公开(公告)号：US20150200434A1

公开(公告)日：2015-07-16

申请号：US14155906

申请日：2014-01-15

Applicant: Honeywell International Inc.

Inventor： Nan Wang ,  Chao Wang ,  Orville Nyhus

IPC: H01P3/08 ,  H05K3/36 ,  H02H1/04

CPC classification number: H01P5/028 ,  H01P1/047 ,  H01P1/30 ,  H01P3/085 ,  H01Q1/50 ,  H01Q21/0075 ,  H01Q21/08 ,  H02H1/04 ,  H05K1/142 ,  H05K3/36 ,  H05K2201/09181 ,  H05K2201/09845 ,  Y10T29/49126

Abstract: An anti-lightning-combined-stripline-circuit system is provided. The anti-lightning-combined-stripline-circuit system includes a stripline board including circuitry, and a metal ground bar attached to the stripline board. The metal ground bar has a geometry configured to function as a ground for the circuitry and simultaneously function as a lightning ground for a linear array of elements driven by the circuitry.

Abstract translation: 提供防雷击组合线路电路系统。 防雷击组合线路电路系统包括带状线板，其包括电路和连接到带状线板的金属接地棒。 金属接地棒具有配置为用作电路的接地的几何形状，并且同时用作由电路驱动的元件的线性阵列的雷电接地。

公开(公告)号：US20150181702A1

公开(公告)日：2015-06-25

申请号：US14640458

申请日：2015-03-06

Applicant: Eastman Kodak Company

Inventor： Ronald Steven Cok ,  David Paul Trauernicht

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H05K1/097 ,  H05K3/1258 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/09736 ,  H05K2201/09845

Abstract: A connection-pad structure includes a substrate and a An electrical conductor including a plurality of micro-wires form an electrically continuous connection pad on or in the substrate. An electrical connector is electrically connected to the electrical conductor.

Abstract translation: 连接焊盘结构包括基板和包括多根微导线的电导体在基板上或基板中形成电连续的连接焊盘。 电连接器电连接到电导体。

公开(公告)号：US09063307B2

公开(公告)日：2015-06-23

申请号：US13991742

申请日：2011-12-07

Applicant: Gnitaboure Yabre ,  Yves Stricot

Inventor： Gnitaboure Yabre ,  Yves Stricot

IPC: G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H05K1/14 ,  H05K3/30

CPC classification number: G02B6/4269 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/428 ,  H05K1/021 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/183 ,  H05K3/306 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2201/10416 ,  H05K2201/10674 ,  Y10T29/49139

Abstract: Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.

Abstract translation: 印刷电路板组件，其包括具有用于承载至少一个光电子部件的承载面的光学子组件，使得从其发射/发射的光通过光学子组件传输; 印刷电路板，具有用于支撑所述光学子组件的支撑区域; 其中所述印刷电路板支撑区域包括覆盖所述光电子部件的至少一部分的孔，并且其中所述承载面的至少一部分通过倒装芯片接合固定到所述支撑区域的至少一部分。

公开(公告)号：US20150173181A1

公开(公告)日：2015-06-18

申请号：US14107069

申请日：2013-12-16

Applicant: Cisco Technology, Inc.

Inventor： Dewen Xu ,  Jingping Wang ,  Jianqun Fu ,  Jiang Wang ,  Jing An

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/325 ,  H05K3/308 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10878 ,  Y10T29/49153

Abstract: An apparatus may be provided. The apparatus may comprise a circuit board and a bore. The circuit board may have a component side surface and a bottom side surface. The bore may be disposed in the circuit board. The bore may extent from the component side surface to the bottom side surface. The bore may comprise a first portion and a second portion. The first portion may have a first diameter. The second portion may be disposed between the first portion and the component side surface. The second portion may have a second diameter greater than the first diameter.

Abstract translation: 可以提供一种装置。 该装置可以包括电路板和孔。 电路板可以具有部件侧表面和底侧表面。 孔可以设置在电路板中。 孔可以从部件侧表面到底侧表面。 孔可以包括第一部分和第二部分。 第一部分可以具有第一直径。 第二部分可以设置在第一部分和部件侧表面之间。 第二部分可以具有大于第一直径的第二直径。

公开(公告)号：US09054460B2

公开(公告)日：2015-06-09

申请号：US13762433

申请日：2013-02-08

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott L. Michaelis

IPC: H01R24/00 ,  H01R13/658 ,  H01R43/20 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/66 ,  H01R24/64 ,  H05K1/11 ,  H01R12/53 ,  H01R24/28 ,  H05K1/02

CPC classification number: H01R13/658 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R43/205 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。

公开(公告)号：US20150146386A1

公开(公告)日：2015-05-28

申请号：US14298792

申请日：2014-06-06

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jun Namkung ,  Soonryong Park ,  Chulwoo Jeong

IPC: H05K1/02

CPC classification number: H05K1/028 ,  G02F1/133305 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02E10/549

Abstract: A flexible display device including a flexible display panel including a folding area and a peripheral area, and a first outer member including a groove pattern is disclosed. The groove pattern includes a flat surface and inclined portions connected to the flat surface and symmetrical with each other about the flat surface.

