公开(公告)号：US5950908A

公开(公告)日：1999-09-14

申请号：US768395

申请日：1996-12-18

Applicant: Junji Fujino ,  Jitsuho Hirota ,  Goro Izuta ,  Akira Adachi

Inventor： Junji Fujino ,  Jitsuho Hirota ,  Goro Izuta ,  Akira Adachi

IPC: H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/12 ,  H05K3/34 ,  B23K1/00 ,  B23K3/00

CPC classification number: H05K3/3484 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13316 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19043 ,  H05K2201/0272 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2201/10992 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K3/1216 ,  H05K3/3436 ,  H05K3/3463

Abstract: A method of depositing solder paste includes the steps of: superimposing a masking member having a plurality of through-holes and a supporting member on each other so that the supporting member covers the plurality of through-holes; filling cavity portions formed by the plurality of through-holes and the supporting member with solder paste; disposing an LSI chip and the masking member so that electrodes and the cavity portions are superimposed on each other respectively; and heating the solder paste so as to make the solder paste deposit on the electrodes.

Abstract translation: 一种沉积焊膏的方法包括以下步骤：将具有多个通孔和支撑构件的掩蔽构件彼此重叠，使得支撑构件覆盖多个通孔; 由多个通孔形成的填充腔部分和具有焊膏的支撑部件; 设置LSI芯片和掩蔽部件，使得电极和空腔部分分别重叠; 并加热焊膏以使焊膏沉积在电极上。

公开(公告)号：US5872051A

公开(公告)日：1999-02-16

申请号：US510401

申请日：1995-08-02

Applicant: Kenneth Michael Fallon ,  Christian Robert Le Coz ,  Mark Vincent Pierson

Inventor： Kenneth Michael Fallon ,  Christian Robert Le Coz ,  Mark Vincent Pierson

IPC: B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L21/288 ,  H01L21/58

CPC classification number: H01L24/12 ,  B23K1/0016 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3484 ,  B23K2201/40 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/742 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3463

Abstract: A process within substrate is provided with vias communicating with surface contacts or bumps. Joining material paste is forced through holes in a screen onto an area array of the contacts on the substrate then the screen is biased against the substrate as the paste is heated and cooled to transfer the joining material onto the contacts. Alternately, joining material paste is forced into the screen and then a substrate is placed onto the screen with an area array of bump contacts of the substrate in contact with the solder paste, and then the paste is heated and cooled to transfer the material onto the bumps. The joining material may be a solder paste, conductive adhesive paste, or transient liquid bond paste. The substrate may be a semiconductor chip substrate, flexible or rigid organic substrate, or a metal substrate coated to form a dielectric surface. Also, the substrate may be a computer chip, chip carrier substrate or a circuit board substrate. The process may be used to produce flip chips, ball grid array modules, column grid array modules, circuit boards, and attachment structures of the preceding components including information handling systems.

Abstract translation: 衬底内的工艺设有与表面接触或凸块连通的通孔。 连接材料糊料被迫通过筛网上的孔到基板上的触点的区域阵列上，然后当膏被加热和冷却以将接合材料转移到触点上时，屏幕被偏压到基板上。 或者，将接合材料糊剂强制进入筛网，然后将基板放置在具有与焊膏接触的基板的凸起接触的区域阵列的屏幕上，然后将该浆料加热并冷却以将材料转移到 颠簸 接合材料可以是焊膏，导电粘合剂糊或瞬态液体粘合膏。 衬底可以是半导体芯片衬底，柔性或刚性有机衬底或涂覆以形成电介质表面的金属衬底。 此外，基板可以是计算机芯片，芯片载体基板或电路板基板。 该过程可用于制造包括信息处理系统的前述组件的倒装芯片，球栅阵列模块，列网格阵列模块，电路板和附接结构。

