive patterns adjacent thereto in the first direction; and plural third conductive patterns that are smaller than the first conductive patterns, and that connect, in the second direction, each of the plural first conductive patterns to first conductive patterns adjacent thereto in the second direction.

    Abstract translation: 提供一种印刷电路板，包括：多个第一导电图案，其在第一方向上相邻排列并且由第一间隙分开; 多个导电图案行，包括多个第一导电图案，相邻导电图案行在第一方向上彼此偏移第二间隙; 导电图案组，包括在与第一方向相交并与第三间隙分隔的第二方向上相邻布置的多个导电图案行; 多个第二导电图案，其小于第一导电图案，并且在第一方向上将多个第一导电图案中的每一个连接到在第一方向上与其相邻的第一导电图案; 以及多个第三导电图案，其小于第一导电图案，并且在第二方向上将多个第一导电图案中的每一个连接到与第二导电图案相邻的第一导电图案。

    Multilayer flexible printed circuit board and electronic device
    57.
    发明授权
    Multilayer flexible printed circuit board and electronic device 有权
    多层柔性印刷电路板和电子设备

    公开(公告)号：US08476532B2

    公开(公告)日：2013-07-02

    申请号：US13272877

    申请日：2011-10-13

    Applicant: Naofumi Kitano ,  Tetsuya Esaki

    Inventor： Naofumi Kitano ,  Tetsuya Esaki

    IPC: H05K1/00

    CPC classification number: H05K1/0215 ,  H05K1/0224 ,  H05K1/147 ,  H05K2201/0397 ,  H05K2201/09681

    Abstract: A multilayer flexible printed circuit board disclosed in the present application is a multilayer flexible printed circuit board in which a ground layer, an insulating layer and a signal wiring layer in which signal wiring is formed are laminated in sequence, with the multilayer flexible printed circuit board including a protruding portion protruding laterally, and a ground that is electrically connected to the ground layer being formed on at least one surface of the protruding portion, in order to have shielding properties that can cope with high speed signal transmission performed via the signal wiring layer.

    Abstract translation: 本申请中公开的多层柔性印刷电路板是多层柔性印刷电路板，其中依次层叠形成信号布线的接地层，绝缘层和信号布线层，多层柔性印刷电路板 包括横向突出的突出部分和在突出部分的至少一个表面上形成的与接地层电连接的接地，以便具有能够应付经由信号布线层执行的高速信号传输的屏蔽特性 。

    Flexible Flat Cable
    58.
    发明申请
    Flexible Flat Cable 审中-公开
    柔性扁平电缆

    公开(公告)号：US20130153283A1

    公开(公告)日：2013-06-20

    申请号：US13628317

    申请日：2012-09-27

    Applicant: Hosiden Corporation

    Inventor： Hayato Kondo

    IPC: H01B7/04

    CPC classification number: H01B7/04 ,  H05K1/0225 ,  H05K1/0253 ,  H05K1/118 ,  H05K2201/0715 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/2009

    Abstract: A plurality of linear conductors arranged in parallel with each other are covered from the upper and lower sides thereof by first and second insulator layers. On the upper side of the first insulator layer, a first adjustment material layer is formed with forming a predetermined gap relative to an end of the flat cable. And, at this gap, a reinforcement plate is provided. A shield member is provided for covering the upper side of the reinforcement plate and a portion of the upper side of the first adjustment material layer. From the upper side of the shield member to the upper side of the first adjustment material layer, a first shield layer is provided in such a manner to expose the upper side of the portion of the shield member where the reinforcement plate is present. A second insulator layer is configured to expose the conductors at the end of the flat cable. The shield member includes an impedance adjusting arrangement.

    Abstract translation: 由彼此平行布置的多个线状导体由其上侧和下侧由第一和第二绝缘体层覆盖。 在第一绝缘体层的上侧，形成有相对于扁平电缆的端部形成预定间隙的第一调整材料层。 并且，在该间隙，设置有加强板。 设置有用于覆盖加强板的上侧和第一调整材料层的上侧的一部分的屏蔽构件。 从屏蔽部件的上侧到第一调整材料层的上侧，设置第一屏蔽层，以露出屏蔽部件的存在加强板的部分的上侧。 第二绝缘体层被配置为在扁平电缆的端部露出导体。 屏蔽构件包括阻抗调节装置。

    CONDUCTIVE FILM
    59.
    发明申请
    CONDUCTIVE FILM 有权
    导电膜

    公开(公告)号：US20130126213A1

    公开(公告)日：2013-05-23

    申请号：US13741818

    申请日：2013-01-15

    Applicant: FUJIFILM CORPORATION

    Inventor： Toyomi MATSUDA ,  Makoto SUTOU ,  Tomonori BABA ,  Daisuke MITSUHASHI

    IPC: H01B5/00

    CPC classification number: H01B5/00 ,  G03F1/14 ,  H05K1/0393 ,  H05K3/0082 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/056 ,  H05K2203/1545 ,  Y10T428/24917 ,  Y10T428/24997

    Abstract: There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200 μm, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to ⅙ of the designed width.

    Abstract translation: 提供了图案曝光方法，导电膜制造方法和导电膜，其中感光材料通过设置有70至200μm的邻近间隙的光掩模进行接近曝光，从而暴露于掩模 沿输送方向周期性地形成导电膜。 导电膜具有第一导电薄金属线和第二导电薄金属线的多个导电部分和多个开口部。 每个细金属丝的一侧具有从表示薄金属线的设计宽度的虚拟线向开口部延伸的突起，突起的突出量为设计宽度的1/25至1/6。

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