公开(公告)号：US20180310416A1

公开(公告)日：2018-10-25

申请号：US15738074

申请日：2016-06-16

Applicant: Ronald NEHRING ,  Mokhtar ROUABHI ,  Reginald SIMPSON

Inventor： Ronald NEHRING ,  Mokhtar ROUABHI ,  Reginald SIMPSON

IPC: H05K3/34 ,  H05K1/02

CPC classification number: H05K3/3405 ,  H05K1/0243 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10628 ,  H05K2201/10818 ,  H05K2201/10969

Abstract: Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).

公开(公告)号：US09844137B2

公开(公告)日：2017-12-12

申请号：US14850253

申请日：2015-09-10

Applicant: Advanced Powertrain Engineering, LLC

Inventor： Paul Fathauer

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  F16K31/02 ,  H05K1/18

CPC classification number: H05K1/115 ,  F16K31/02 ,  H05K1/119 ,  H05K1/18 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10818 ,  Y10T29/49002

Abstract: A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

公开(公告)号：US20140146549A1

公开(公告)日：2014-05-29

申请号：US14171552

申请日：2014-02-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Kyong Jun KIM

IPC: F21V23/00

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provided are a light emitting apparatus and a light unit having the same. The light emitting apparatus includes a light emitting device includes a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

Abstract translation: 提供一种发光装置和具有该发光装置的光单元。 发光装置包括发光装置，其包括发光元件和多个外部引线，以及在发光器件下方的多个电极焊盘。

公开(公告)号：US08277107B2

公开(公告)日：2012-10-02

申请号：US13240871

申请日：2011-09-22

Applicant: Kyong Jun Kim

Inventor： Kyong Jun Kim

IPC: F21V7/04

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provides are a light emitting apparatus and a light unit having the same. The light emitting apparatus comprises a light emitting device comprising a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

Abstract translation: 提供一种发光装置和具有该发光装置的光单元。 发光装置包括发光装置，其包括发光元件和多个外部引线，以及在发光器件下方的多个电极焊盘。

公开(公告)号：US20120181077A1

公开(公告)日：2012-07-19

申请号：US13346085

申请日：2012-01-09

Applicant: Kazuya MIYASAKA ,  Kouji KOBAYASHI ,  Akihito FUKUZAWA

Inventor： Kazuya MIYASAKA ,  Kouji KOBAYASHI ,  Akihito FUKUZAWA

IPC: H05K1/11

CPC classification number: H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board.

Abstract translation: 印刷电路板单元包括：印刷电路板，包括具有彼此相对的第一和第二内表面的通孔; 终端销，其包括插入到所述通孔中的插入部; 焊料填充到通孔中，并且将印刷电路板与端子销接合，其中插入部分包括抵靠第一内表面的基部，以及突出部分，包括：从基部突出到第二内部的突出表面 表面并邻接第二内表面; 以及位于所述突起表面的后侧并与所述第一内表面间隔开的凹陷表面，并且所述突出部分的所述印刷电路板的厚度方向的长度大于所述印刷电路板的厚度。

公开(公告)号：US20110201214A1

公开(公告)日：2011-08-18

申请号：US12837517

申请日：2010-07-16

Applicant: Ryou MATSUBARA ,  Shouichi Mimura ,  Hirotsugu Fusayasu ,  Masafumi Kumoi ,  Toshiyuki Nakaie

Inventor： Ryou MATSUBARA ,  Shouichi Mimura ,  Hirotsugu Fusayasu ,  Masafumi Kumoi ,  Toshiyuki Nakaie

IPC: H01R12/14 ,  H01R24/00 ,  H05K1/11

CPC classification number: H01R43/16 ,  H01R12/724 ,  H01R13/6582 ,  H05K1/111 ,  H05K1/141 ,  H05K3/3426 ,  H05K2201/0373 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/10818 ,  Y02P70/611

Abstract: A receptacle structure includes a housing structure, a terminal insulating board, a first terminal and a second terminal. The housing structure is configured to be mounted on a printed wiring board and to accommodate a plug. The terminal insulating board includes a top face and a bottom face that is opposite to the top face. The terminal insulating board is disposed inside the housing structure with the bottom face facing towards the printed wiring board. The first terminal is connected to the printed wiring board via the first rear connection part and to the terminal insulating board. The second terminal is connected to the printed wiring board via the first front connection part and to the terminal insulating board. The first front connection part has a width narrower than the first rear connection part and is connected to the printed wiring board away from the first rear connection part.

