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    Printed circuit board module
    61.
    发明授权
    Printed circuit board module 有权
    印刷电路板模块

    公开(公告)号：US08251712B2

    公开(公告)日：2012-08-28

    申请号：US12979369

    申请日：2010-12-28

    Applicant: Chien-Pang Cheng

    Inventor： Chien-Pang Cheng

    IPC: H01R12/00

    CPC classification number: H01R12/7082 ,  H01R12/721 ,  H01R12/73 ,  H05K1/144 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2036

    Abstract: A PCB module includes a first rigid PCB having a first edge connector, a second rigid PCB having a second edge connector, and a connecting mechanism. The connecting mechanism includes a flexible connecting board, an elastic member, and a fixing member. The flexible connecting has a number of connecting circuit traces isolated from each other. The flexible connecting board is bent in such a manner that a first end portion is in contact with the first edge connector, and a second end portion is in contact with the second edge connector. Thus, the first edge connector is electrically connected with the second edge connector by the traces. The elastic member is compressed between the end portions of the flexible connecting board. The fixing member is configured to fix the first rigid PCB to the second rigid PCB and compress the elastic member.

    Abstract translation: PCB模块包括具有第一边缘连接器的第一刚性PCB，具有第二边缘连接器的第二刚性PCB以及连接机构。 连接机构包括柔性连接板，弹性部件和固定部件。 柔性连接具有彼此隔离的多个连接电路迹线。 柔性连接板弯曲成使得第一端部与第一边缘连接器接触，并且第二端部与第二边缘连接器接触。 因此，第一边缘连接器通过迹线与第二边缘连接器电连接。 弹性构件在柔性连接板的端部之间被压缩。 固定构件被构造成将第一刚性PCB固定到第二刚性PCB并压缩弹性构件。

    COMPOSITE POLYMER-METAL ELECTRICAL CONTACTS
    63.
    发明申请
    COMPOSITE POLYMER-METAL ELECTRICAL CONTACTS 有权
    复合聚合物金属电气联系

    公开(公告)号：US20120043119A1

    公开(公告)日：2012-02-23

    申请号：US13318369

    申请日：2010-05-27

    Applicant: James Rathburn

    Inventor： James Rathburn

    IPC: H05K1/03 ,  H05K1/02 ,  H01R43/00 ,  H05K1/09

    CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01R12/52 ,  H05K2201/0133 ,  H05K2201/0311 ,  Y10T29/49224 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base layer. Conductive plating is applied to the metalized layer to create an array of conductive paths. The resilient polymeric base layer, the metalized layer, and the conductive plating have an aggregate spring constant sufficient to maintain distal portions of the contact members in a cantilevered configuration and to form a stable electrical connection between the distal portions and the first circuit member solely by compressive engagement.

    Abstract translation: 一组复合聚合物 - 金属接触构件，适于与第一电路构件形成无焊料电连接。 接触构件包括弹性聚合物基底层和印刷在基底层的选定部分上的金属化迹线阵列。 将导电电镀施加到金属化层以形成导电路径阵列。 弹性聚合物基层，金属化层和导电镀层具有足够的聚集弹簧常数，以使接触构件的远侧部分保持悬臂结构，并且仅在远侧部分和第一电路部件之间形成稳定的电连接 压缩接合。

    FLEXIBLE PRINTED CIRCUIT BOARD WITH WATERPROOF STRUCTURE
    64.
    发明申请
    FLEXIBLE PRINTED CIRCUIT BOARD WITH WATERPROOF STRUCTURE 有权
    柔性印刷电路板，防水结构

    公开(公告)号：US20120018196A1

    公开(公告)日：2012-01-26

    申请号：US12967488

    申请日：2010-12-14

    Applicant: GWUN-JIN LIN ,  KUO-FU SU

    Inventor： GWUN-JIN LIN ,  KUO-FU SU

    IPC: H05K1/02 ,  H05K1/09

    CPC classification number: H05K1/0253 ,  H05K5/069 ,  H05K2201/0133 ,  H05K2203/1147