公开(公告)号：US5733598A

公开(公告)日：1998-03-31

申请号：US815993

申请日：1997-03-10

Applicant: Naoki Sera ,  Toshiharu Fukui ,  Kouji Tanabe ,  Futoshi Matsui

Inventor： Naoki Sera ,  Toshiharu Fukui ,  Kouji Tanabe ,  Futoshi Matsui

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  B05D5/12

CPC classification number: H05K3/363 ,  H05K1/189 ,  H05K3/0064 ,  H05K3/245 ,  H05K3/28 ,  H05K1/0218 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K1/181 ,  H05K2201/035 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/10636 ,  H05K2201/2009 ,  H05K2203/166 ,  H05K3/3447 ,  H05K3/366 ,  H05K3/386 ,  H05K3/428 ,  H05K3/4685 ,  Y02P70/611

Abstract: A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

Abstract translation: 柔性布线板包括形成在绝缘膜上的印刷导电电路层，形成在印刷导电电路层上的金属层和形成在金属层上的绝缘层。 制造柔性布线板的方法包括以下步骤：通过使用导电浆丝网印刷布线图案来形成导电电路层，烘烤印刷布线图案，以及通过电镀方法在印刷导电电路层上形成金属层。

公开(公告)号：US5717247A

公开(公告)日：1998-02-10

申请号：US751930

申请日：1996-11-05

Applicant: Wei H. Koh ,  Connie S. McCausland

Inventor： Wei H. Koh ,  Connie S. McCausland

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L23/48

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H05K3/4061 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/035 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2203/1476 ,  H05K3/0094

Abstract: A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.

Abstract translation: 一种用于在非导电衬底中形成导电通孔的方法，其中具有形成在其中间两侧的通孔。 该方法采用以下步骤：将金膏施加到通孔，以提供通过其的导电性; 并且当在基板上存在薄导电膜并且在基板上不存在薄导电膜时完全烧制金膏时，在烧结金膏时。 当在基板上存在薄膜时，在烧制金膏时，可以防止薄导电膜的劣化。 金膏的后续处理确保了其完整性和可靠性。 因此，与当代薄膜通孔相比，金膏提供增强的导电性和改进的可靠性。

公开(公告)号：US5562973A

公开(公告)日：1996-10-08

申请号：US473773

申请日：1995-06-06

Applicant: Takashi Nagasaka ,  Yuji Otani ,  Mitsuhiro Saitou

Inventor： Takashi Nagasaka ,  Yuji Otani ,  Mitsuhiro Saitou

IPC: H05K1/09 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00

CPC classification number: H01L23/49883 ,  H01L21/4867 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/096 ,  H05K3/248 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4667 ,  Y10S428/901 ,  Y10T428/12507 ,  Y10T428/12514 ,  Y10T428/1284 ,  Y10T428/12896 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multi-layer is a non-copper metal having a melting point higher than a temperature at which the ceramic multi-layer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag--Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.

Abstract translation: 在陶瓷多层布线基板中，表面导体层由铜基材料构成，陶瓷多层中的内导体是熔点高于陶瓷多层布线基板的温度的非铜金属 通常Ag被烧毁。 Cu和Ag在烧制Cu的表面导体层时形成共晶晶体。 这可以通过用与表面布线层和内部导体的材料不同的Ag-Pd或金属连接表面导体层和内部导体，并且不与表面布线的材料形成共晶体 在表面布线层被烧制的温度下。

公开(公告)号：US5552107A

公开(公告)日：1996-09-03

申请号：US437494

申请日：1995-05-09

Applicant: Jon A. Casey ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Jonathan H. Harris ,  Lester W. Herron ,  Gregory M. Johnson ,  Niranjan M. Patel ,  Andrew M. Reitter ,  Subhash L. Shinde ,  Rao V. Vallabhaneni ,  Robert A. Youngman

Inventor： Jon A. Casey ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Jonathan H. Harris ,  Lester W. Herron ,  Gregory M. Johnson ,  Niranjan M. Patel ,  Andrew M. Reitter ,  Subhash L. Shinde ,  Rao V. Vallabhaneni ,  Robert A. Youngman

IPC: B32B18/00 ,  B22F7/02 ,  C04B35/581 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

CPC classification number: C04B41/009 ,  B22F7/02 ,  C04B41/5133 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3731 ,  H05K3/4061 ,  B22F2998/00 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/035 ,  H05K2201/09981 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/12021 ,  Y10T428/12028 ,  Y10T428/12056 ,  Y10T428/31678

Abstract: Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.

