公开(公告)号：US11780725B2

公开(公告)日：2023-10-10

申请号：US17145061

申请日：2021-01-08

Applicant: Nanusens SL

Inventor： Josep Montanyà Silvestre

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81B7/0006 ,  B81C1/00142 ,  B81C1/00325 ,  B81B2201/0228 ,  B81B2203/0163 ,  B81B2207/07

Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

公开(公告)号：US11726107B2

公开(公告)日：2023-08-15

申请号：US17027948

申请日：2020-09-22

Applicant: NXP USA, Inc.

Inventor： Andrew C McNeil ,  Jerome Romain Enjalbert ,  Joel Cameron Beckwith ,  Jun Tang

IPC: G01P15/125 ,  B81B3/00

CPC classification number: G01P15/125 ,  B81B3/0027 ,  B81B2201/0228

Abstract: A sensor system includes a transducer for sensing a physical stimulus along at least two orthogonal axes and an excitation circuit. The transducer includes a movable mass configured to react to the physical stimulus and multiple differential electrode pairs of electrodes. Each of the electrode pairs is configured to detect displacement of the movable mass along one of the orthogonal axes. The excitation circuit is connectable to the electrodes in various electrode connection configurations, with different polarity schemes, that enable excitation and sampling of each of the orthogonal axes during every sensing period. For each sensing period, a composite output signal is produced that includes the combined information sensed along each of the orthogonal axes. The individual sense signals for each orthogonal axis may be extracted from the composite output signals.

公开(公告)号：US11661333B2

公开(公告)日：2023-05-30

申请号：US17070341

申请日：2020-10-14

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Wei-Jhih Mao ,  Shang-Ying Tsai ,  Kuei-Sung Chang ,  Chun-Wen Cheng

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81C1/00166 ,  B81C1/00825 ,  B81B2201/0228 ,  B81B2201/0292 ,  B81B2201/038 ,  B81B2203/04

Abstract: A semiconductor structure includes a substrate; a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.

公开(公告)号：US11650566B2

公开(公告)日：2023-05-16

申请号：US16734233

申请日：2020-01-03

Applicant: STMicroelectronics S.r.l.

Inventor： Luca Fontanella ,  Andrea Labombarda ,  Marco Bianco ,  Davide Ghezzi ,  Christian Raineri ,  Paolo Gatti

IPC: B81B7/00 ,  G05B19/406 ,  G05B23/02

CPC classification number: G05B19/406 ,  G05B23/0218 ,  B81B2201/02 ,  B81B2201/0228 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/01 ,  G05B2219/34351

Abstract: A system for detecting and evaluating environmental quantities and events is formed by a detection and evaluation device and a mobile phone, connected through a wireless connection. The device is enclosed in a containment casing housing a support carrying a plurality of inertial sensors and environmental sensors. A processing unit is coupled to the inertial sensors and to the environmental sensors. A wireless connection unit, is coupled to the processing unit and a wired connection port, is coupled to the processing unit. A programming connector is coupled to the processing unit and is configured to couple to an external programming unit to receive programming instructions of the processing unit. A storage structure is coupled to the processing unit and a power-supply unit supplied power in the detection and evaluation device. The mobile phone stores an application, which enables a basicuse mode, an expert use mode, and an advanced use mode.

公开(公告)号：US20190218093A1

公开(公告)日：2019-07-18

申请号：US16360274

申请日：2019-03-21

Applicant: Versana Micro Inc

Inventor： BISHNU PRASANNA GOGOI

IPC: B81B7/02 ,  H01L27/22 ,  H05K7/02 ,  H01L41/113 ,  H01L27/14 ,  H01L27/16

CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

Abstract: A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.

公开(公告)号：US20180327255A1

公开(公告)日：2018-11-15

申请号：US15683573

申请日：2017-08-22

Applicant: Honeywell International Inc.