    Abstract: Disclosed is a flexible printed circuit board with waterproof structure, including a flexible substrate that has a first surface on which a first metal layer is bonded. The first metal layer has an upper surface forming a covered area and at least one mounting zone and the metal layer forms on a surface thereof within the mounting zone a bonding improved waterproof structure. A first insulation layer is formed on the covered area of the upper surface of the first metal layer in such a way not to cover the mounting zone of the first metal so as to expose the mounting zone. A water resistant member is securely mounted to the mounting zone of the first metal layer. The flexible substrate also has a second surface to which a second metal layer and a second insulation layer are mounted. The second metal layer also forms a mounting zone, which is not covered by the second insulation layer so as to expose for mounting the water resistant member. The metal surface inside the mounting zone also forms bonding improved waterproof structure. The waterproof structure improves the bonding strength between the flexible printed circuit board and the water resistant member through proper arrangement and selection of shape, size, and distribution density of holes that are defined in the exposed metal surface. Alternatively, the holes can be made completely through the metal layer in order to also feature control of impedance for high frequency signals.

    Abstract translation: 公开了一种具有防水结构的柔性印刷电路板，包括柔性基板，该柔性基板具有第一金属层与第一金属层接合的第一表面。 第一金属层具有形成覆盖区域的上表面和至少一个安装区域，并且金属层在安装区域内的表面上形成结合改进的防水结构。 第一绝缘层形成在第一金属层的上表面的覆盖区域上，不会覆盖第一金属的安装区域，以露出安装区域。 防水构件牢固地安装到第一金属层的安装区域。 柔性基板还具有安装第二金属层和第二绝缘层的第二表面。 第二金属层也形成安装区域，其不被第二绝缘层覆盖，以暴露以安装防水构件。 安装区内的金属表面也形成粘结改进的防水结构。 防水结构通过适当地布置和选择在暴露的金属表面中限定的孔的形状，尺寸和分布密度来提高柔性印刷电路板和防水构件之间的结合强度。 或者，可以通过金属层完全地形成孔，以便还可以控制高频信号的阻抗。

    CHIP COMPONENT MOUNTING STRUCTURE, CHIP COMPONENT MOUNTING METHOD AND LIQUID CRYSTAL DISPLAY DEVICE
    65.
    发明申请
    CHIP COMPONENT MOUNTING STRUCTURE, CHIP COMPONENT MOUNTING METHOD AND LIQUID CRYSTAL DISPLAY DEVICE 有权
    芯片组件安装结构，芯片组件安装方法和液晶显示设备

    公开(公告)号：US20120008064A1

    公开(公告)日：2012-01-12

    申请号：US13257679

    申请日：2009-11-04

    Applicant: Hiroki Miyazaki

    Inventor： Hiroki Miyazaki

    IPC: G02F1/1335 ,  H05K1/16 ,  H05K3/30 ,  H05K7/00

    CPC classification number: H05K3/321 ,  H01L2224/27334 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83851 ,  H01L2224/97 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2224/83

    Abstract: Provided are a chip component mounting structure and a chip component mounting method, wherein when a plurality of chip components having different heights are mounted on a substrate via an anisotropic conductive film, position gaps which occur when the chip components are pressure-bonded to the substrate are prevented, and the chip components can be accurately mounted to the substrate at target positions; and a liquid crystal display device provided with the substrate. In the chip component mounting structure, a position fixing resin (4) for maintaining the orientation of chip components (2) which are pressure-bonded to a substrate (1) via an anisotropic conductive film (7) is provided. In the chip component mounting method, after the position fixing resin (4) for maintaining the orientation of the chip components (2) which are mounted to the substrate (1) via the anisotropic conductive film (7) is applied to the substrate (1) and cured, the chip components (2) are heated at a predetermined temperature and pressed at a predetermined pressure via an elastic sheet (5) provided on the chip components (2) and, then, pressure-bond to the substrate (1) together. The liquid crystal display is provided with such a substarate.

    Abstract translation: 提供了一种芯片部件安装结构和芯片部件安装方法，其中当通过各向异性导电膜将多个具有不同高度的芯片部件安装在基板上时，当芯片部件被压接在基板上时发生位置间隙 并且能够将芯片部件精确地安装在基板的目标位置; 以及设置有该基板的液晶显示装置。 在芯片部件安装结构中，设置有用于通过各向异性导电膜（7）将用于保持与基板（1）压接的芯片部件（2）的取向保持的定位树脂（4）。 在芯片部件安装方法中，在用于将经由各向异性导电膜（7）安装到基板（1）的芯片部件（2）的取向的位置固定树脂（4）施加到基板（1） ）并固化，芯片部件（2）被加热到预定温度，并通过设置在芯片部件（2）上的弹性片（5）以预定压力压制，然后压接到基板（1） 一起。 液晶显示器设置有这样的基底。