Abstract translation: 公开了一种具有分级冶金的氮化铝体及其制造方法。 氮化铝体具有至少一个通孔，并且包括与氮化铝体直接接触的第一层和与第一层直接接触并完全封装的第二层。 第一层包括30至60体积％的氮化铝和40至70体积％的钨和/或钼，而第二层包括90至100体积％的钨和/或钼和0至10体积％的氮化铝。

公开(公告)号：US5118027A

公开(公告)日：1992-06-02

申请号：US690731

申请日：1991-04-24

Applicant: Carol Braun ,  George C. Correia ,  Sheila Konecke-Lease ,  Richard W. Cummings

Inventor： Carol Braun ,  George C. Correia ,  Sheila Konecke-Lease ,  Richard W. Cummings

IPC: H01L21/60 ,  B23K1/20 ,  H01L21/00 ,  H01L21/48 ,  H05K3/34

CPC classification number: H01L21/67138 ,  B23K1/20 ,  H01L21/4853 ,  H05K3/3478 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2924/01322 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/082 ,  H05K3/3484

Abstract: A process for fabricating a plurality of solder joints from a low melting point solder paste and high melting point solder balls is described. An abbreviated process flow is as follows: First, the solder balls are placed into cavities in an alignment boat, a vacuum is initiated to hold the boat and solder balls in place. Second, an amount of solder paste is applied directly onto the solder balls in the boat. Third, an alignment plate is placed over the alignment boat to provide a means of roughly aligning the solder ball/solder paste combination to the substrate. Fourth, the substrate is placed through the alignment plate on top of the solder balls in the boat. Pressure is applied to wet the solder paste to the conductive pads on the substrate. Finally, the substrate and alignment boat assembly is processed through a furnace for solder paste reflow. No expensive alignment tools are necessary as the substrate can at least partially realign itself to the array of solder balls during reflow because of the surface tension exerted by the molten solder paste as it wets the entirety of each conductive pad on the substrate.

Abstract translation: 描述了从低熔点焊膏和高熔点焊球制造多个焊点的工艺。 缩短的工艺流程如下：首先，将焊球放置在对准船的空腔中，开始真空以将船和焊球保持在适当位置。 第二，将一定量的焊膏直接施加到船上的焊球上。 第三，将对准板放置在对准船上方，以提供将焊球/焊膏组合大致对准到基板的装置。 第四，基板通过对准板放置在船中的焊球上。 施加压力以将焊膏润湿到衬底上的导电焊盘。 最后，通过用于焊膏回流的炉子处理衬底和对准舟组件。 不需要昂贵的对准工具，因为衬底可以在回流期间至少部分地将其自身重新排列到焊球阵列，因为当熔融焊膏浸润衬底上的每个导电焊盘的整体时施加的表面张力。

公开(公告)号：US4991284A

公开(公告)日：1991-02-12

申请号：US319903

申请日：1989-03-06

Applicant: Shiro Ezaki

Inventor： Shiro Ezaki

IPC: H01C17/06 ,  H01C17/28 ,  H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K1/167 ,  H01C17/281 ,  H01L21/705 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K3/4685 ,  Y10T29/49099 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of manufacturing and monitoring the manufacture of a thick film circuit board device. The method includes the steps of forming a resistive layer in a prescribed pattern on an insulative base board, forming a first conductive layer on the insulative base board adjacent to the resistive layer with a gap of predetermined width therebetween and forming a second conductive layer in the gap and overlapping a portion of the resistive layer and the first conductive layer for establishing electrical contact between the resistive layer and the first conductive layer.

