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    Panel with electric devices
    51.
    发明授权
    Panel with electric devices 有权
    面板带电器

    公开(公告)号：US09596752B2

    公开(公告)日：2017-03-14

    申请号：US14464006

    申请日：2014-08-20

    Applicant: Ambianti B.V.

    Inventor： Georgios Metaxas

    IPC: H05K5/00 ,  H05K1/02 ,  G06F3/14 ,  G09G3/20 ,  H05K3/00

    CPC classification number: H05K1/0292 ,  G06F3/1446 ,  G09G3/20 ,  G09G3/2085 ,  G09G3/2088 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2310/0278 ,  G09G2310/0281 ,  G09G2330/08 ,  G09G2340/0492 ,  G09G2360/141 ,  G09G2370/18 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/09972 ,  H05K2201/10507

    Abstract: A panel of rectangular shape comprising a plurality of electric devices spread over the panel, a control unit including a microprocessor and a power supply, drivers for driving the electric devices based on control information received from the control unit and electric wiring connecting the control unit, the drivers and the electric devices, the shape of the panel being adaptable by removing one or more parts of the panel by cutting, sawing, milling, drilling or other suitable methods, wherein the control unit and the drivers are positioned closer to a first side of the panel than to a second side opposite the first side. The drivers and electric devices are partitioned into groups that each comprises one driver that exclusively drives the electric devices in that group.

    Abstract translation: 一种矩形形状的面板，包括分布在面板上的多个电气设备，包括微处理器和电源的控制单元，基于从控制单元接收的控制信息和连接控制单元的电线驱动电气设备的驱动器， 驱动器和电气设备，通过切割，锯切，铣削，钻孔或其它合适的方法来移除面板的一个或多个部分来适应面板的形状，其中控制单元和驱动器位于更靠近第一侧 与第一侧相对的第二侧。 驱动器和电气设备被分成组，每个组包括专门驱动该组中的电气设备的一个驱动器。

    Vehicle-mounted antenna device
    52.
    发明授权
    Vehicle-mounted antenna device 有权
    车载天线装置

    公开(公告)号：US09590294B2

    公开(公告)日：2017-03-07

    申请号：US14425277

    申请日：2013-06-20

    Applicant: DENSO CORPORATION

    Inventor： Yasumune Yukizaki ,  Tadao Suzuki ,  Ryohei Kataoka ,  Yuji Sugimoto

    IPC: H01Q1/32 ,  H01Q1/24 ,  H01Q1/42 ,  H05K1/18 ,  H05K5/00 ,  H01Q9/42 ,  H01Q1/02

    CPC classification number: H01Q1/3275 ,  H01Q1/02 ,  H01Q1/241 ,  H01Q1/42 ,  H01Q9/42 ,  H05K1/181 ,  H05K5/003 ,  H05K2201/10098 ,  H05K2201/10507

    Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on a surface of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section implemented on the board at a position away from the base in the first direction.

    Abstract translation: 车载天线装置包括基座，板，电路部分和壳体。 基座可安装在车辆的屋顶上。 该电路板具有天线元件部分，并且站在基座的表面上。 电路部分用作电连接到天线元件部分的无线通信电路的至少一部分。 壳体由树脂材料制成并形成车辆外形的突起。 板和电路部分位于由基座和壳体形成的空间中。 板位于基座的表面上，使得垂直于基座表面的第一方向与等于板的厚度方向的第二方向不同。 电路部分在基板上在第一方向上远离基座的位置处实现。

    RESIN-SEALED MODULE
    53.
    发明申请
    RESIN-SEALED MODULE 审中-公开
    树脂密封模块

    公开(公告)号：US20170048982A1

    公开(公告)日：2017-02-16

    申请号：US15336941

    申请日：2016-10-28

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shota ISHIHARA ,  Tetsuya ODA ,  Tatsunori KAN ,  Kenichi ATSUCHI

    IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K1/185 ,  H05K1/111 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10431 ,  H05K2201/10507 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/048 ,  H05K2203/1316 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

    Abstract translation: 桥接部分12设置在安装部分11彼此相对的区域中，使得其朝向预定侧移位。 因此，即使桥接部12的线宽比现有技术中的线宽大，也可以在回流工序中适当地进行自对准现象。 因此，可以提供具有高树脂充电性能的树脂密封模块，并且包括电路基板，其中桥接部分12也不会破坏，即使根据较小尺寸的共同接地电极10的尺寸减小 电路部件5可靠地确保安装在电路基板上的多个电路部件5之间的充分的间隙。

    Component-embedded resin substrate
    54.
    发明授权
    Component-embedded resin substrate 有权
    部件嵌入式树脂基板

    公开(公告)号：US09526176B2

    公开(公告)日：2016-12-20

    申请号：US14246682

    申请日：2014-04-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Norio Sakai ,  Yoshihito Otsubo

    IPC: H05K1/18 ,  H01L23/498 ,  H01L23/50 ,  H01L23/00 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/186 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0195 ,  H05K2201/09027 ,  H05K2201/10507 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.