Abstract translation: 插座结构包括壳体结构，端子绝缘板，第一端子和第二端子。 壳体结构被配置为安装在印刷线路板上并容纳插头。 端子绝缘板包括顶面和与顶面相对的底面。 端子绝缘板设置在壳体结构内部，底面朝向印刷线路板。 第一端子经由第一后连接部和端子绝缘板与印刷电路板连接。 第二端子经由第一前连接部和端子绝缘板与印刷电路板连接。 第一前连接部分具有比第一后连接部分窄的宽度，并且与第一后连接部分连接到印刷线路板。

公开(公告)号：US07841859B2

公开(公告)日：2010-11-30

申请号：US12229012

申请日：2008-08-18

Applicant: Fang-Chu Liao ,  Chun-Yi Chang

Inventor： Fang-Chu Liao ,  Chun-Yi Chang

IPC: H01R12/00

CPC classification number: H01R12/707 ,  H01R12/716 ,  H05K3/3426 ,  H05K2201/10325 ,  H05K2201/10818 ,  H05K2201/10848 ,  Y02P70/613

Abstract: A socket, for electrically connecting an IC package and a printed circuit board, comprises an insulative housing and a plurality of contacts received in the insulative housing. The insulative housing has an opening in a center thereof, a solder pad is received in the opening and has a soldering board which is soldered to the printed circuit board to enhance a mechanical connection between the socket and the printed circuit board.

Abstract translation: 用于电连接IC封装和印刷电路板的插座包括绝缘壳体和容纳在绝缘壳体中的多个触点。 绝缘壳体在其中心具有开口，焊盘被容纳在开口中，并且具有焊接到印刷电路板的焊接板，以增强插座和印刷电路板之间的机械连接。

公开(公告)号：US20100238637A1

公开(公告)日：2010-09-23

申请号：US12303572

申请日：2007-06-05

Applicant: Rabin Bhattacharya ,  Pieter J. Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger

Inventor： Rabin Bhattacharya ,  Pieter J. Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger

IPC: H05K7/02

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

Abstract translation: 提供了一种用于在基板上布置电子部件的基座。 底座包括头部构件和从头部构件突出的至少一个衬底接合构件。 头部构件包括彼此隔离的导电部分中的至少两个，其中每个导电部分包括适于将电子部件连接到其上的部件接触件和布置在所述基板侧上的基板接触件，适于使所述 与包括在所述衬底中的电路接触的导电部分。 本发明的基座可以用于将诸如发光二极管的电子部件附接到纺织品基板，而不需要将电子部件直接焊接在基板上。

公开(公告)号：US20100212149A1

公开(公告)日：2010-08-26

申请号：US12557222

申请日：2009-09-10

Applicant: Zdenko GRAJCAR

Inventor： Zdenko GRAJCAR

IPC: H05K3/00

CPC classification number: H05K1/144 ,  F21K9/00 ,  H05K1/0204 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/306 ,  H05K3/3415 ,  H05K3/368 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10818 ,  H05K2203/0169 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A light circuit manufacturing process includes forming a palletized driver PCB board having a plurality of driver PCBs, forming a plurality of power PCBs on a palletized surface, forming slots in the driver PCBs, forming holes in the power PCBs, aligning both the power PCB palletization and the driver PCB palletization using reference holes such that the edges of each extend further in one direction or the other, and inserting thermal tabs into both the power PCB and the driver PCB.

Abstract translation: 光电路制造工艺包括形成具有多个驱动器PCB的码垛驱动PCB板，在码垛表面上形成多个电源PCB，在驱动器PCB中形成槽，在电源PCB中形成孔，使电源PCB码垛 以及使用参考孔的驱动器PCB码垛，使得每个边缘在一个方向上进一步延伸，并且将热突片插入到电源PCB和驱动器PCB中。

公开(公告)号：US20090213587A1

公开(公告)日：2009-08-27

申请号：US11817978

申请日：2006-03-06

Applicant: Noritsugu Enomoto ,  Hirofumi Utsunomiya ,  Shigeki Motomura

Inventor： Noritsugu Enomoto ,  Hirofumi Utsunomiya ,  Shigeki Motomura

IPC: F21V1/00 ,  F21V21/00

CPC classification number: H05K3/326 ,  F21K9/00 ,  F21S4/10 ,  F21S43/14 ,  F21S43/195 ,  F21S43/30 ,  F21S43/33 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10962 ,  H05K2203/1189

Abstract: An LED lighting device provided with a flat circuit body where LEDs are mounted in a lamp room that is constructed from a lamp body and a lens installed on a front opening of the lamp body, and with a reflector structure body for reflecting light that is emitted from the LEDs. Opening are formed in a wall section of the reflector structure body, and the LEDs of the flat circuit body are installed in the openings. As a result, the flat circuit body supported by the reflector structure body.

Abstract translation: 一种LED照明装置，其具有平坦电路体，其中LED安装在由灯体和安装在灯体的前开口上的透镜构成的灯室中，并具有反射器结构体，用于反射发射的光 从LED。 开口形成在反射器结构体的壁部分中，并且扁平电路体的LED安装在开口中。 结果，由反射器结构体支撑的平坦电路体。