公开(公告)号：US20040238212A1

公开(公告)日：2004-12-02

申请号：US10489879

申请日：2004-03-17

Inventor： Francois Droz

IPC: H05K001/11 ,  H05K001/18

CPC classification number: G06K19/07752 ,  G06K19/07749 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49855 ,  H01L23/5389 ,  H01L2224/16 ,  H05K3/4084 ,  H05K3/4092 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/09081

Abstract: The aim of this invention is to obtain a very cheap electronic circuit used for example in a card or a label while maintaining high reliability. It particularly concerns the connection of one or several electronic components on the conductive tracks by means of conductive bridges that traverse the substrate. The electronic circuit according to the invention includes at least one electronic component (6), a substrate (5), on a first face of this substrate an adhesive layer and a conductive layer including a plurality of tracks (4) are applied. The electronic component (6) comprises at least two connection areas (7). One of these connection areas (7) is electrically linked to the conductive layer by a conductive bridge formed by a conductive segment (1) delimited in the conductive layer only. Said segment (1), free from any adhesive substance, traverses the substrate (5) through a passage (2, 3) and links the connection area (7).

Abstract translation: 本发明的目的是获得例如卡或标签中使用的非常便宜的电子电路，同时保持高可靠性。 它特别涉及通过穿过衬底的导电桥将导电轨道上的一个或几个电子部件连接起来。 根据本发明的电子电路包括至少一个电子部件（6），衬底（5），在该衬底的第一面上施加粘合层和包括多个轨道（4）的导电层。 电子部件（6）包括至少两个连接区域（7）。 这些连接区域（7）中的一个通过由仅在导电层中限定的导电段（1）形成的导电桥电连接到导电层。 所述片段（1）没有任何粘合物质，通过通道（2,3）穿过基片（5）并连接连接区域（7）。

公开(公告)号：US06716060B2

公开(公告)日：2004-04-06

申请号：US10213871

申请日：2002-08-06

Applicant: Martin Gollhofer ,  Roland Etzkom ,  Wolfgang Zeeb ,  Wolfgang Hutt ,  Michael Stache

Inventor： Martin Gollhofer ,  Roland Etzkom ,  Wolfgang Zeeb ,  Wolfgang Hutt ,  Michael Stache

IPC: H01R1366

CPC classification number: H01R12/7052 ,  H05K3/306 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10575 ,  H05K2201/10598

Abstract: An electrical connector is constructed for ease of fixing a sheet metal solder plate (25) to the bottom surface portion (70) of the connector insulator frame (12), so the solder plate can be soldered to one or more traces on a circuit board to hold down the frame. The frame has downwardly extending pegs (33-35) and the solder plate has corresponding peg-receiving holes (28-30). The mount plate forms at least one tongue (48, 49) at each of its holes, each tongue projecting against one of the pegs to form an interference fit against the peg that prevents removable of the solder plate from the insulator pegs. Each peg has a vertical slot (38, 39) that receives a nose (50, 51) at the end of the tongue.

Abstract translation: 电连接器被构造为便于将金属板焊接板（25）固定到连接器绝缘体框架（12）的底表面部分（70），使得焊接板可以焊接到电路板上的一个或多个迹线 按住框架。 框架具有向下延伸的销钉（33-35），并且焊接板具有对应的钉接收孔（28-30）。 安装板在其每个孔处形成至少一个舌部（48,49），每个舌片突出抵靠其中一个栓钉，以形成与栓钉的过盈配合，从而防止焊料板从绝缘钉上移除。 每个钉具有在舌头末端接收鼻子（50,51）的垂直槽（38,39）。

公开(公告)号：US06657767B2

公开(公告)日：2003-12-02

申请号：US10105574

申请日：2002-03-25

Applicant: Timothy A. Bonardi ,  Frederick T. Bauer

Inventor： Timothy A. Bonardi ,  Frederick T. Bauer

IPC: G02F115

CPC classification number: H05K1/189 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/088 ,  B60R1/1207 ,  H05K1/02 ,  H05K1/18 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A rearview mirror assembly of the present invention includes a circuit board disposed behind the mirror. The circuit board may be a flexible circuit board and may include an LED mounted to project light through a transparent window in the flexible circuit board and through the mirror. The flexible circuit board may function as a mirror heater and may include conductive paths for connection to the LED and/or electrodes of an electrochromic mirror. The LED may include an LED chip mounted directly on the circuit board and encapsulated thereon by an encapsulant.

公开(公告)号：US06583990B2

公开(公告)日：2003-06-24

申请号：US09984318

申请日：2001-10-29

Applicant: Yasuyoshi Serizawa ,  Takahiko Suzuki ,  Keizo Nishitani

Inventor： Yasuyoshi Serizawa ,  Takahiko Suzuki ,  Keizo Nishitani

IPC: H05K100

CPC classification number: H01R12/616 ,  H05K1/118 ,  H05K1/142 ,  H05K3/326 ,  H05K3/361 ,  H05K2201/048 ,  H05K2201/09081

Abstract: A flexible first circuit member (10) includes conductors (11) wired thereto. The conductors (11) include a first conductor group (12). The first circuit member defines an opening (14) having a first edge part (14d). The first conductor group (12) terminates at the first edge part (14d). A flexible second circuit member (13) is electrically connected to first conductor group (12) at the first edge part (14d).

