公开(公告)号：US20030155656A1

公开(公告)日：2003-08-21

申请号：US10346288

申请日：2003-01-17

Inventor： Cindy Chia-Wen Chiu ,  David Hsein-Pin Chen ,  Philip Yi Zhi Chu ,  Hsiao Ken Chuang ,  H. Paul Barker

IPC: H01L023/48

CPC classification number: H01L23/49827 ,  H01L2224/11334 ,  H01L2224/16237 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2201/10378

Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.

Abstract translation: 用于提供电子部件之间的电互连的各向异性导电结构以及制造这种各向异性导电结构的方法。 各向异性导电结构包括具有基本上均匀厚度的介电矩阵; 穿过矩阵的通孔阵列; 多个导电元件，其中单个通孔包含至少一个导电元件; 粘附到基质的第一主表面上的第一粘合剂层; 以及可选地，粘附到基质的第二主表面的第二粘合剂层。

公开(公告)号：US20030068877A1

公开(公告)日：2003-04-10

申请号：US10225907

申请日：2002-08-21

Inventor： Larry D. Kinsman

IPC: H01L021/44

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

公开(公告)号：US06270363B1

公开(公告)日：2001-08-07

申请号：US09315373

申请日：1999-05-18

Applicant: Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01R458

CPC classification number: H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/81101 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/0256 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0272 ,  H05K2201/0284 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A compressible interposer comprising an interposer sheet having a plurality of apertures filled with a dielectric material having a substantially uniform suspension of conductive particles therein forming a plurality of conductive sites. Preferably, the number of conductive sites on the interposer are greater in number than the number of contact pads on the electronic components such that precise alignment of the interposer between the electronic components is not required. The apertures of the interposer sheet confine the conductive particles within the dielectric material such that during compression of the interposer between the electronic components, z-axis conductive pathways are formed without shorting in the x and y directions. Preferably, the interposer sheet comprises polyimide. Preferably, the dielectric material comprises polyimide-siloxane. Preferably, the conductive particles have a diameter of about 2 to about 20 &mgr;m and comprise of a material selected from the group consisting of copper, gold, silver, nickel, palladium, platinum, and alloys thereof. The particles may also be coated with an additional conductive material such as solder having a lower melting temperature. Most preferably, the conductive particles comprise solder coated copper particles. The conductive particles are present in an amount of about 30 to about 90 wt. % of the total weight of the conductive particles and the dielectric material.

Abstract translation: 一种可压缩插入件，其包括插入片，所述插入片具有填充有形成多个导电部位的导电粒子的基本均匀悬浮液的电介质材料的多个孔。 优选地，内插器上的导电位置的数量大于电子部件上的接触焊盘的数量，使得不需要电子部件之间的插入器的精确对准。 插入片的孔径将导电粒子限制在电介质材料内，使得在电子部件之间的插入件压缩期间，在x和y方向上形成z轴传导路径而不会短路。 优选地，插入片包括聚酰亚胺。 优选地，电介质材料包括聚酰亚胺 - 硅氧烷。 优选地，导电颗粒的直径为约2至约20μm，并且包括选自铜，金，银，镍，钯，铂及其合金的材料。 颗粒也可以涂覆有另外的导电材料，例如具有较低熔融温度的焊料。 最优选地，导电颗粒包括焊料涂覆的铜颗粒。 导电颗粒的存在量为约30至约90wt。 导电颗粒和电介质材料的总重量的百分比。

公开(公告)号：US6042894A

公开(公告)日：2000-03-28

申请号：US890342

申请日：1997-07-09

Applicant: Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

Inventor： Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

IPC: C08J5/00 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H01R13/24 ,  H05K3/10 ,  H05K3/32 ,  C08J7/04 ,  B05D5/00 ,  B05D1/36

CPC classification number: H01R13/2414 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H05K3/102

Abstract: An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

Abstract translation: 通过将导电颗粒粘附到形成在支撑体上并固定在其中的粘着层并且填充与导电颗粒之间的粘合材料不相容的成膜树脂而产生的各向同性导电树脂薄膜材料仅通过该导电颗粒在膜厚度方向上具有导电性 导电颗粒在平面方向上均匀分散，并且适用于电连接多个电子部件的相对放置的电路和精细电极，并用于测试电子部件。

公开(公告)号：US5902438A

公开(公告)日：1999-05-11

申请号：US910280

申请日：1997-08-13

Applicant: Richard Arthur ,  Lyn Holt ,  David Baghurst ,  Gary Lee Nicholls

Inventor： Richard Arthur ,  Lyn Holt ,  David Baghurst ,  Gary Lee Nicholls

IPC: H01R43/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B31/18 ,  H01B1/20 ,  H01R1/00

CPC classification number: H05K3/4069 ,  H05K3/321 ,  H01R43/007 ,  H05K2201/09572 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0126 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1572 ,  H05K3/3436 ,  H05K3/3484 ,  Y10T156/1057

Abstract: A process for the preparation of an anisotropic conducting material including the steps of providing a strip or sheet of a non-conducting matrix and laminating at least one layer of a release material to each side thereof to form a composite matrix, forming an array of holes in a predetermined pattern in the composite matrix, passing the matrix through a coating head which simultaneously fills the holes in the array in the composite matrix from both sides of the matrix with a conducting material, curing or drying the composite filled matrix and removing at least one layer of release material from each side of the matrix.

