公开(公告)号：US20060192273A1

公开(公告)日：2006-08-31

申请号：US11066875

申请日：2005-02-25

Applicant: Bernhard Lange ,  William Boyd

Inventor： Bernhard Lange ,  William Boyd

IPC: H01L23/48

CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

Abstract translation: 集成电路（IC）封装100包括耦合到IC的IC 102和引线104。 每个引线具有被配置为耦合到集成电路的第一端106和被配置为穿过延伸穿过安装板112的多个安装孔110中的一个的第二端108。 引线包括至少一个定位引线114，定位引线114包括止动件118，该止动件118是定位引线的连续部分，并且具有大于多个安装孔中的第一孔124的直径122的横向尺寸120。 引线还包括至少一个非定位引线116，其具有连续均匀成形的主体130，其横向尺寸132小于多个安装孔中的第二孔136的直径134。 停止限制非定位导线通过第二个孔的延伸。

公开(公告)号：US06898847B2

公开(公告)日：2005-05-31

申请号：US10193989

申请日：2002-07-15

Applicant: André Koerner ,  Ralf Schulze

Inventor： André Koerner ,  Ralf Schulze

IPC: H01R4/02 ,  H01R43/02 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H01R4/024 ,  H01R43/0235 ,  H01R43/0256 ,  H05K3/3415 ,  H05K3/3484 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10871 ,  H05K2201/10901 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A method is described for producing an electrical connection between a plug element and a printed circuit board. A plug end of the at least one plug element is inserted in an opening extending through the printed circuit board. A solder, preferably in the form of solder paste, is applied essentially from above to at least parts of the opening or the area surrounding the opening. The connection between the board and the plug end is achieved by melting the solder. Prior to melting of the solder and/or application of the solder, the plug end is introduced into the opening in the printed circuit board essentially from below, and is held therein by a retaining arrangement such that during melting the solder enters the opening from above and contacts the plug end.

Abstract translation: 描述了一种用于产生插头元件和印刷电路板之间的电连接的方法。 所述至少一个插头元件的插塞端插入延伸穿过所述印刷电路板的开口中。 优选以焊膏形式的焊料基本上从上方施加到开口的至少部分或围绕开口的区域。 通过熔化焊料来实现板和插头端之间的连接。 在焊料熔化和/或焊接的应用之前，插塞端部基本上从下方引入印刷电路板的开口中，并通过保持装置保持在其中，使得在熔化期间焊料从上方进入开口 并接触插头端。

公开(公告)号：US06817092B2

公开(公告)日：2004-11-16

申请号：US09972697

申请日：2001-10-04

Applicant: James Keith Custer ,  James Hiram Roberson ,  William Kerr Veitschegger

Inventor： James Keith Custer ,  James Hiram Roberson ,  William Kerr Veitschegger

IPC: H01R906

CPC classification number: H01R12/7082 ,  H01R12/523 ,  H01R12/58 ,  H05K3/1216 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/10303 ,  H05K2201/10871 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49163

Abstract: A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a circuit board from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board and solder applied to the pins at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections between the pins and conductive traces on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.

Abstract translation: 提供了允许在电路板之间廉价自动构建互连的方法。 根据本发明，印刷电路引脚从顶部（部件侧）插入到电路板中。 如果引脚的头部足够薄以便位于焊料模板之下，则引脚可以预先安装在电路板上，并且将焊料施加到引脚上，同时将焊料施加到板的其它区域。 因此，可以采用已知的表面贴装技术来形成引脚和电路板上的导电迹线之间的焊接连接，这有助于分别对印刷电路引脚进行以前的手动操作的自动化。

公开(公告)号：US06790102B2

公开(公告)日：2004-09-14

申请号：US10268327

申请日：2002-10-10

Applicant: Morris D Stillabower ,  Roy A. Visser

Inventor： Morris D Stillabower ,  Roy A. Visser

IPC: H01R1122

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/10386 ,  H05K2201/10825 ,  H05K2201/10871

Abstract: A flat twisted electrical terminal is provided for connecting a first circuit element to a second circuit element on respective first and second circuit boards. The terminal includes a flat conductive member having a first end for connecting to a first circuit element and a second end for connecting to a second circuit element. The conductive member is axially twisted about its longitudinal axis.

