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    Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
    65.
    发明授权
    Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor 有权
    在半导体衬底上具有单片集成多传感器装置的运输装置及其方法

    公开(公告)号：US09327965B2

    公开(公告)日：2016-05-03

    申请号：US14207443

    申请日：2014-03-12

    Applicant: Versana Micro Inc.

    Inventor： Bishnu Prasanna Gogoi

    IPC: B81B7/02 ,  H01L27/14 ,  H01L27/22 ,  H01L27/16 ,  H05K7/02 ,  H01L41/113

    CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

    Abstract: A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.

    Abstract translation: 提供了具有多个传感器的运输装置，其被配置为检测和测量不同的感兴趣的参数。 运输装置包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 运输装置将待测量的第一参数直接耦合到直接传感器。 相反，运输装置可间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到运输装置。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。

    MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFOR
    66.
    发明申请
    MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFOR 有权
    半导体基板上的单片集成多传感器器件及其方法

    公开(公告)号：US20140264657A1

    公开(公告)日：2014-09-18

    申请号：US14207419

    申请日：2014-03-12

    Applicant: BISHNU PRASANNA GOGOI

    Inventor： BISHNU PRASANNA GOGOI

    IPC: H01L27/02 ,  H01L29/66 ,  H01L43/12 ,  H01L27/22 ,  H01L27/14 ,  H01L31/18

    CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

    Abstract: An integrated circuit having an indirect sensor and a direct sensor formed on a common semiconductor substrate is disclosed. The direct sensor requires the parameter being measured to be directly applied to the direct sensor. Conversely, the indirect sensor can have the parameter being measured to be indirectly applied to the indirect sensor. The parameter being measured by the direct sensor is different than the parameter being measured by the indirect sensor. In other words, the direct sensor and indirect sensor are of different types. An example of a direct sensor is a pressure sensor. The pressure being measured by the pressure sensor must be applied to the pressure sensor. An example of an indirect sensor is an accelerometer. The rate of change of velocity does not have to be applied directly to the accelerometer. In one embodiment, the direct and indirect sensors are formed using photolithographic techniques.

    Abstract translation: 公开了一种具有间接传感器和形成在公共半导体衬底上的直接传感器的集成电路。 直接传感器需要测量的参数直接应用于直接传感器。 相反，间接传感器可以将被测量的参数间接地应用于间接传感器。 由直接传感器测量的参数与由间接传感器测量的参数不同。 换句话说，直接传感器和间接传感器是不同的类型。 直接传感器的一个例子是压力传感器。 由压力传感器测量的压力必须应用于压力传感器。 间接传感器的一个例子是加速度计。 速度变化率不必直接应用于加速度计。 在一个实施例中，使用光刻技术形成直接和间接传感器。

    MEMS DEVICE AND METHOD OF MAKING SAME
    69.
    发明申请
    MEMS DEVICE AND METHOD OF MAKING SAME 审中-公开
    MEMS器件及其制造方法

    公开(公告)号：US20090212386A1

    公开(公告)日：2009-08-27

    申请号：US12034905

    申请日：2008-02-21

    Applicant: Jeff A. Ridley ,  Robert Higashi ,  James F. Detry

    Inventor： Jeff A. Ridley ,  Robert Higashi ,  James F. Detry

    IPC: H01L31/058 ,  H01L21/00

    CPC classification number: B81B7/0087 ,  B81B2201/0242 ,  B81B2201/0278

    Abstract: A MEMS device includes a P-N device formed on a silicon pin, which is connected to a silicon sub-assembly, and where the P-N device is formed on a silicon substrate that is used to make the silicon pin before it is embedded into a first glass wafer. In one embodiment, forming the P-N device includes selectively diffusing an impurity into the silicon pin and configuring the P-N device to operate as a temperature sensor.

    Abstract translation: MEMS器件包括形成在硅引脚上的PN器件，其连接到硅子组件，并且其中PN器件形成在硅衬底上，硅衬底在其被嵌入第一玻璃中之前用于制造硅销 晶圆。 在一个实施例中，形成P-N器件包括选择性地将杂质扩散到硅引脚中并且将P-N器件配置为用作温度传感器。

    PACKAGE COMPRISING AN ELECTRICAL CIRCUIT
    70.
    发明申请
    PACKAGE COMPRISING AN ELECTRICAL CIRCUIT 有权
    包装电路的包装

    公开(公告)号：US20090102003A1

    公开(公告)日：2009-04-23

    申请号：US12298320

    申请日：2007-04-24

    Applicant: Holger Vogt ,  Jochen Bauer

    Inventor： Holger Vogt ,  Jochen Bauer

    IPC: H01L21/50 ,  H01L31/02

    CPC classification number: B81C1/00269 ,  B81B2201/0278 ,  B81C2203/019 ,  G01J5/02 ,  G01J5/023 ,  G01J5/04 ,  G01J5/045 ,  G01J5/046 ,  G01J5/0875 ,  G01J5/20 ,  H01L27/14618 ,  H01L27/14649 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A package including an electrical circuit may be produced in a more efficient manner when on a substrate including a plurality of electrical circuits the circuits are tested for their functionality and when the functional circuits are connected, by means of a frame enclosing the circuit on the surface of the substrate, to a second substrate whose surface area is smaller than that of the first substrate. The substrates are connected, by means of a second frame, which is adapted to the first frame and is located on the surface of the second substrate, such that the first and second frames lie one on top of the other. Subsequently, the functional packaged circuits may be singulated in a technologically simple manner.

    Abstract translation: 当在包括多个电路的基板的基板上，可以以更有效的方式制造包括电路的封装，这些电路的功能被测试，并且当功能电路连接时，通过在表面上包围电路的框架 的第二基板，其表面积小于第一基板的表面积。 基板通过第二框架连接，第二框架适于第一框架并且位于第二基板的表面上，使得第一和第二框架位于另一框架的顶部。 随后，功能封装电路可以以技术上简单的方式被分割。

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