Abstract translation: 一种制造和监测厚膜电路板装置的制造方法。 该方法包括以下步骤：在绝缘基板上形成规定图案的电阻层，在与绝缘基板相邻的绝缘基板上形成第一导电层，其间具有预定宽度的间隙，并在其中形成第二导电层 间隙并且与电阻层和第一导电层的一部分重叠，以在电阻层和第一导电层之间建立电接触。

公开(公告)号：US4859805A

公开(公告)日：1989-08-22

申请号：US194841

申请日：1988-03-29

Applicant: Shin Kawakami ,  Satoshi Haruyama ,  Hirotaka Okonogi ,  Katutomo Nikaido ,  Norito Mukai

Inventor： Shin Kawakami ,  Satoshi Haruyama ,  Hirotaka Okonogi ,  Katutomo Nikaido ,  Norito Mukai

IPC: H05K1/02 ,  H05K3/24 ,  H05K3/28 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H05K2201/0209 ,  H05K2201/035 ,  H05K2201/0989 ,  H05K3/245 ,  H05K3/28

Abstract: A printed circuit board comprises a base plate and a circuit conductor formed on at least one of the opposed surfaces of the base plate. A heat-radiating film is formed on at least a portion of the surface of the circuit conductor, and an insulating film is formed over the exposed surfaces of the heat-radiating film and the circuit conductor. At least one opening is formed in the insulating film, and the opening overlies the heat-radiating film thereby directly exposing the heat-radiating film to ambient atmosphere so as to promote dissipation of heat from the circuit conductor during use of the printed circuit board. The opening in the insulating film may be in the form of a slot or may comprise a pattern of circular or oval openings. The heat-radiating film may be copper or nickel paste, or non-organic material such as aluminum oxide.

公开(公告)号：US4833039A

公开(公告)日：1989-05-23

申请号：US125091

申请日：1987-11-25

Applicant: Stephan P. Mitoff ,  Richard J. Charles ,  Wayne D. Pasco

Inventor： Stephan P. Mitoff ,  Richard J. Charles ,  Wayne D. Pasco

IPC: C04B41/52 ,  C04B41/89 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K3/4061 ,  C04B41/52 ,  C04B41/89 ,  H05K3/246 ,  H05K3/247 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0116 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/1147 ,  H05K2203/128 ,  Y10T428/12007 ,  Y10T428/12056 ,  Y10T428/12118

Abstract: A process for producing an hermetic feedthrough in a ceramic substrate by providing a sheet of liquid phase sinterable ceramic composition having a feedthrough hole, filling the feedthrough hole with refractory metal metallization material, firing the resulting structure to produce a sintered substrate and adherent metallization wherein the metallization is comprised of continuous phases of refractory metal and glass, contacting the refractory metal with electrically conductive intrusion metal and heating the resulting structure to a temperature at which the glassy phase is fluid, the refractory metal is solid, and the intrusion metal is liquid whereby the liquid metal preferentially wets the refractory metal, migrates into the metallization displacing glass and, upon subsequent solidification, partially or wholly occupies the volume space originally containing the continuous glass phase.

Abstract translation: 一种通过提供一种具有馈通孔的液相可烧结陶瓷组合物制成密封馈通的方法，用耐火金属金属化材料填充馈通孔，烧制所得结构以产生烧结基底和粘附金属化，其中， 金属化由耐火金属和玻璃的连续相组成，使难熔金属与导电侵入金属接触，并将所得结构加热至玻璃相为流体的温度，难熔金属为固体，侵入金属为液体，由此 液体金属优先润湿难熔金属，迁移到金属化位移玻璃中，并且在随后的固化时，部分或全部占据原始包含连续玻璃相的体积空间。