Inventor： Daniel Endean ,  Barry A. Roberts

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00

CPC classification number: B81B7/008 ,  B81B7/0045 ,  B81B7/02 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/0019 ,  B81C1/00293 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/0172 ,  B81C2203/0792

Abstract: Systems and methods for multi-sensor integrated sensor devices are provided. In one embodiment, a sensor device comprises: a substrate having a first surface and an opposing second surface; a plurality of sensor cavities recessed into the substrate; a first sensor die sealed within a first sensor cavity of the plurality of sensor cavities at a first atmospheric pressure level; a second sensor die sealed within a second sensor cavity of the plurality of sensor cavities at a second atmospheric pressure level that is a different pressure than the first atmospheric pressure level; a first plurality of direct feedthrough electrical conductors embedded within the substrate coupled to the first sensor die; and a second plurality of direct feedthrough electrical conductors embedded within the substrate coupled to the second sensor die.

公开(公告)号：US20180202808A1

公开(公告)日：2018-07-19

申请号：US15742810

申请日：2016-05-24

Applicant: Robert Bosch GmbH

Inventor： Benjamin Schmidt ,  Andreas Lassl ,  Burkhard Kuhlmann ,  Christian Hoeppner ,  Mirko Hattass ,  Thorsten Balslink

IPC: G01C19/5747 ,  G01C19/5726 ,  G01C19/5762 ,  G01C19/5712 ,  B81B3/00

CPC classification number: G01C19/5747 ,  B81B3/0054 ,  B81B2201/0228 ,  G01C19/5712 ,  G01C19/5726 ,  G01C19/5762

Abstract: A rotation rate sensor having a first structure movable with respect to the substrate, a second structure movable with respect to the substrate and with respect to the first structure, a first drive structure for deflecting the first structure with a motion component parallel to a first axis, and a second drive structure for deflecting the second structure with a motion component parallel to the first axis. The first and second structures are excitable to oscillate in counter-phase, with motion components parallel to the first axis, the first drive structure having a first spring mounted on the substrate to counteract a pivoting of the first structure around an axis parallel to a second axis extending perpendicularly to a principal extension plane, the second drive structure having a second spring mounted on the substrate to counteracts a pivoting of the second structure around a further axis parallel to the second axis.

公开(公告)号：US20180099868A1

公开(公告)日：2018-04-12

申请号：US15830096

申请日：2017-12-04

Applicant: Versana Micro Inc.

Inventor： BISHNU PRASANNA GOGOI

IPC: B81B7/02 ,  H01L27/16 ,  H01L27/22 ,  H01L41/113 ,  H05K7/02 ,  H01L27/14

CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

Abstract: A wearable device is provided having multiple sensors configured to detect and measure different parameters of interest. The wearable device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The wearable device couples a first parameter to be measured directly to the direct sensor. Conversely, the wearable device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the wearable device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors to reduce form factor, cost, complexity, simplify assembly, while increasing performance.

公开(公告)号：US20180009654A1

公开(公告)日：2018-01-11

申请号：US15711890

申请日：2017-09-21

Applicant: InvenSense, Inc.

Inventor： Peter SMEYS ,  Martin LIM

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0278 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00238 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A sensor chip includes a first substrate with a first surface and a second surface including at least one CMOS circuit, a first MEMS substrate with a first surface and a second surface on opposing sides of the first MEMS substrate, a second substrate, a second MEMS substrate, and a third substrate including at least one CMOS circuit. The first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate. The second surface of the first MEMS substrate is attached to the second substrate. The first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects.

公开(公告)号：US09758368B2

公开(公告)日：2017-09-12

申请号：US15050388

申请日：2016-02-22

Applicant: Versana Micro Inc

Inventor： Bishnu Prasanna Gogoi

IPC: B81B7/02 ,  H01L27/14 ,  H01L27/22 ,  H01L27/16 ,  H05K7/02 ,  H01L41/113

CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

Abstract: A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.