公开(公告)号：US5281152A

公开(公告)日：1994-01-25

申请号：US914870

申请日：1992-07-15

Applicant: Hisafumi Takahashi ,  Naoki Sugita

Inventor： Hisafumi Takahashi ,  Naoki Sugita

IPC: H05K3/34 ,  H01R9/09

CPC classification number: H05K3/3426 ,  H01R12/716 ,  H05K2201/09709 ,  H05K2201/10772 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A surface-mounted electronic connector in which board connecting end portions of contacts of the connector extend in mutually parallel, closely spaced apart, coplanar relation and are maintained spaced apart above the board by feet of equal height which depend from tips of respective end portions. The height of each foot is not less than the sum the above-board height of a connection portion of a conductive layer of the board and the height of a reflow solder layer or pad thereon.

Abstract translation: 一种表面安装的电子连接器，其中连接连接端子的触头端部的板以相互平行的，相互间隔开的共面关系延伸，并且在板的上方保持间隔开，这些脚相等于相应端部的尖端。 每个脚的高度不小于板的导电层的连接部分的上板高度和其上的回流焊料层或焊盘的高度之和。

公开(公告)号：US5241134A

公开(公告)日：1993-08-31

申请号：US908826

申请日：1992-07-01

Applicant: Clarence S. Yoo

Inventor： Clarence S. Yoo

IPC: H01L23/495 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01R43/0235 ,  H01L23/49541 ,  H05K3/3426 ,  H05K3/3442 ,  H05K3/3478 ,  H01L2924/0002 ,  H05K2201/0373 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0113 ,  H05K2203/033 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K3/3489 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179

Abstract: The prior art terminal for making a solder bond between a lead and a bond site is modified so as to enhance the reliability of the solder bond. In one embodiment, this modification entails solder relief terminals: solder relief holes through the terminal, notches, grooves or ridges on the surface of the terminal, or bending of the terminal. In a second embodiment, this modification entails predeposit of a predetermined and controlled amount of solid solder and flux on the terminal.

Abstract translation: 改进了用于在引线和键合部位之间形成焊料接合的现有技术的端子，以提高焊料接合的可靠性。 在一个实施例中，该修改涉及消除焊接端子：通过端子的焊接浮雕孔，端子表面上的凹口，凹槽或脊，或端子的弯曲。 在第二实施例中，该修改需要在端子上预定和控制量的固体焊料和焊剂。

公开(公告)号：US4953173A

公开(公告)日：1990-08-28

申请号：US228107

申请日：1988-08-04

Applicant: Takao Fujitsu

Inventor： Takao Fujitsu

IPC: H01L23/14 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498 ,  H05K1/05 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K3/363 ,  H01L23/142 ,  H01L23/49534 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/056 ,  H05K1/141 ,  H05K2201/091 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10772 ,  H05K2203/302 ,  H05K3/0061

Abstract: A semiconductor device comprises an inverted-tray-shaped support frame having a concave inner surface, a semiconductor element supported by the support frame at the center of its inner surface, and a plurality of leads which are formed on the inner surface of the support frame over an insulative layer interposed therebetween, and which extend from the center of the support frame outward to the periphery hereof and are electrically connected at their inner root ends to respective electrodes of the semiconductor element. The support frame reinforces and preserves the mechanical strength of the leads, which can therefore be spaced more closely and accurately.

Abstract translation: 半导体器件包括具有凹内表面的倒托盘状支撑框架，在其内表面的中心由支撑框架支撑的半导体元件和形成在支撑框架的内表面上的多个引线 在绝缘层之间插入，并且从支撑框架的中心向外延伸到其周边，并且在其内根部处电连接到半导体元件的相应电极。 支撑框架加强并保持引线的机械强度，因此可以更紧密和准确地间隔。

公开(公告)号：US4777564A

公开(公告)日：1988-10-11

申请号：US122606

申请日：1987-11-17

Applicant: Dennis J. Derfiny ,  Joseph D. Ceccoli ,  Emery E. Baxter

Inventor： Dennis J. Derfiny ,  Joseph D. Ceccoli ,  Emery E. Baxter

IPC: H01L23/495 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01R9/00

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H01R12/57 ,  H05K1/0271 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K3/305 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved leadform for use with surface mount components is described. The improved leadform provides a connection to a printed circuit substrate which is highly resistant to stress related failures. The leadform is configured so that the connection utilizes a relatively greater area of the leadform for contact with a solder connection resulting in a more compliant connection. In addition, the present invention provides a preparation for the printed circuit media which allows the substrate media to absorb stresses which occur due to thermal cycling.