公开(公告)号：US20030232522A1

公开(公告)日：2003-12-18

申请号：US10393434

申请日：2003-03-20

Applicant: Andrew Corporation

Inventor： Charles J. Buondelmonte ,  Joseph P. Mendelsohn ,  Richard William Brown ,  Min Li ,  Richard Franklin Schwartz ,  Sanjay S. Upasani

IPC: H01R012/00

CPC classification number: H05K3/368 ,  B23K2101/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

Abstract translation: 一种用于在两个电路板之间提供机械/电气互连的方法以及因此需要的互连部件包括每个具有尾部，肩部和头部的销和插座。 销的尾部的尺寸设计成适合于第一板的电镀通孔中，头部的尺寸被设计成允许自动装置捕获头部并且搁置在电镀通孔的顶部上，当 插入其中，并且肩部的尺寸相对于电镀通孔的尺寸，以便放置在电镀通孔内，并允许预定量的焊料在头部下方流下并进入电镀通孔，而不是如 远离尾部，从而有助于将销定位在通孔中。 在加热到回流焊温度时，围绕销的头部周边和插座的肩部的焊料环在插头的头部和插座的肩部下方流动，从而形成焊接的电气 引脚与第一板，插座和第二板之间的连接。 通过将销与插座对准并将销的尾部插入插座的空腔中，在第一板和第二板之间形成可分离的可靠的机械和电气互连。

公开(公告)号：US06552277B1

公开(公告)日：2003-04-22

申请号：US09658764

申请日：2000-09-08

Applicant: Stuart D. Downes

Inventor： Stuart D. Downes

IPC: H01R1204

CPC classification number: H01R12/58 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1084 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: The invention is directed to techniques for forming a connection between a pin and a circuit board using a pin having protruding portions and grooved surfaces that extend between the protruding portions. The protruding portions (i) prevent the pin from inadvertently slipping through a via of the circuit board, and (ii) maintains the pin's proper position relative to the circuit board via. The grooved surfaces enable gas to vent from a cavity in the via during the solder process thus enabling solder to flow within the via and form a reliable and robust solder joint between the pin and the circuit board via. In one arrangement, the protruding portions and grooved surfaces are at both ends of the pin enabling the pin to be soldered between two circuit board sections. In one arrangement, the pin is simultaneously soldered to both circuit board sections. In another arrangement, the pin is initially soldered to one circuit board section, and subsequently soldered to another circuit board section. In either arrangement, the protruding portions of the pin, and in some arrangements close tolerances between the pin and the via, facilitate positioning of the pin in its proper location and the additional surface area provided by the grooved surfaces and the protruding portions (i.e., wetted metallic surfaces having a high affinity for solder) retain solder in the via cavities of the circuit board sections in order to form healthy solder joints. Accordingly, the invention is suitable for use in connecting multiple circuit board sections together at opposite ends of a pin.

Abstract translation: 本发明涉及使用具有在突出部分之间延伸的突出部分和凹槽表面的销来形成销和电路板之间的连接的技术。 突出部分（i）防止销不经意地滑过电路板的通孔，并且（ii）保持销相对于电路板通孔的适当位置。 沟槽表面使得气体在焊接过程期间能够从通孔中的空腔排出，从而使得焊料能够在通孔内流动，并在销和电路板通孔之间形成可靠且牢固的焊接接头。 在一种布置中，突出部分和沟槽表面位于销的两端，使得销能够焊接在两个电路板部分之间。 在一种布置中，引脚同时焊接到两个电路板部分。 在另一种布置中，该引脚最初被焊接到一个电路板部分，并随后焊接到另一个电路板部分。 在任何一种布置中，销的突出部分和在销和通孔之间的一些布置中的公差很容易将销定位在其正确的位置以及由凹槽表面和突出部分（即， 对焊料具有高亲和力的润湿金属表面）将焊料保留在电路板部分的通孔中，以形成健康的焊点。 因此，本发明适用于在引脚的相对端部处将多个电路板部分连接在一起。

公开(公告)号：US20020182903A1

公开(公告)日：2002-12-05

申请号：US10195865

申请日：2002-07-15

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H01R012/00

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，所述材料将接合销接合到相对方垫81.接合销由大于通孔的开口直径的接合头部11构成，并形成接合 以及具有能够将该腿部插入通孔的尺寸的腿部12。 脚部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。大体上具有球形而不是接合销的接合球也可以连接到通孔 由导电材料制成。

