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    PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
    62.
    发明申请
    PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE 有权
    印刷电路板和电子设备

    公开(公告)号：US20160270214A1

    公开(公告)日：2016-09-15

    申请号：US14653723

    申请日：2014-10-24

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Yue WU ,  Yan REN ,  Zifeng WANG

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0233 ,  H05K1/0225 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/162 ,  H05K2201/083 ,  H05K2201/093

    Abstract: The present disclosure relates to the field of circuits, and provides a printed circuit board (PCB) and an electronic device. The PCB includes a substrate and a wiring layer arranged at the substrate. The wiring layer includes a digital region and an analog region, and a gap region is defined between the digital region and the analog region. The substrate is provided with a hole in the gap region, and the digital region and the analog region of the wiring layer are connected through a magnetic bead.

    Abstract translation: 本公开涉及电路领域，并提供印刷电路板（PCB）和电子设备。 PCB包括衬底和布置在衬底上的布线层。 布线层包括数字区域和模拟区域，并且在数字区域和模拟区域之间限定间隙区域。 基板在间隙区域设置有孔，并且布线层的数字区域和模拟区域通过磁珠连接。

    METHOD OF FORMING METALLIC PATTERN ON POLYMER SUBSTRATE
    64.
    发明申请
    METHOD OF FORMING METALLIC PATTERN ON POLYMER SUBSTRATE 有权
    在聚合物基体上形成金属图案的方法

    公开(公告)号：US20150366072A1

    公开(公告)日：2015-12-17

    申请号：US14304982

    申请日：2014-06-16

    Applicant: Wistron NeWeb Corp.

    Inventor： Babak Radi ,  Yu-Fu Kuo

    IPC: H05K3/10 ,  H05K3/00

    CPC classification number: H05K3/185 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/023 ,  H05K1/0284 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/105 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/083 ,  H05K2201/09118 ,  H05K2201/10098 ,  Y10T29/49156

    Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.

    Abstract translation: 提供了一种在聚合物基板上形成金属图案的方法。 在聚合物基材表面上形成混合层。 混合物层包括活性载体介质和分散在活性载体介质中的纳米颗粒。 执行激光处理以处理混合物层的一部分以在聚合物基材的表面上形成活性种子残留物。 进行清洁处理以除去混合物层的未处理部分以暴露聚合物基材的表面，同时活性种子残留物保留在聚合物基材的表面上。 然后，对聚合物基底上的活性种子残留物进行化学镀处理，以在聚合物基底上的活性种子残基上形成金属图案。

    Anisotropic conductor, method of producing the same, and anisotropic conductor-arranged sheet
    67.
    发明授权
    Anisotropic conductor, method of producing the same, and anisotropic conductor-arranged sheet 有权
    各向异性导体，其制造方法和各向异性导体排列片

    公开(公告)号：US08872038B2

    公开(公告)日：2014-10-28

    申请号：US13393568

    申请日：2010-08-25

    Applicant: Yutaka Nakaone

    Inventor： Yutaka Nakaone

    IPC: H05K1/03 ,  H01L23/498 ,  H05K3/32 ,  H01R43/00

    CPC classification number: H05K3/32 ,  H01L21/486 ,  H01L23/145 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H01R43/007 ,  H05K2201/0133 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2201/10962 ,  H05K2203/104 ,  H01L2924/00

    Abstract: To provide a technique by which a material exhibiting high adhesiveness to objects to be fixed can be selected regardless of a material used for an insulating base in an anisotropic conductor having an adhesive section. An intermediate sheet which can be attached to the base is provided between the base and adhesive section. Since the intermediate sheet is provided in this manner, adhesive materials that exhibit high adhesive force to objects to be fixed can be used for the adhesive section without the consideration for adhesive force to the base. Furthermore, adhesive force which cannot be exhibited between the adhesive section and the base in the case of direct contact of the adhesive section with the base can be exhibited.

    Abstract translation: 提供一种技术，通过该技术可以选择对具有粘合部分的各向异性导体中用于绝缘基底的材料的任何材料，可以选择对待固定物体具有高粘附性的材料。 可以在基部和粘合部之间设置可附接到基部的中间片。 由于以这种方式设置中间片，所以对于粘合部可以使用对固定物具有高粘合力的粘合剂材料，而不考虑对基底的粘合力。 此外，在粘合部与基部直接接触的情况下，可以显示在粘合部和基部之间不能发挥的粘合力。

    POWDER COATING METHOD AND APPARATUS FOR ABSORBING ELECTROMAGNETIC INTERFERENCE (EMI)
    68.
    发明申请
    POWDER COATING METHOD AND APPARATUS FOR ABSORBING ELECTROMAGNETIC INTERFERENCE (EMI) 审中-公开
    用于吸收电磁干扰（EMI）的粉末涂布方法和装置

    公开(公告)号：US20140264182A1

    公开(公告)日：2014-09-18

    申请号：US14216800

    申请日：2014-03-17

    Applicant: Flextronics AP, LLC

    Inventor： Peter Suorsa

    IPC: H05K9/00

    CPC classification number: H05K9/0088 ,  G02B2207/121 ,  H01Q17/00 ,  H01Q17/002 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/024 ,  H05K2201/083 ,  Y10T29/49018 ,  Y10T156/1002

    Abstract: A method for producing a magnetic resonant frequency (MRF) absorber and apparatus for an MRF absorber are described herein. The method comprises processing a high permeability material such as permalloy comprising 80% nickel, 18% iron, 2% molybdenum to create a specific geometric form factor such as a flake, sphere, or rod. The geometric form factor may then be encapsulated in an insulating matrix. The insulating matrix may be a Potassium Silicate (SiO3K2). The insulated flake, sphere, or rod form factor may be introduced to a powder coating process. The insulated flake, sphere, or rod form factor may then be mixed with a polymetric coating powder at a weight ratio based on a desired performance for absorbing electromagnetic interference (EMI).

