Abstract:
Retention structures are provided to guide and secure a co-axial cable from an upper portion to a lower portion of a logic board having a bend region. In one embodiment, a retention structure can guide, retain, and electrically ground the co-axial cable at multiple locations. In another embodiment, a retention structure can provide route a co-axial cable around the bend region of the logic board, while providing strain relief and the ability to accommodate co-axial cables of different lengths, due to manufacturing tolerances. Multi-purpose cowling structures are also provided to minimize spacing impact within an electronic device, while maximizing functional utility. In another embodiment, a cowling can electrically connect the ground plane of a logic board to the ground plane of a housing member and provide a pre-load force to a conductor connection existing on logic board.
Abstract:
A cable guide is used to constrain and locate wires or cables for preparation for and for connection to a circuit board or connector, for termination. The cable guide has openings that receive and secure wires during the termination process. A shaft of the cable guide may be used to secure, in a repeatable manner, a predetermined length of the wires with ends offset from a cable jacket, or other reference on or near the end of the cable. The cable guide and the cable/wires may be secured in a fixture that allows the wire ends to be repeatably scored to remove insulation.
Abstract:
A sensor comprises a preferably multi-layer ceramic substrate (2) and at least one sensor element (1) arranged in, at, or on the ceramic substrate (2). The sensor element (1) can be contacted via a metallic contact (6), with the metallic contact (6) being produced via a soldering connection, which electrically connects the contact (6) with the sensor element (1) and here generates a fixed mechanic connection of the contact (6) in reference to the ceramic substrate (2). Furthermore, a method is claimed for producing the sensor according to the invention.
Abstract:
Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.
Abstract:
An assembly of substrate packages interconnected with flex cables. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing detachable inter-package flex cable connection. The flex cable comprises a transmission region that includes a plurality of signal traces and a ground plane. A plurality of solder mask strips are disposed on the plurality of signals traces to provide anchoring for the signal traces. The solder mask strips intersect the signals traces. The exposed signal traces and the ground plane are coated with organic solderability preservative material. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
Abstract:
Provided is a metal terminal block adapted for surface mounting, which includes a metal body having a three-dimensional shape, an outer surface of which includes at least one portion appropriate for vacuum pickup. The metal terminal block provided on a reel carrier through taping is picked up through the vacuum pickup on the portion of the outer surface of the metal body and is mounted on a conductive pattern of a circuit board through the surface mounting. A back surface of the metal terminal block is adhered to the conductive pattern through reflow soldering. The metal body has an insertion recess extending from a surface to an opposite surface thereto, or an insertion hole passing through a surface to an opposite surface thereto.
Abstract:
An electrical connector assembly is provided with an insulating housing, a PCB, and an FFC. The insulating housing includes a plurality of terminals and two side extensions The FFC and the terminals are electrically connected together by the PCB. A plurality of contacts of the PCB are provided on a top surface of the PCB. A space is defined by the extensions and two rearward inclined members on both sides of the insulating housing respectively with each rearward inclined member joining the insulating housing and the extension. The PCB is disposed in the space.
Abstract:
An electronic endoscope has an insert section to be introduced into a human body cavity. A distal portion of the insert section contains a CCD and a printed circuit board to which the CCD is bonded. In the insert section, a cable bundle being a bundle of coaxial cables extends. Each coaxial cable consists of a signal line, insulation surrounding the signal line, a braided wire surrounding the insulation, and an insulating jacket. The cylindrical braided wire is stranded into a single line, and is soldered as a ground line to a ground terminal of the printed circuit board. The signal line is pulled out of the coaxial cable with a length longer than the ground line. The signal line is soldered to an input/output terminal of the printed circuit board with a larger sag than the ground line.
Abstract:
Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.
Abstract:
An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.