公开(公告)号：US6142791A

公开(公告)日：2000-11-07

申请号：US115647

申请日：1998-07-15

Applicant: Nobuyuki Yagi ,  Shigeaki Kinoshita ,  Noboru Tohma ,  Osamu Nomura ,  Ikuo Nagatomo ,  Mitsuru Hosokawa

Inventor： Nobuyuki Yagi ,  Shigeaki Kinoshita ,  Noboru Tohma ,  Osamu Nomura ,  Ikuo Nagatomo ,  Mitsuru Hosokawa

IPC: H05K1/18 ,  H05K3/32 ,  H05K7/12 ,  H01R12/00

CPC classification number: H05K3/326 ,  H05K7/12 ,  H05K1/189 ,  H05K2201/09081 ,  H05K2201/10393 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: The invention provides a mounting construction in which an electronic component is mounted on a flexible substrate. The mounting construction comprises a flexible substrate including a flexible sheet, bendable electrode pattern forming portions formed on the flexible sheet, and electrode patterns formed on the electrode pattern forming portions, an electronic component having electrode portions, and a clamping member having clamping pieces for clamping the electronic component therebetween. The electrode pattern forming portions are deflected, so as to cause the electrode patterns to be contacted with the electrode portions of the electronic component placed on the flexible substrate. By this, the electronic component is clamped by the clamping pieces of the clamping member through the deflected electrode pattern forming portions. Thus, the electronic component may be easily and positively secured to the flexible substrate, without employing additional reinforcing means such as adhesives.

Abstract translation: 本发明提供一种安装结构，其中电子部件安装在柔性基板上。 安装结构包括柔性基板，其包括柔性片，形成在柔性片上的可弯曲电极图案形成部分，以及形成在电极图案形成部分上的电极图案，具有电极部分的电子部件，以及夹持件， 其间的电子部件。 电极图案形成部分被偏转，以使电极图案与放置在柔性基板上的电子部件的电极部分接触。 由此，电子部件通过夹持部件的夹紧片通过偏转的电极图形形成部夹持。 因此，电子部件可以容易且牢固地固定到柔性基板，而不需要附加的加强装置，例如粘合剂。

公开(公告)号：US6080603A

公开(公告)日：2000-06-27

申请号：US268286

申请日：1999-03-15

Applicant: Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

Inventor： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

Abstract: In a method for mounting a sheet-like microelectronic element, the sheet-like element comprises a dielectric layer having a top surface and a bottom surface and is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. A plurality of leads are formed on the bottom surface of the sheet-like element, the leads including bonding pads. In other embodiments, a method is provided for bonding bond pads on a sheet-like microelectronic element to contacts on a microelectronic component.

Abstract translation: 在安装片状微电子元件的方法中，片状元件包括具有顶表面和底表面的电介质层，并且首先接合到膨胀环。 然后将膨胀环加热以拉伸片状元件。 然后将具有小于膨胀环内径的外径的框架环结合到片状元件。 多个引线形成在片状元件的底表面上，引线包括接合焊盘。 在其他实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的接触的方法。

公开(公告)号：US5989936A

公开(公告)日：1999-11-23

申请号：US989312

申请日：1997-12-12

Applicant: John W. Smith ,  Joseph Fjelstad

Inventor： John W. Smith ,  Joseph Fjelstad

IPC: H01L21/48 ,  H01L23/22 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44 ,  H01L21/50

CPC classification number: H01L23/22 ,  H01L21/4839 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/13 ,  H05K3/4084 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H05K3/361

Abstract: A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends detachable from the structure. The structure is engaged with a microelectronic element such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.

Abstract translation: 包括导电优选金属导电层的结构在底表面上设置有引线。 引线具有永久地附接到结构的固定端部和从结构可拆卸的自由端。 该结构与诸如半导体芯片或晶片的微电子元件接合，引线的自由端接合到微电子元件，并且通过相对于微电子元件移动结构而使引线弯曲。 导电层的一部分被去除，导致导电层的剩余部分作为分开的电端子连接到至少一些引线。 导电层在结合之前机械稳定结构，并且有助于引线与微电子元件的精确对准。 在将导电层转换成单独的端子之后，它不会损害端子相对于微电子元件的自由移动。

公开(公告)号：US5706174A

公开(公告)日：1998-01-06

申请号：US812202

申请日：1997-03-06

Applicant: Thomas H. Distefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

Inventor： Thomas H. Distefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01L24/81 ,  H01L21/4839 ,  H01L21/563 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3025 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A compliant microelectronic mounting device. An area array of conductive contact pads are connected into rows by conductive leads on a first side of a flexible substrate. Each of the conductive leads bridges a bonding hole in the substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A plurality of compliant dielectric buttons, typically composed of an elastomer material, are attached to a second side of the substrate and typically positioned under each contact pad. The component may be attached to a microelectronic device having contacts so that a stand-off is created between the substrate and the device by the compliant dielectric buttons. The frangible portions allow the leads to be cleanly broken, bent and secured into electrical contact with opposed contact pads on the microelectronic device. Each of these connections may be supported by a compliant layer, typically an uncured elastomer which fills the area around the dielectric pads and is then cured.