    Abstract translation: 本文描述了用于制造用于MRF吸收器的磁共振频率（MRF）吸收器和装置的方法。 该方法包括加工包括80％镍，18％铁，2％钼的坡莫合金的高磁导率材料，以产生特定的几何形状因子，例如片状，球形或棒状。 然后可以将几何形状因子封装在绝缘矩阵中。 绝缘基质可以是硅酸钾（SiO 3 K 2）。 绝缘薄片，球形或棒状形状因子可以被引入到粉末涂覆过程中。 绝缘薄片，球形或棒状形状因子可以与聚甲基涂层粉末以基于所需性能的重量比与吸收电磁干扰（EMI）混合。

    Flexible magnetostrictive sensor
    69.
    发明授权
    Flexible magnetostrictive sensor 有权
    柔性磁致伸缩传感器

    公开(公告)号：US08653810B2

    公开(公告)日：2014-02-18

    申请号：US13236062

    申请日：2011-09-19

    Applicant: Adam C. Cobb ,  Jonathan D. Bartlett ,  Charles E. Duffer

    Inventor： Adam C. Cobb ,  Jonathan D. Bartlett ,  Charles E. Duffer

    IPC: G01R33/18

    CPC classification number: G01R33/18 ,  H05K1/165 ,  H05K2201/083 ,  H05K2201/10151

    Abstract: A flexible printed circuit board (PCB) magnetostrictive (MS) sensor comprising a first direct current (DC) bias PCB layer comprising a first plurality of conductive traces, a first alternating current (AC) PCB layer disposed on the first DC bias PCB layer, the first AC PCB layer comprising a first AC coil, a pocket PCB layer disposed on the first AC PCB layer, the pocket PCB layer to receive a strip of MS material, a second AC PCB layer disposed on the pocket PCB layer, the second AC PCB layer comprising a second AC coil, and a second DC bias PCB layer disposed on the second AC PCB layer, the second DC bias PCB layer comprising a second plurality of conductive traces. The traces from the first plurality of conductive traces are electrically coupled to traces from the second plurality of conductive traces.

    Abstract translation: 一种柔性印刷电路板（PCB）磁致伸缩（MS）传感器，包括包括第一多个导电迹线的第一直流（DC）偏压PCB层，设置在第一DC偏压PCB层上的第一交流电（AC）PCB层， 第一AC PCB层包括第一AC线圈，布置在第一AC PCB层上的袋PCB层，用于接收MS材料条的袋PCB层，设置在袋PCB层上的第二AC PCB层，第二AC PCB层包括第二AC线圈和设置在第二AC PCB层上的第二DC偏置PCB层，第二DC偏置PCB层包括第二多个导电迹线。 来自第一多个导电迹线的迹线电耦合到来自第二多个导电迹线的迹线。

    Modular lighting system and method employing loosely constrained magnetic structures
    70.
    发明授权
    Modular lighting system and method employing loosely constrained magnetic structures 有权
    采用松散约束磁结构的模块化照明系统和方法

    公开(公告)号：US08651711B2

    公开(公告)日：2014-02-18

    申请号：US13211533

    申请日：2011-08-17

    Applicant: Charles A. Rudisill ,  Daniel John Whittle

    Inventor： Charles A. Rudisill ,  Daniel John Whittle

    IPC: F21V21/00 ,  F21V29/00

    CPC classification number: F21V29/70 ,  F21S2/005 ,  F21V21/096 ,  F21V21/35 ,  F21V23/005 ,  F21V29/507 ,  F21V29/773 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/10106 ,  Y10T29/49117

    Abstract: A lighting system including modules containing LEDs or other electroluminescent devices and loosely constrained magnetic structures at least partially contained within cavities in the module substrate that are connected to fixtures under magnetic force. The loosely constrained magnetic structures accommodate mechanical variations in the system and provide a method to connect modules mechanically, electrically and thermally to different fixtures or positions in fixtures without tools. The relatively short distance separating magnetic structures provides high connection forces with the use of relatively small magnets. Magnets and electrical contacts are not located directly between the LED subassembly and the fixture, which provides higher thermal conductivity pathways to remove heat from the LEDs. Biasing members may be used to increase thermal contact. Magnetic structures may, but are not required, to conduct electricity. Fixtures that attach to modules include rails, sockets, heat sinks and two-dimensional structures with recessed electrodes for improved electrical safety.

    Abstract translation: 一种照明系统，包括包含LED或其他电致发光器件的模块以及至少部分地包含在模块衬底中的空腔内的松散约束的磁性结构，其在磁力下连接到固定装置。 松散约束的磁性结构适应系统中的机械变化，并提供一种将模块机械地，电气地和热地连接到不同工具的夹具中的不同夹具或位置的方法。 分离磁性结构的相对短的距离通过使用相对小的磁体提供高的连接力。 磁体和电触点不直接位于LED子组件和固定装置之间，这提供了更高的导热通道，以从LED中去除热量。 偏压构件可用于增加热接触。 磁性结构可以但不是必需的来传导电力。 连接到模块的夹具包括导轨，插座，散热器和具有凹陷电极的二维结构，以提高电气安全性。

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