公开(公告)号：US5434362A

公开(公告)日：1995-07-18

申请号：US300762

申请日：1994-09-06

Applicant: Tomasz L. Klosowiak ,  David W. Currier ,  Gary K. Mui

Inventor： Tomasz L. Klosowiak ,  David W. Currier ,  Gary K. Mui

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K5/003 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K3/0061

Abstract: A flexible circuit board assembly (10) includes a flexible substrate (11) having first and second end portions (14,15) and an intermediate portion (16). Conductive metalization interconnect paths (17) extend between the substrate end portions (14, 15) and across the intermediate portion (16). The substrate first and second end portions are mounted to first and second end portions (21, 22) of a rigidizer plate (20). Stiffening material (35) is provided on the flexible substrate intermediate portion (16) to define stiff (36, 37, 38) and less stiff (39, 40) paths that extend across the interconnect paths (17) and the substrate intermediate portion (16) and define desired bend curvature characteristics for the flexible substrate intermediate portion (16). A method utilizes this structure to provide a flexible circuit board assembly (10), preferably with a bent rigidizer plate (20).

Abstract translation: 柔性电路板组件（10）包括具有第一和第二端部（14,15）和中间部分（16）的柔性基板（11）。 导电金属化互连路径（17）在基板端部（14,15）之间延伸并跨越中间部分（16）。 衬底第一和第二端部安装到刚性化板（20）的第一和第二端部（21,22）上。 硬化材料（35）设置在柔性基板中间部分（16）上，以限定穿过互连路径（17）和基板中间部分（16）延伸的刚性（36,37,38）和较小刚性（39,40） 16）并且限定用于柔性基板中间部分（16）的所需弯曲曲率特性。 一种方法利用该结构来提供柔性电路板组件（10），优选地具有弯曲的刚性板（20）。

公开(公告)号：US4037047A

公开(公告)日：1977-07-19

申请号：US537714

申请日：1974-12-31

Applicant: Glen J. Taylor

Inventor： Glen J. Taylor

IPC: H05K3/00 ,  H05K1/14 ,  H05K3/30

CPC classification number: H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09109

Abstract: Method and structure for creating multilayer printed circuit boards having integral flexible conductor appendages, involving the utilization of an array of flexible, circuit-containing layers bonded in properly aligned relationship between rigid layers equipped with suitable electrical connections. All of the layers are substantially larger than the size the finished circuit board is to be and selectively bonded and slotted in preselected locations, and maintained in this over-sized condition throughout the procedure in which holes for interconnections are drilled, and plated through with conductive material. Only after the plating procedure has been completed are the portions of the upper and lower rigid layers removed from locations above and below the appendage portions, thus allowing them to attain the desired, flexible condition. By keeping the rigid layers intact, the assemblage is maintained rigid during the plating procedure, thereby avoiding undesirable work hardening of the flexible portions even without tools for restraining the flexible portions. The selective bonding and preslotting permits the ready removal of the rigid material from certain portions of the assemblage to form the circuit board with integral flexible conductor appendages.

Abstract translation: 用于制造具有整体柔性导线附件的多层印刷电路板的方法和结构，涉及利用配备有适当电连接的刚性层之间以适当对准的关系结合的柔性电路层的阵列。 所有的层都大大地大于完成的电路板将被选择性地结合并且在预先选定的位置开槽的尺寸，并且在贯穿用于互连的孔的钻孔过程中保持在这种超大尺寸的状态，并且通过导电 材料。 只有在电镀步骤完成之后，上，下刚性层的部分从附件部分上方和下方的位置移除，从而使它们达到所需的柔性状态。 通过保持刚性层的完整性，组装在电镀过程中保持刚性，从而避免了柔性部分的不期望的加工硬化，甚至没有用于限制柔性部分的工具。 选择性粘合和预拉伸允许从组合件的某些部分准备去除刚性材料以形成具有整体柔性导体附件的电路板。

公开(公告)号：US20190020138A1

公开(公告)日：2019-01-17

申请号：US16030937

申请日：2018-07-10

Applicant: New Cable Corporation Oy

Inventor： Tommi Rintala ,  Antti Backman

IPC: H01R12/78 ,  H01R12/79 ,  H01R12/77

CPC classification number: H01R12/78 ,  H01R12/61 ,  H01R12/771 ,  H01R12/79 ,  H05K1/028 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/46 ,  H05K3/4697 ,  H05K2201/055 ,  H05K2201/09109 ,  H05K2201/09145 ,  H05K2201/10356

Abstract: The pocket connector of the invention has been manufactured of a substrate, which is preferably flexible in at least one direction, of which three parts have been prepared, which are bent or assembled from three parts and joined together superimposed so that at least two opposite sides of the pocket connector have coupling apertures. Two flat cables or a connector for a flexible circuit board is connectable to these coupling apertures.

