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    SYSTEM FOR ATTACHING ELECTRONIC COMPONENTS TO MOLDED INTERCONNECTION DEVICES
    61.
    发明申请
    SYSTEM FOR ATTACHING ELECTRONIC COMPONENTS TO MOLDED INTERCONNECTION DEVICES 有权
    将电子元件连接到成型互连器件的系统

    公开(公告)号：US20080222876A1

    公开(公告)日：2008-09-18

    申请号：US11684665

    申请日：2007-03-12

    Applicant: Ronald M. Weber ,  Sheldon Lynn Horst

    Inventor： Ronald M. Weber ,  Sheldon Lynn Horst

    IPC: H01L23/58 ,  H01S4/00

    CPC classification number: H05K1/183 ,  H05K1/0284 ,  H05K3/301 ,  H05K3/303 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49002 ,  Y10T29/49137

    Abstract: A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the substrate. The anchor is either a raised structure or a recessed structure, and further includes at least one retention member formed integrally with the anchor. At least one electronic component is mounted within the anchor and the at least one retention member secures the component to the substrate. At least one electrical trace is disposed on the substrate and the at least one electrical trace extends into the anchor, contacts the at least one electronic component, and forms an electrical connection between the substrate and the at least one electronic component.

    Abstract translation: 提供了一种用于将电气设备彼此连接的系统。 该系统包括水平或非水平衬底和连接到衬底或与衬底一体形成的锚固件。 锚固件是凸起结构或凹形结构，并且还包括与锚固件一体形成的至少一个保持构件。 至少一个电子部件安装在锚固体内，并且至少一个保持构件将部件固定到基底上。 至少一个电迹线设置在衬底上，并且至少一个电迹线延伸到锚中，接触至少一个电子部件，并在衬底和至少一个电子部件之间形成电连接。

    MANUFACTURING METHOD OF MULTILAYER CERAMIC BOARD
    63.
    发明申请
    MANUFACTURING METHOD OF MULTILAYER CERAMIC BOARD 有权
    多层陶瓷板的制造方法

    公开(公告)号：US20080128157A1

    公开(公告)日：2008-06-05

    申请号：US11877971

    申请日：2007-10-24

    Applicant: Takaki MURATA ,  Yasutaka SUGIMOTO

    Inventor： Takaki MURATA ,  Yasutaka SUGIMOTO

    IPC: B32B3/00

    CPC classification number: H05K3/0052 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/49822 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2203/308 ,  Y10T428/24917 ,  Y10T428/24926

    Abstract: A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green sheets including ceramic material powder, contraction prevention green sheets including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet are arranged such that along at least a portion of the outer circumference of the principal surface, the portion and a nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets are removed. With a multilayer ceramic board, protruding portions are formed along at least a portion of the outer circumference of a principal surface.

    Abstract translation: 制造多层陶瓷板的方法防止了通过非收缩工艺制造的多层陶瓷板的表面上形成的布线导体的损坏。 在由包含陶瓷材料粉末的多个板状陶瓷生片构成的层叠体的至少一个主面上，包含在基板陶瓷生片的烧成温度下未烧结的无机材料粉末的收缩防止生片被配置为 沿着主表面的外周的至少一部分，使其部分及其附近部分暴露以形成复合层状体，在烧结陶瓷材料粉末的条件下对复合层叠体进行烘烤， 无机材料粉末不被烧结，除去收缩防止生片。 利用多层陶瓷板，沿着主表面的外周的至少一部分形成突出部。

    Electronic Component
    65.
    发明申请
    Electronic Component 有权
    电子元器件

    公开(公告)号：US20080024960A1

    公开(公告)日：2008-01-31

    申请号：US11597880

    申请日：2005-06-03

    Applicant: Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

    Inventor： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

    IPC: B29C45/14 ,  H05K7/00

    CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

    Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

    Abstract translation: 本发明的目的是提供一种以低成本制造工艺制造的电子部件，同时实现耐冲击性，耐久性，抗弯曲性，安装可靠性等的改善，而不需要微调等。本发明是 具有元件2的电子部件1，设置在元件2上的一对端子部4和覆盖端子部4的一部分和元件2的外部覆盖材料5， 倾斜部分10设置在底面9的角部和外部覆盖材料5的侧面的方式，端子部4从外部覆盖材料的倾斜部10和底面9的角部突出 相交。

    Wiring Circuit Board Producing Method and Wiring Circuit Board
    66.
    发明申请
    Wiring Circuit Board Producing Method and Wiring Circuit Board 审中-公开
    接线电路板生产方法和接线电路板

    公开(公告)号：US20070220744A1

    公开(公告)日：2007-09-27

    申请号：US11587439

    申请日：2005-07-21

    Applicant: Kenji Kitaoka ,  Takayoshi Fujimoto

    Inventor： Kenji Kitaoka ,  Takayoshi Fujimoto

    IPC: H05K3/10 ,  H01K3/10

    CPC classification number: H05K3/4007 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/182 ,  H05K3/246 ,  H05K3/3436 ,  H05K3/4614 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09472 ,  H05K2203/0709 ,  H05K2203/1173 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A wiring circuit board and a method of producing the same are provided in which a desired pattern of wiring is provided at higher density while permitting no overflow from the grooves of an electroless plating catalyst containing solution and an electric conductor forming liquid such as silver ink. The pattern of electric conductor is deposited by applying the electric conductor forming liquid into the grooves provided in a substrate and distributing the same along the grooves with the action of capillarity. The method starts with patterning the grooves in the surface of the substrate (S1), applying the electric conductor forming liquid into the grooves (S2), and coating the surface of the substrate with a layer of repellent liquid which is lower in the affinity with the electric conductor forming liquid (S3). This is followed by cleaning at least the grooves (S4) and then filling the grooves with the electric conductor forming liquid once again (S5). The electric conductor forming liquid applied into the grooves is then distributed throughout the grooves by the action of capillarity. When silver ink is used, the pattern of electric conductor is produced by repeating an action of applying and drying a number of times. Alternatively, the patter of electric conductor can be produced by an electroless plating technique or a combination of an electroless plating technique and an electro-plating technique for separating an electrical conductive material form the electric conductor forming liquid.

    Abstract translation: 提供一种布线电路板及其制造方法，其中以更高的密度提供所需的布线图案，同时不允许来自含化学镀电镀催化剂溶液的槽和诸如银墨的电导体形成液体的槽溢出。 通过将导电剂形成液体施加到设置在基板中的凹槽中并通过毛细管作用沿着凹槽分布而将电导体的图案沉积。 该方法开始于图案化基板表面（S 1）中的凹槽，将导电体形成液体施加到凹槽（S 2）中，并且在基板的表面中涂覆一层较低的驱避液体 与导电体形成液体的亲合力（S 3）。 然后，至少清洗槽（S 4），然后再次用导电体形成液填充槽（S 5）。 然后通过毛细作用的作用将施加到槽中的导电体形成液体分布在整个槽中。 当使用银墨时，通过重复施加和干燥多次的作用产生电导体的图案。 或者，电导体的图案可以通过化学镀技术或化学镀技术和电镀技术的组合来制造，用于从形成电导体的液体中分离导电材料。

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