Abstract translation: 一种用于制备各向异性导电材料的方法，包括以下步骤：提供非导电基质的条或片，并将至少一层释放材料层压到其每一侧以形成复合基质，形成孔阵列 在复合基质中以预定的图案，使基质通过涂层头，涂层头同时用导电材料从基体的两侧填充复合基体中的阵列中的孔，固化或干燥复合填充的基质并至少除去 从矩阵的每一侧的一层释放材料。

公开(公告)号：US5856636A

公开(公告)日：1999-01-05

申请号：US810356

申请日：1997-03-03

Applicant: David W. Sanso

Inventor： David W. Sanso

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K1/03

CPC classification number: H05K1/116 ,  H05K1/0266 ,  H05K1/0287 ,  H05K1/0298 ,  H05K2201/0133 ,  H05K2201/09381 ,  H05K2201/09781 ,  H05K2201/09945 ,  H05K2201/10303 ,  H05K2203/1189 ,  H05K3/429 ,  Y10T29/49126

Abstract: Electronic circuit prototype wiring board is fabricated with layers of electrically conductive material separated by layers of dielectric material. Contact pads of electrically conductive material are arrayed on a surface of the board. Columns of electrically conductive material extend upward from each of the conductive layers to selected contact pads, passing through perforations in any intermediate layers above, such that each of the pads is in electrical communication with only one of the conductive layers. All of the pads connected to a common conductive layer are of a similar geometric plan form which is associated with that layer and which is different and distinguishable from the plan form of pads in electrical communication with any other of the conductive layers. In an alternative embodiment, the wiring board is fabricated of an elastic dielectric material. Access points for each conductive layer of the board are identified by similar geometric shapes associated with that layer and which are different and distinguishable from shapes identifying access points for any other of the conductive layers. Pins fabricated of electrically conductive material are inserted into the elastic dielectric material to establish electrical contact with a desired conductive layer and be retained by the dielectric material to serve as a wiring post.

Abstract translation: 电子电路原型布线板由电介质材料层隔开的导电材料层制成。 导电材料的接触垫排列在板的表面上。 导电材料的列从每个导电层向上延伸到选定的接触焊盘，穿过上面任何中间层的穿孔，使得每个焊盘仅与一个导电层电连通。 连接到公共导电层的所有焊盘具有类似的几何平面形式，其与该层相关联，并且与与任何其它导电层电连通的焊盘的平面形式不同且可区分。 在替代实施例中，布线板由弹性介电材料制成。 板的每个导电层的接入点由与该层相关联的类似几何形状标识，并且与形成的任何其他导电层的识别不同的形状区分开来。 由导电材料制成的引脚插入到弹性电介质材料中以与期望的导电层建立电接触并被电介质材料保持以用作布线柱。

公开(公告)号：US5509815A

公开(公告)日：1996-04-23

申请号：US255687

申请日：1994-06-08

Applicant: Sungho Jin ,  Mark T. McCormack

Inventor： Sungho Jin ,  Mark T. McCormack

IPC: B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC classification number: B23K35/0222 ,  H05K3/3436 ,  B23K35/0227 ,  B23K35/0244 ,  H01L2924/0002 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0235 ,  H05K2203/0769 ,  H05K2203/104 ,  Y02P70/613

Abstract: Electronic devices having at least two components wire mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two component. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to the diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

Abstract translation: 具有至少两个部件的电子设备配线接触焊盘在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成，使得至少两个焊丝与配合焊盘接触，并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成，该焊丝具有与直径的长宽比的高纵横比。 或者，复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。

公开(公告)号：US5366140A

公开(公告)日：1994-11-22

申请号：US129668

申请日：1993-09-30

Applicant: David C. Koskenmaki ,  Clyde D. Calhoun

Inventor： David C. Koskenmaki ,  Clyde D. Calhoun

IPC: B23K35/02 ,  H01L21/52 ,  H01L21/60 ,  H01L23/498 ,  H05K3/10 ,  H05K3/32 ,  B23K35/00 ,  B23K35/14

CPC classification number: H01L24/83 ,  B23K35/0222 ,  H01L23/49883 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12033 ,  H01L2924/14 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2203/0338 ,  H05K2203/0425 ,  H05K2203/128 ,  H05K3/102 ,  Y10T428/12 ,  Y10T428/12014

Abstract: The present invention provides a method for providing an array of metal microbeads on a substrate, preferably in a regular pattern of very fine, uniform size microspheres or microbeads at precise spacing or scale previously unachievable. The method of the present invention comprises the steps of providing a metal layer on a substrate that is partitioned into metal regions; heating the metal layer to a temperature sufficient to melt the metal and to permit beading of the layer into discrete microbeads.