公开(公告)号：US20180277956A1

公开(公告)日：2018-09-27

申请号：US15984112

申请日：2018-05-18

Applicant: Ce Zhang

Inventor： Ce Zhang

IPC: H01Q9/04 ,  H01Q21/06

CPC classification number: H01Q9/0464 ,  G02F2001/133541 ,  H01Q1/288 ,  H01Q3/2682 ,  H01Q9/0492 ,  H01Q9/065 ,  H01Q21/06 ,  H01Q21/065 ,  H05K2201/09109

Abstract: A planar multi-layer assembly method fabricates a dual frequency, dual polarization phased-array antenna. A plurality of vias make up an array of double-walled wells which are connected to a ground plane. A shorted annular ring patch antenna (SARPA) is deposited at the top of each double-walled well. Fabricated coaxially and parallel to each SARPA, is an array of circular patch antennas (CPA). The inner wall of each double-walled well improves isolation of the CPA signals from the SARPA signals. Each SARPA of the array is connected to a pair of first frequency band signal vias and the CPA is coupled to a pair of second frequency band signal vias. Within each frequency band, a plurality of signal phases enable steerable polarized antenna beams.

公开(公告)号：US09658648B2

公开(公告)日：2017-05-23

申请号：US14224892

申请日：2014-03-25

Applicant: Apple Inc.

Inventor： Benjamin M. Rappoport ,  Justin R. Wodrich ,  Santhana Balaji ,  Shayan Malek

IPC: G06F1/16 ,  H05K1/02 ,  H05K3/00

CPC classification number: G06F1/1633 ,  G06F1/1656 ,  H05K1/0281 ,  H05K3/0064 ,  H05K2201/09109 ,  H05K2201/2009

Abstract: An electronic device may have a signal cable formed from a flexible printed circuit. A service loop may be formed in the signal cable. The bend may be formed in a desired location on the flexible printed circuit by contraction of an elastic member having ends attached to the flexible printed circuit. The elastic member may be conductive to carry signals and provide shielding. Structures may be attached to the flexible printed circuit to promote bending in a desired location and direction. A crease or other bending promotion feature may be applied to the flexible printed circuit at a desired bend location. Overbending prevention structures such as overmolded elastomeric structures may be applied to the flexible printed circuit at the bend. Integral strain relief features may prevent overbending of the flexible printed circuit upon exiting the elastomeric structures. Overmolded structures may serve as protective bumpers.

公开(公告)号：US09414500B2

公开(公告)日：2016-08-09

申请号：US13320285

申请日：2010-05-27

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H05K3/12 ,  H01L23/498 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  H05K1/16 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/0221 ,  H05K1/0256 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/118 ,  H05K1/16 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/246 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4664 ,  H05K3/4694 ,  H05K2201/0344 ,  H05K2201/0367 ,  H05K2201/09109 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T29/49155

Abstract: A compliant printed flexible circuit including a flexible polymeric film and at least one dielectric layer bonded to the polymeric film with recesses corresponding to a target circuit geometry. A conductive material is printed in at least a portion of the recesses to form a circuit geometry. At least one dielectric covering layer is printed over at least the circuit geometry. Openings can be printed in the dielectric covering layer to provide access to at least a portion of the circuit geometry.

Abstract translation: 包括柔性聚合物膜和柔性聚合物膜的柔性印刷柔性电路以及与聚合物膜结合的至少一个介电层，其具有对应于目标电路几何形状的凹部。 在至少一部分凹部中印刷导电材料以形成电路几何形状。 至少一个电介质覆盖层至少印刷在电路几何形状上。 开口可以印刷在电介质覆盖层中以提供对电路几何形状的至少一部分的访问。

公开(公告)号：US09035189B2

公开(公告)日：2015-05-19

申请号：US12997867

申请日：2009-06-08

Applicant: Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

Inventor： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H05K3/4691 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T428/24322

Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

Abstract translation: 一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域 。

公开(公告)号：US20140305683A1

公开(公告)日：2014-10-16

申请号：US14095878

申请日：2013-12-03

Applicant: Zhen Ding Technology Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd.

Inventor： BIAO LI

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/14 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09109 ,  H05K2201/09127 ,  Y10T29/302

Abstract: A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence.

Abstract translation: 紧凑的刚性柔性板包括两个柔性PCB，两个刚性基板，第三轨迹层和第四轨迹层。 第一柔性PCB包括第一按压部分，第一暴露部分和第三按压部分，以及分离的第二暴露部分。 第二柔性PCB包括第四和第五按压部分和第二暴露部分。 第一刚性基板包括第六，第七和第八按压部分。 第二刚性基板包括第九和第十按压部。 第三迹线层，第六，第一，第四和第九按压部分和第四迹线层依次层叠。 第三迹线层，七，第二，第五和第十按压部分和第四迹线层依次层叠。 第三迹线层和第八和第三按压部分依次层叠。

公开(公告)号：US08559181B2

公开(公告)日：2013-10-15

申请号：US12930971

申请日：2011-01-21

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

公开(公告)号：US20130256004A1

公开(公告)日：2013-10-03

申请号：US13435372

申请日：2012-03-30

Applicant: Darryl COTTON ,  Samiul Md. HAQUE ,  Piers ANDREW

Inventor： Darryl COTTON ,  Samiul Md. HAQUE ,  Piers ANDREW

IPC: H05K1/02 ,  H05K3/20 ,  H05K3/24 ,  H05K3/10

CPC classification number: H05K3/0064 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09045 ,  H05K2201/09109 ,  H05K2201/09263 ,  H05K2201/2036

Abstract: An apparatus and method wherein the apparatus comprises includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.

Abstract translation: 一种装置和方法，其中所述装置包括可变形衬底; 导电部分; 以及至少一个支撑件，其构造成将所述导电部分耦合到所述可变形基板，使得所述导电部分与所述可变形基板间隔开。