公开(公告)号：US20020058428A1

公开(公告)日：2002-05-16

申请号：US09473705

申请日：1999-12-29

Inventor： CHIEKO TORII

IPC: H05K001/00

CPC classification number: H05K3/3447 ,  H01R4/028 ,  H01R12/58 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10803 ,  H05K2201/10871

Abstract: The circuit-board connecting terminal (1) includes a small-width portion (7) to be inserted into a through hole (22) formed in a circuit board (12), a pair of taper portions (8) respectively to be abutted against an open end (23) of the through hole (22), and a large-width portion (5) formed so as to be continuous with the taper portions (8), while the small-width portion (7) can be connected to the inside of the through hole (22) by soldering. In the circuit-board connecting terminal (1), the taper portions (8) have a steep inclination angle, and are located at the open end (23) of the through hole (22), so as not to advance almost into the through hole (22).

Abstract translation: 电路板连接端子（1）包括插入到形成在电路板（12）中的通孔（22）中的小宽度部分（7），一对锥形部分（8），分别抵靠 所述通孔（22）的开口端（23）和形成为与所述锥形部分（8）连续的大宽度部分（5），而所述小宽度部分（7）可以连接到 通孔（22）的内部通过焊接。 在电路板连接端子（1）中，锥形部分（8）具有陡峭的倾斜角度，并且位于通孔（22）的开口端（23）处，以便不会前进到通孔 孔（22）。

公开(公告)号：US06217346B1

公开(公告)日：2001-04-17

申请号：US09309353

申请日：1999-05-11

Applicant: Michael M. Cubon

Inventor： Michael M. Cubon

IPC: H01R1200

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K3/4069 ,  H05K2201/09981 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10871 ,  Y10S439/931

Abstract: A solderless pin connection for a printed circuit board wherein a substrate is printed with polymer thick film. The substrate includes an inner surface defining a hole. The polymer thick film is applied along a top surface of the substrate and along the inner surface. The polymer thick film may additionally be applied along a bottom surface of the substrate with an additional layer along the inner surface. A pin, having a diameter less than a diameter of the hole, is press fit within the polymer thick film along the inner surface the pin. The pin is staked with respect to the substrate using a mechanical connection such as barbs or a folded portion on a staked end of the pin.

Abstract translation: 用于印刷电路板的无焊针连接器，其中衬底被印刷有聚合物厚膜。 衬底包括限定孔的内表面。 聚合物厚膜沿着衬底的顶表面并沿内表面施加。 聚合物厚膜可以另外沿着衬底的底表面沿着内表面附加层施加。 具有小于该孔直径的直径的针沿销的内表面压配合在聚合物厚膜内。 使用机械连接（例如倒钩或销钉的桩端上的折叠部分）将销钉相对于基板铆接。

公开(公告)号：US5726862A

公开(公告)日：1998-03-10

申请号：US596530

申请日：1996-02-02

Applicant: Due Huynh ,  Thomas P. Kirby ,  Micheal M. Austin ,  John E. Herrmann

Inventor： Due Huynh ,  Thomas P. Kirby ,  Micheal M. Austin ,  John E. Herrmann

IPC: H01L33/62 ,  H05K3/30 ,  H05K7/02

CPC classification number: H01L33/62 ,  H05K3/308 ,  H01L2924/0002 ,  H05K2201/094 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/168

Abstract: A leaded component (10) is provided with first and second leads (14 & 16). The leads are formed with stopping deviations (26 & 28) which prevent the leads from being inserted into a circuit board (38) beyond the stopping deviations. The leads may also be provided with retaining deviations (34 & 36) which function to retain the component on the circuit board. Further, the stopping deviations may be formed so as to indicate the polarity of a component, and finally, the stopping deviations may be provided with mounting portions (50 & 52) so that the leaded component may be surface mounted on a circuit board (54).

Abstract translation: 引线元件（10）设置有第一和第二引线（14和16）。 引线形成有阻止偏差（26和28），其阻止引线超出止动偏差插入电路板（38）。 引线还可以设置有用于将部件保持在电路板上的保持偏差（34和36）。 此外，可以形成停止偏差以指示部件的极性，最后，可以将停止偏差设置有安装部分（50和52），使得引线部件可以表面安装在电路板（54）上 ）。