Abstract translation: 符合微电子的安装装置。 导电接触焊盘的区域阵列通过柔性基板的第一侧上的导电引线连接成行。 每个导电引线桥接位于连续接触焊盘之间的衬底中的结合孔。 每个导电引线还在每个结合孔内或附近还具有易碎部分。 通常由弹性体材料组成的多个柔性介质按钮被附接到基板的第二侧并且通常位于每个接触垫下方。 该部件可以附接到具有触点的微电子器件，使得通过柔性介质按钮在基板和器件之间产生间隔。 易碎部分允许引线被干净地折断，弯曲并固定成与微电子器件上的相对接触焊盘电接触。 这些连接中的每一个可以由柔性层（通常是填充介电垫周围区域的未固化的弹性体）支撑，然后固化。

公开(公告)号：US5599595A

公开(公告)日：1997-02-04

申请号：US468235

申请日：1995-06-06

Applicant: William J. McGinley ,  John R. Cannon ,  William J. Green ,  Richard P. Zanardo

Inventor： William J. McGinley ,  John R. Cannon ,  William J. Green ,  Richard P. Zanardo

IPC: C09K19/38 ,  H01R12/71 ,  H01R13/03 ,  H01R24/00 ,  H01R43/16 ,  H05K1/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  B52B9/00

CPC classification number: H05K3/0014 ,  H01R12/716 ,  H01R13/035 ,  H05K1/119 ,  H05K3/326 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/117 ,  H05K2201/0141 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K3/366 ,  Y10S428/901 ,  Y10S439/931

Abstract: A conductive component for carrying electrical signals constructed from a molded polymer substrate and a conductive coating adhered to the substrate, the coating defining a continuous electrical pathway between at least two terminals. Preferably, molded plastic such as liquid crystal polymer is formed to make circuits having conductive ink adhered thereto in order to provide inexpensive and versatile printed circuit boards for carrying electrical traces and other components and to provide printed formed contacts. The conductive solderable inks can be adhered to the substrate, for example, via screen printing, brush, spraying, dipping, masking, vacuum plating or vacuum deposition with subsequent oven drying, reflowing in a vapor phase, post curing or plating.

Abstract translation: 用于承载由模制的聚合物基底构成的电信号的导电组件和粘附到基底的导电涂层，所述涂层在至少两个端子之间限定连续的电通路。 优选地，形成诸如液晶聚合物的模制塑料以使具有导电油墨的电路粘附到其上，以便提供用于承载电迹线和其它部件的便宜且通用的印刷电路板，并提供印刷成形的触点。 导电性可焊墨水可以例如通过丝网印刷，刷涂，喷涂，浸渍，掩模，真空电镀或真空沉积，随后烘箱干燥，气相回流，后固化或电镀而粘附到基底上。

公开(公告)号：US5307519A

公开(公告)日：1994-04-26

申请号：US844035

申请日：1992-03-02

Applicant: Alay M. Mehta ,  Venus D. Desai

Inventor： Alay M. Mehta ,  Venus D. Desai

IPC: H01M6/50 ,  H01M10/42 ,  H01M10/50 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/40 ,  H05K7/20 ,  H04B1/16

CPC classification number: H05K1/0204 ,  H01M10/42 ,  H01M10/617 ,  H01M10/623 ,  H01M10/6554 ,  H01M2200/10 ,  H05K1/0393 ,  H05K1/16 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/10181 ,  H05K2201/10416 ,  H05K3/4046

Abstract: A circuit assembly (400) includes a flexible circuit (402) having first (504) and second layers (502). A current-limiting device such as a nichrome strip (316) is coupled to the flexible circuit (402) for limiting the amount of current during a short circuit condition. A heat sink (404) is selectively placed between the first and second layers of the flexible circuit in thermal proximity to the nichrome wire (316) in order to dissipate some of the heat generated by the nichrome strip (316).

Abstract translation: 电路组件（400）包括具有第一（504）和第二层（502）的柔性电路（402）。 诸如镍铬合金带（316）的限流装置耦合到柔性电路（402），用于限制短路状态下的电流量。 散热器（404）被选择性地放置在柔性电路的第一和第二层之间，靠近镍铬合金丝（316），以便消散由镍铬合金带（316）产生的一些热。