    Printed circuit board reinforcement structure and integrated circuit package using the same
    66.
    发明授权
    Printed circuit board reinforcement structure and integrated circuit package using the same 有权
    印刷电路板加固结构和集成电路封装采用相同

    公开(公告)号：US08059384B2

    公开(公告)日：2011-11-15

    申请号：US12183463

    申请日：2008-07-31

    Applicant: Se Ho Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

    Inventor： Se Ho Park ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

    IPC: H05K1/03 ,  H05K1/16

    CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/0064 ,  H05K2201/0133 ,  H05K2203/063

    Abstract: A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

    Abstract translation: 一种用于印刷电路板的印刷电路板加强结构，其接收多个表面安装装置，以及使用该电路板的集成电路封装。 该结构包括具有一个或多个开口的硬层，所述开口形成在与一个或多个厚度超过预定厚度的一个或多个表面安装装置相对应的区域处; 以及粘结到硬质层的一侧的软层，使得软层可以容纳表面安装装置的突起。 该结构通过将加强结构施加到薄的印刷电路板上而大大减小了封装的尺寸，从而防止了印刷电路板的缺陷，例如变形，断裂等，从而增强了薄的印刷电路板的刚度（机械强度） 印刷电路板。

    Semiconductor module
    67.
    发明授权
    Semiconductor module 有权
    半导体模块

    公开(公告)号：US08053889B2

    公开(公告)日：2011-11-08

    申请号：US12457522

    申请日：2009-06-15

    Applicant: Seong-chan Han ,  Dong-woo Shin ,  Hyun-jong Oh ,  Nam-yong Oh

    Inventor： Seong-chan Han ,  Dong-woo Shin ,  Hyun-jong Oh ,  Nam-yong Oh

    IPC: H01L23/34 ,  H05K7/10

    CPC classification number: H05K1/0271 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10734 ,  H01L2924/00

    Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

    Abstract translation: 提供了一种半导体模块，其包括在模块主体的暴露表面上的模块体和减震构件。 模块体可以包括在衬底上的至少一个半导体封装，并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。 根据示例实施例，模块主体还可以在至少一个半导体封装上包括传热构件，并且模块主体的暴露表面可以包括传热构件的暴露表面。

    ELECTRONIC PART, ELECTRONIC MEMBER CONNECTION METHOD, AND CIRCUIT CONNECTION MEMBER
    68.
    发明申请
    ELECTRONIC PART, ELECTRONIC MEMBER CONNECTION METHOD, AND CIRCUIT CONNECTION MEMBER 有权
    电子部件，电子部件连接方法和电路连接部件

    公开(公告)号：US20110266037A1

    公开(公告)日：2011-11-03

    申请号：US13094846

    申请日：2011-04-27

    Applicant: Kazuo INOUE ,  Ryouji SETAKA ,  Tsuyoshi YAMAKOSHI

    Inventor： Kazuo INOUE ,  Ryouji SETAKA ,  Tsuyoshi YAMAKOSHI

    IPC: H05K1/02 ,  H05K3/00

    CPC classification number: H05K3/325 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/10378 ,  Y10T29/49124

    Abstract: An electronic part includes a first electronic member having a wiring side. An anisotropic conductive sheet has a first side and a second side opposite to the first side and is disposed on the first electronic member so that the wiring side contacts the first side. A second electronic member has a third side and a fourth side opposite to the third side and is disposed on the anisotropic conductive sheet so that the second side contacts the third side. The second electronic member is electrically connected to the first electronic member through the anisotropic conductive sheet. An elastic body has a fifth side and a sixth side opposite to the fifth side and is disposed on the second electronic member so that the fourth side contacts the fifth side. A pressing member is disposed on the sixth side of the elastic body.

    Abstract translation: 电子部件包括具有布线侧的第一电子部件。 各向异性导电片具有与第一侧相对的第一侧和第二侧，并且布置在第一电子部件上，使得布线侧接触第一侧。 第二电子部件具有与第三面相反的第三面和第四面，并设置在各向异性导电片上，使得第二面接触第三面。 第二电子部件通过各向异性导电片与第一电子部件电连接。 弹性体具有与第五面相反的第五面和第六面，并且设置在第二电子部件上，使得第四面接触第五面。 按压构件设置在弹性体的第六面上。

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