Abstract translation: 本发明提供了一种用于在衬底上提供金属微珠阵列的方法，优选地以非常精细，均匀尺寸的微球或微珠的规则图案以精确的间隔或尺度提前预先不可实现。 本发明的方法包括在分隔成金属区域的基板上设置金属层的步骤; 将金属层加热到足以熔化金属的温度，并允许该层将珠粒串联成离散的微珠。

公开(公告)号：US5282312A

公开(公告)日：1994-02-01

申请号：US816634

申请日：1991-12-31

Applicant: Thomas H. DiStefano ,  Igor Y. Khandros ,  Gary W. Grube

Inventor： Thomas H. DiStefano ,  Igor Y. Khandros ,  Gary W. Grube

IPC: H01L21/48 ,  H01L23/538 ,  H05K1/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5385 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0298 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Multilayer circuit assemblies are made by stacking circuit panels having contacts on their top surfaces, through conductors extending between top and bottom surfaces and terminals connected to the bottomend of each through conductor. The terminals and contacts are arranged so that when the panels are stacked the terminals on the bottom of one panel are in alignment with the contacts on the top surface of the immediately underlying panel. The panels are selectively treated on their top and/or bottom surfaces so as to selectively disconnect or connect each contact to a terminal on the bottom surface of the same panel. For example, the top surface of the panel may be selectively etched to disconnect a contact from one through conductor and hence from the associated terminal. The aligned terminals and contacts are nonselectively connected to one another at each interface so that wherever a terminal and contact on adjacent panels are aligned with one another there are connected to one another. This forms composite vertical conductors extending through a plurality of the panels. The selective treatment of the panel top and bottom surfaces provides selective interruptions in the vertical conductors. A circuit panel precursor having the through conductors and methods of making the same are also provided.

Abstract translation: 多层电路组件通过在其顶表面上堆叠具有触点的电路板，通过在顶表面和底表面之间延伸的导体以及连接到每个贯通导体的底端的端子而形成。 端子和触点被布置成使得当面板堆叠时，一个面板的底部上的端子与紧邻的底板的顶表面上的触点对准。 在其顶表面和/或底表面上选择性地处理这些面板，以便选择性地将每个接触件断开或连接到同一面板的底表面上的端子。 例如，可以选择性地蚀刻面板的顶表面以将接触从一个导体断开，并因此从相关联的端子断开。 对准的端子和触点在每个接口处彼此非选择性地连接，使得相邻面板上的端子和触点彼此对准的位置彼此连接。 这形成延伸穿过多个面板的复合垂直导体。 面板顶部和底部表面的选择性处理在垂直导体中提供选择性的中断。 还提供了具有贯通导体的电路板前体及其制造方法。

公开(公告)号：US5240761A

公开(公告)日：1993-08-31

申请号：US237546

申请日：1988-08-29

Applicant: Clyde D. Calhoun ,  Maurice J. Fleming

Inventor： Clyde D. Calhoun ,  Maurice J. Fleming

IPC: C09J7/00 ,  C09J7/02 ,  H05K3/32

CPC classification number: C09J7/00 ,  C09J7/0203 ,  C09J7/0207 ,  H05K3/323 ,  C09J2201/32 ,  C09J2201/602 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/09945 ,  Y10T428/24413 ,  Y10T428/24545 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

Abstract: Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive particles, most of which are substantially uniformly spaced from their six nearest neighbors. Preferably the particles are spherical and of substantially equal diameter slightly exceeding the thickness of the adhesive layer. The adhesive tape can be made by forming a dense monolayer of the particles, covering a stretchable adhesive layer with that dense monolayer, biaxially stretching the adhesive layer to separate each particle from other particles of the monolayer, and then embedding the particles either into that adhesive layer or into the adhesive layer of another tape.

Abstract translation: 两个基板上的导电元件可以通过含有导电颗粒的粘合带电互连，其中大部分与其六个最近的邻近部分基本均匀地间隔开。 优选地，颗粒是球形的并且具有基本相等的直径略微超过粘合剂层的厚度。 胶带可以通过形成致密的单层颗粒，用该致密单层覆盖可拉伸的粘合剂层，双轴拉伸粘合剂层以将每个颗粒与单层的其它颗粒分离，然后将颗粒包埋在该粘合剂中 层或另一条胶带的粘合剂层。