    Abstract translation: 嵌入树脂组件的树脂基板包括树脂结构体，该树脂结构体包括多个层压树脂层，并且具有围绕树脂层的外周的端面和嵌入树脂结构体中的多个嵌入部件。 多个嵌入式组件包括第一嵌入组件和第二嵌入组件。 当在平面视图中观察时，第一嵌入部件具有沿最靠近第一嵌入部件的端面5的一部分延伸的第一外侧。 当在平面视图中观察时，第二嵌入部件具有沿最靠近第二嵌入部件的端表面的一部分延伸的第二外侧。 当在平面图中观察时，外侧与第二外侧倾斜。

    ELECTRIC MOTOR CONTROLLER
    55.
    发明申请
    ELECTRIC MOTOR CONTROLLER 审中-公开
    电动马达控制器

    公开(公告)号：US20160329774A1

    公开(公告)日：2016-11-10

    申请号：US15109832

    申请日：2014-05-22

    Applicant: MITSUBISHI ELECTRIC CORPORATION

    Inventor： Rei ARAKI ,  Yu KAWANO ,  Yoshihito ASAO

    IPC: H02K5/24 ,  H02K11/33 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H02K11/21 ,  H02K11/25

    CPC classification number: H02K5/24 ,  H02K11/21 ,  H02K11/25 ,  H02K11/33 ,  H05K1/0201 ,  H05K1/0216 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/1009 ,  H05K2201/10507

    Abstract: A board includes a separating zone in an area closer to the edge than to the center of the board, the separating zone including one elongated through hole. A first group of electronic components that is a source of heat or electric noise is placed in a first area on the center side with respect to the separating zone of the board. On the other hand, a second group of electronic components from which influence of heat or electric noise from other components needs to be eliminated to a maximum extent is placed in a second area on the edge side with respect to the separating zone of the board.

    Abstract translation: 板包括在靠近边缘的区域比板的中心更远的区域，分离区包括一个细长的通孔。 作为热或电噪声源的第一组电子部件被放置在相对于电路板的分离区域的中心侧的第一区域中。 另一方面，从第二组电子部件放置到相对于电路板的分离区域的边缘侧的第二区域中，来自其他部件的热或电噪声的影响需要最大程度地消除。

    MULTIPLE DRIVE SLED IN A STORAGE ARRAY
    56.
    发明申请
    MULTIPLE DRIVE SLED IN A STORAGE ARRAY 有权
    多个驱动器在存储阵列中滑动

    公开(公告)号：US20160095246A1

    公开(公告)日：2016-03-31

    申请号：US14502717

    申请日：2014-09-30

    Applicant: SEAGATE TECHNOLOGY LLC

    Inventor： Shawn Noland ,  Daniel Milligan

    IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

    CPC classification number: H05K7/1489 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10159 ,  H05K2201/10507

    Abstract: An apparatus as associated method contemplating a housing and a midplane supported by the housing having a midplane connector. A printed circuit board (PCB) having a PCB connector is selectively connectable to the midplane connector. A plurality of data storage devices are arranged on the printed circuit board in a staggered pattern, each electrically connected to the PCB connector via a respective electrical trace in the PCB.

    Abstract translation: 一种设备作为相关方法，考虑由具有中平面连接器的壳体支撑的壳体和中平面。 具有PCB连接器的印刷电路板（PCB）可选择性地连接到中面板连接器。 多个数据存储装置以交错图案布置在印刷电路板上，每个电路板经由PCB中的相应电迹线与PCB连接器电连接。

    Integrated circuit structures having off-axis in-hole capacitor
    57.
    发明授权
    Integrated circuit structures having off-axis in-hole capacitor 有权
    具有离轴孔内电容器的集成电路结构

    公开(公告)号：US09185807B2

    公开(公告)日：2015-11-10

    申请号：US14708755

    申请日：2015-05-11

    Applicant: International Business Machines Corporation

    Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

    IPC: H05K1/18 ,  H05K1/11

    CPC classification number: H05K1/183 ,  H05K1/0231 ,  H05K1/11 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/09645 ,  H05K2201/10015 ,  H05K2201/10507 ,  Y02P70/611 ,  Y10T29/49135

    Abstract: Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (IC) structure includes: a substrate layer having an upper surface; an IC chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the IC chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the IC chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the IC chip.

    Abstract translation: 各种实施例包括具有离轴孔内电容器的集成电路结构。 在一些实施例中，集成电路（IC）结构包括：具有上表面的基底层; 至少部分地包含在所述衬底层内并与垂直于所述衬底层的上表面的短轴对准的IC芯片; 所述基板层中的孔，所述孔与所述IC芯片物理分离; 以及孔中的电容器，并且至少部分地包含在所述衬底层内，所述电容器与所述IC芯片物理隔离，其中所述电容器与垂直于所述衬底层的上表面的轴线对准，并且偏离所述衬底层的短轴 IC芯片。

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