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公开(公告)号：US20240083742A1
公开(公告)日：2024-03-14
申请号：US18510628
申请日：2023-11-15
Inventor： Ting-Li YANG , Kai-Di WU , Ming-Da CHENG , Wen-Hsiung LU , Cheng Jen LIN , Chin Wei KANG
CPC classification number: B81B3/0081 , B81C1/0069 , B81B2203/0127 , B81B2203/019 , B81B2203/0353 , B81B2207/015 , B81C2201/013 , B81C2201/0181 , B81C2203/032 , B81C2203/0735
Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.
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公开(公告)号：US11905168B2
公开(公告)日：2024-02-20
申请号：US17072863
申请日：2020-10-16
Applicant: Microjet Technology Co., Ltd.
Inventor： Hao-Jan Mou , Hsien-Chung Tai , Lin-Huei Fang , Yung-Lung Han , Chi-Feng Huang , Chang-Yen Tsai , Wei-Ming Lee
IPC: B81C1/00 , F04B43/04 , H10N30/067 , H10N30/081 , H10N30/082 , F16K99/00
CPC classification number: B81C1/00182 , B81C1/00119 , B81C1/00166 , F04B43/046 , H10N30/067 , H10N30/081 , H10N30/082 , B81C2201/013 , B81C2201/0156 , F16K99/0048 , F16K2099/0074 , F16K2099/0094
Abstract: A manufacturing method of miniature fluid actuator is disclosed and includes the following steps. A flow-channel main body manufactured by a CMOS process is provided, and an actuating unit is formed by a deposition process, a photolithography process and an etching process. Then, at least one flow channel is formed by etching, and a vibration layer and a central through hole are formed by a photolithography process and an etching process. After that, an orifice layer is provided to form at least one outflow opening by an etching process, and then a chamber is formed by rolling a dry film material on the orifice layer. Finally, the orifice layer and the flow-channel main body are flip-chip aligned and hot-pressed, and then the miniature fluid actuator is obtained by a flip-chip alignment process and a hot pressing process.
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公开(公告)号：US20240024917A1
公开(公告)日：2024-01-25
申请号：US18376598
申请日：2023-10-04
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Jianwei Liu
CPC classification number: B06B1/0292 , B81B3/0021 , B81C1/00158 , B81B2201/0271 , B81B2203/0127 , B81C2203/0735 , B81B2207/015 , B81B2207/07 , B81C2201/013 , B81C2201/0125 , B81C2203/036 , B81B2203/04
Abstract: An ultrasound transducer device includes an electrode, a membrane separated from the electrode by a cavity between the membrane and the electrode, a patterned membrane support layer that defines a size and shape of the cavity and that is disposed between the electrode and the membrane, and vias that electrically connect the electrode to a substrate. The vias are disposed in the ultrasound transducer device such that less than 50% of the vias overlap with a support surface of the patterned membrane support layer, in a plan view.
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64.发明授权公开(公告)号：US11788912B2
公开(公告)日：2023-10-17
申请号：US16972588
申请日：2019-06-28
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Peter Schmollngruber
CPC classification number: G01L9/0048 , B81B3/0021 , B81C1/00182 , G01L9/005 , G01L9/0073 , G01L19/145 , B81B2201/0264 , B81B2203/0118 , B81B2203/0127 , B81B2203/0163 , B81B2203/0307 , B81B2203/04 , B81C2201/013 , B81C2201/0105
Abstract: A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device is equipped with a sensor substrate; a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between; and a plate-shaped electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm. The first diaphragm and the second diaphragm are designed in such a way that they are deformable toward one another when acted on by an external pressure.
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公开(公告)号：US20230312334A1
公开(公告)日：2023-10-05
申请号：US18124788
申请日：2023-03-22
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Siarhei Dmitrievich Barsukou
CPC classification number: B81B3/0021 , H10N30/30 , B81C1/0015 , H10N30/872 , H04R17/02 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , H04R2201/003 , B81C2201/0178 , B81C2201/013
Abstract: A piezoelectric microelectromechanical systems microphone is provided comprising a sensor, an anchor region at which the sensor is supported by a substrate, a first region of the sensor adjacent to the anchor region, the first region having at least one piezoelectric layer and at least one electrode, and a second region of the sensor, the second region being adjacent to the first region, having at least one piezoelectric layer and at least one electrode, and having a thickness less than the thickness of the first region. A method for manufacturing a piezoelectric microelectromechanical systems microphone is also provided.
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Patent Agency Ranking
公开(公告)号：US20230211345A1
公开(公告)日：2023-07-06
申请号：US17684719
申请日：2022-03-02
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Wei LI , Baiquan LIN , Kaidi ZHANG , Yunfei BAI , Ping SU , Kerui XI , Zhenyu JIA
CPC classification number: B01L3/502784 , B81B3/0089 , B81C1/00714 , B01L2200/12 , B01L2300/161 , B01L2300/0819 , B01L2300/1805 , B01L2400/0415 , B81B2201/057 , B81B2203/0353 , B81C2201/013 , B81C2201/053 , B81C2201/0198
Abstract: A microfluidic chip and a fabrication method of the microfluidic chip are provided. The microfluidic chip includes an array substrate, and a hydrophobic layer disposed on a side of the array substrate. The hydrophobic layer includes at least one through-hole, and a through-hole of the at least one through-hole penetrates through the hydrophobic layer along a direction perpendicular to a plane of the array substrate. The microfluidic chip also includes at least one hydrophilic structure. A hydrophilic structure of the at least one hydrophilic structure is disposed in the through-hole.
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公开(公告)号：US11678133B2
公开(公告)日：2023-06-13
申请号：US17020153
申请日：2020-09-14
Inventor： Jung-Huei Peng , Chia-Hua Chu , Chun-Wen Cheng , Chin-Yi Cho , Li-Min Hung , Yao-Te Huang
CPC classification number: H04R31/003 , B81C1/00158 , H04R31/006 , B81C2201/013 , B81C2201/0125 , B81C2201/053 , B81C2203/036 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2307/027
Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.
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公开(公告)号：US11667522B2
公开(公告)日：2023-06-06
申请号：US17109405
申请日：2020-12-02
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Wen-Chuan Tai , Fan Hu
CPC classification number: B81B7/02 , B81C1/00047 , B81C1/00333 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2203/0315 , B81C2201/013 , B81C2201/0125 , B81C2203/0109
Abstract: The present disclosure relates to a MEMS package having different trench depths, and a method of fabricating the MEMS package. In some embodiments, a cap substrate is bonded to a device substrate. The cap substrate comprises a cap substrate bonded to a device substrate. The cap substrate comprises a MEMS trench, a scribe trench, and an edge trench respectively recessed from at a front-side surface of the cap substrate. A stopper is disposed within the MEMS trench and raised from a bottom surface of the MEMS trench.
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公开(公告)号：US20190098424A1
公开(公告)日：2019-03-28
申请号：US16200072
申请日：2018-11-26
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Stefan Barzen
CPC classification number: H04R31/003 , B81B3/0021 , B81B3/0086 , B81B2201/0221 , B81B2201/0257 , B81B2203/0127 , B81B2203/04 , B81C1/00158 , B81C2201/013 , H04R1/08 , H04R19/005 , H04R31/006 , H04R2201/003
Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.
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公开(公告)号：US10081540B2
公开(公告)日：2018-09-25
申请号：US15807715
申请日：2017-11-09
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Anthony K. Stamper , John G. Twombly
CPC classification number: B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.
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