Abstract translation: 公开了一种柔性显示装置，包括包括折叠区域和周边区域的柔性显示面板和包括凹槽图案的第一外部构件。 凹槽图案包括平坦表面和连接到平坦表面并且相对于平坦表面彼此对称的倾斜部分。

公开(公告)号：US09018539B2

公开(公告)日：2015-04-28

申请号：US13487909

申请日：2012-06-04

Applicant: Han Ul Lee

Inventor： Han Ul Lee

IPC: H05K1/11 ,  H05K3/36 ,  H05K3/00

CPC classification number: H05K1/115 ,  H05K3/0035 ,  H05K2201/09845 ,  H05K2203/1476 ,  Y10T29/49126

Abstract: The present invention relates to a printed circuit board including: a first circuit pattern formed on a first insulator; a second insulator formed on the first insulator; a second circuit pattern having a pad of which a portion is embedded in the second insulator and a via which penetrates the second insulator to electrically connect the first circuit pattern and the pad; and a third circuit pattern formed on the second insulator, and it is possible to reduce a size of the via without increasing an aspect ratio.

Abstract translation: 印刷电路板技术领域本发明涉及一种印刷电路板，包括：形成在第一绝缘体上的第一电路图案; 形成在第一绝缘体上的第二绝缘体; 第二电路图案，其具有嵌入第二绝缘体中的一部分的焊盘和穿过第二绝缘体以使第一电路图案和焊盘电连接的通孔; 以及形成在第二绝缘体上的第三电路图案，并且可以减小通孔的尺寸而不增加纵横比。

公开(公告)号：US09018094B2

公开(公告)日：2015-04-28

申请号：US13042186

申请日：2011-03-07

Applicant: Valentin Kosenko ,  Sergey Savastiouk

Inventor： Valentin Kosenko ,  Sergey Savastiouk

IPC: H01L21/44 ,  H01L21/768 ,  H01L23/48 ,  H05K3/42 ,  H01L23/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49827 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49822 ,  H01L24/05 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/0195 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A through via (144) contains a conductor (244, 276) passing through a substrate (140) for connection to an integrated circuit element. The through via consists of two segments (144.1, 144.2) formed from respective different sides (140.1, 140.2) of the substrate and meeting inside the substrate. Each segment is shorter than the entire via, so via formation is facilitated. The second segment is etched after deposition of an etch stop layer (214) into the first segment. Due to the etch stop layer, the first segment's depth does not have to be rigidly controlled. The conductor is formed by separate depositions of conductive material into the via from each side of the substrate. From each side, the conductor is deposited to a shallower depth than the via depth, so the deposition is facilitated. Other embodiments are also provided.

Abstract translation: 通孔（144）包含通过用于连接到集成电路元件的衬底（140）的导体（244,276）。 通孔包括由衬底的各个不同侧面（140.1,140.2）形成的两个段（144.1,144.2），并且在衬底内部会合。 每个段都比整个通孔短，因此通过形成便利。 在将蚀刻停止层（214）沉积到第一段中之后蚀刻第二段。 由于蚀刻停止层，第一段的深度不必严格控制。 导体由导电材料从衬底的每一侧分离成通孔而形成。 从每一侧，导体被沉积到比通孔深度更浅的深度，因此便于沉积。 还提供了其他实施例。

公开(公告)号：US20150068789A1

公开(公告)日：2015-03-12

申请号：US14023740

申请日：2013-09-11

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: H05K1/11

CPC classification number: H05K1/117 ,  G06F3/044 ,  H05K1/092 ,  H05K3/1258 ,  H05K3/4611 ,  H05K2201/0919 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2201/09845

Abstract: A multi-layer micro-wire structure includes a substrate having a substrate edge. A first layer is formed over the substrate extending to a first layer edge. One or more first micro-channels are imprinted in the first layer, at least one imprinted first micro-channel having a micro-wire forming at least a portion of an exposed first connection pad in the first layer. A second layer is formed over the first layer extending to a second layer edge. One or more second micro-channels are imprinted in the second layer, at least one imprinted second micro-channel having a micro-wire forming at least a portion of an exposed second connection pad in the second layer. The second-layer edge is farther from the substrate edge than the first-layer edge for at least a portion of the second-layer edge so that the first connection pads are exposed through the second layer.

Abstract translation: 多层微线结构包括具有基板边缘的基板。 第一层形成在延伸到第一层边缘的衬底上。 一个或多个第一微通道被印在第一层中，至少一个压印的第一微通道具有在第一层中形成暴露的第一连接焊盘的至少一部分的微线。 在延伸到第二层边缘的第一层上形成第二层。 一个或多个第二微通道被印在第二层中，至少一个压印的第二微通道具有在第二层中形成暴露的第二连接焊盘的至少一部分的微线。 对于第二层边缘的至少一部分，第二层边缘比第一层边缘离基板边缘更远，使得第一连接焊盘通过第二层曝光。

公开(公告)号：US20150068032A1

公开(公告)日：2015-03-12

申请号：US14023757

申请日：2013-09-11

Applicant: Ronald Steven Cok

Inventor： Ronald Steven Cok

IPC: H05K3/46

CPC classification number: G06F3/047 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01L29/413 ,  H01L33/42 ,  H01L51/5215 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/117 ,  H05K3/465 ,  H05K3/4664 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09845 ,  Y10T29/49155

Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate having a substrate edge and first and second layers formed over the substrate. One or more micro-channels are imprinted in each of the first and second layers and first and second micro-wires located in the imprinted micro-channels, the micro-wires forming at least a portion of an exposed connection pad in each layer. The second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer.

Abstract translation: 制造多层微线结构的方法包括提供具有衬底边缘的衬底和形成在衬底上的第一和第二层。 一个或多个微通道被印刷在第一和第二层中的每一个以及位于压印的微通道中的第一和第二微细线中，微线形成每个层中暴露的连接焊盘的至少一部分。 对于第二层边缘的至少一部分，第二层边缘比距第一层边缘更远离基板边缘，使得第一连接焊盘通过第二层曝光。