Abstract translation: 描述了一种用于表面安装部件的改进的引线形式。 改进的引线形式提供与印刷电路基板的连接，其高度抵抗与应力相关的故障。 引线形状被配置为使得连接利用引线形式的相对较大的区域与焊接连接接触，导致更顺从的连接。 此外，本发明提供了印刷电路介质的准备，其允许基板介质吸收由于热循环而发生的应力。

公开(公告)号：US20170288509A1

公开(公告)日：2017-10-05

申请号：US15507301

申请日：2014-10-23

Applicant: Mitsubishi Electric Corporation

Inventor： Junichiro OYA ,  Tomoaki OIKAWA ,  Mineo YAMAMOTO ,  Hiroyuki ISHII ,  Hiroki ASO ,  Yuto URABE

IPC: H02K11/00 ,  H05K1/11 ,  F24F11/02 ,  H05K1/18

CPC classification number: H02K11/0094 ,  F24F11/89 ,  H02K5/08 ,  H02K11/00 ,  H02K11/215 ,  H02K11/33 ,  H02K15/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/3426 ,  H05K2201/09027 ,  H05K2201/10151 ,  H05K2201/10772 ,  Y02P70/613

Abstract: An object of the present invention is to obtain a wiring board that achieves both of high mounting position accuracy and high solder strength in a circumferential direction. On the wiring board, an electronic component including a plurality of pins is mounted. The wiring board includes a base substrate, a plurality of wires provided on the base substrate, a resist covering the wires, and a plurality of footprints connected to the wires and having entire surfaces exposed in openings of the resist. The pins are soldered to the footprints by reflow. In the openings of the resist, directions in which the pins are led out are parallel to directions in which the wires are led out.

公开(公告)号：US20160227648A1

公开(公告)日：2016-08-04

申请号：US15013286

申请日：2016-02-02

Applicant: FANUC Corporation

Inventor： Takeshi SAWADA ,  Yuichi OKOUCHI ,  Daisuke MIURA

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H05K3/305 ,  H05K2201/10772 ,  Y02P70/613

Abstract: The width of a lead-terminal connection pad on a printed wiring board is not greater than the width of a lead terminal. Therefore, a wider space can be secured between adjacent solder joints, so that bridge failure can be suppressed. Further, the length of projection of the lead-terminal connection pad at the proximal portion of the lead terminal is shorter than that of a lead-terminal connection pad on a conventional printed wiring board. Thus, a solder pool at the proximal portion of the lead terminal can be reduced to suppress bridge defect.

Abstract translation: 印刷电路板上的引线端子连接焊盘的宽度不大于引线端子的宽度。 因此，可以在相邻的焊点之间确保更宽的空间，从而可以抑制桥接故障。 此外，引线端子连接焊盘在引线端子的基端部的突出长度比传统印刷电路板上的引线端子连接焊盘的突出长度短。 因此，可以减少引线端子的近端部分的焊料池，以抑制桥接缺陷。

公开(公告)号：US20130146347A1

公开(公告)日：2013-06-13

申请号：US13323916

申请日：2011-12-13

Applicant: John E. McConnell ,  Alan P. Webster ,  Lonnie G. Jones ,  Garry L. Renner ,  Jeffrey Bell

Inventor： John E. McConnell ,  Alan P. Webster ,  Lonnie G. Jones ,  Garry L. Renner ,  Jeffrey Bell

IPC: H05K1/18 ,  H01G4/30 ,  H05K3/34

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

Abstract translation: 描述了改进的无源电子堆叠部件。 该组件具有堆叠的单个电子电容器和附接到堆叠的第一侧的第一引线。 第二引线连接到堆叠的第二侧。 脚连接到第一引线并向内延伸到第二引线。 稳定销连接到脚或第一引线之一。

公开(公告)号：US08142240B2

公开(公告)日：2012-03-27

申请号：US12805214

申请日：2010-07-19

Applicant: Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

Inventor： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

IPC: H01R4/02

CPC classification number: H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

Abstract: Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

Abstract translation: 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

公开(公告)号：US07893355B2

公开(公告)日：2011-02-22

申请号：US12232316

申请日：2008-09-15

Applicant: Hueng Jae Oh ,  Jin Won Choi

Inventor： Hueng Jae Oh ,  Jin Won Choi

IPC: H01R4/18

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00

Abstract: Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.

Abstract translation: 提供一种用于封装板的引脚，包括直径朝向其中间部分增加的圆盘形头部，并且具有六边形垂直横截面形状; 以及形成为从头部的上表面的中心突出的连接销。

公开(公告)号：US20110014827A1

公开(公告)日：2011-01-20

申请号：US12805214

申请日：2010-07-19

Applicant: Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

Inventor： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

IPC: H01R13/04

CPC classification number: H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

Abstract: Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

Abstract translation: 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。