Abstract:
The present invention is directed to ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or of a storage array device for a network server or web server. The cooling element includes a fan that is disposed at an angle to integrate its cooling air with general circulation or air flow through the chassis. The element may mount on a plate, such as the thermally conductive plate of a heat sink, that is adapted for coupling to the chassis and/or contacting a microprocessor chip, and a fan is disposed on the mounting plate at an angle to cool the plate or chip without creating obstructive cross wind. The mounting plate can be disposed within the middle portion of the chassis. The fan or cooling element can be angled so as to direct airflow towards at least a selected portion of the chassis, e.g. along a flow path to a chassis vent or opening, which may be in the rear portion. The mounting plate can also include one or more a thermally conductive heat dissipation members, such as fins or posts, and the fan may have a side-to-side tilt as well as an inclination with respect to the plane of the plate.
Abstract:
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90null in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
Abstract:
An electronics device comprising a carrier, such as a printed circuit board, a substrate or a chip, and an electric conductor on a surface of the carrier. The surface of the conductor (2) facing away from the carrier has a surface structure (3, 4; 6, 7) in the form of flanges which are defined by etched grooves.
Abstract:
A high speed board-to-board data transfer system capable of data transfer over single ended ribbon cable between a slave device and a master device. A slave device comprises a plurality of drivers generating clock signals at above 40 MHz connected to cable connector pins by a trace line through a series termination resistor. A master device comprises a plurality of receivers corresponding to the drivers connected to cable connector pins through a trace line. The ribbon cable is a single-ended ribbon cable using a ground-signal-ground configuration. The drivers, trace lines, resistors, cables, and receivers are chosen to provide reliable data transfer above 40 MHz, preferably between 40 MHz and 80 MHz. Preferred master and slave devices comprise VESA VIP 2.0 masters and slaves transmitting high quality video.
Abstract:
Magnetic noise cancellation in a single-ended MR preamplifier front end is achieved by forming a balanced ground return path in a flex circuit connecting an MR head to the front end of the preamplifier. The balanced ground return path introduces a noise current in the opposite direction of the original noise current as viewed at the signal input pins of the preamplifier chip. In this manner common mode rejection of the radiated noise component is restored in the single-ended MR preamplifier circuit arrangement.
Abstract:
A data processing system includes a backplane and a plurality of logic boards connected to the backplane by a plurality of connectors. A set of common points is electrically coupled to the connectors by individual conductive traces between each common point and the corresponding pins of the connectors. The inductance of longer traces is reduced by merging traces near a central portion of the backplane to form a conductive region that extends to at least one connector on either side of the common points, thereby electrically shortening the longer traces. The inductance is further reduced by widening the longer traces. Longer traces are wider than shorter traces to reduce the differences in the LC products associated with each trace and, therefore, the differences in delay among the traces.
Abstract:
A technique for reducing skew between clock signals in a digital system requiring multiple clock signals. The system preferably is implemented on a printed circuit board. An oscillator circuit provides a periodic signal to a clock buffer which generates multiple periodic clock signals. The clock signals are provided to various destination points on the printed circuit board. The rising and falling edges of each clock signal generated by the clock buffer do not occur precisely at the same time as the rising and falling edges of the other clock signals. This misalignment of clock edges, or skew, is detrimental to system performance, but is reduced substantially by connecting all of the clock buffer's output clock signals together at a single physical point or node. Accordingly, the printed circuit board traces carrying each of the clock signals are routed to a single point node. A single point node is used to reduce skew caused by the clock buffer. Single point nodes also may be used at various locations on the printed circuit board to reduce skew caused by differences in the lengths of the traces carrying the clock signals.
Abstract:
A data processing system includes a backplane and a plurality of logic boards connected to the backplane by a plurality of connectors. In one embodiment of the invention, a set of common points is electrically coupled to the connectors by individual conductive traces between each common point and the corresponding pins of the connectors. The common points are preferably centrally located among the plurality of connectors to reduce propagation delay. A connector can be attached at the common points. The traces are separated from each other by lateral displacement in a single plane. If the backplane is a multi-layered printed circuit board, the traces are separated from each other by vertical displacement between the layers of the printed circuit board or by both vertical and horizontal displacement. The traces to the connectors nearest the common points have a minimum length greater than the distance between the nearest connectors and the common points.
Abstract:
A cross circuit comprises a lattice structure formed on a single layer of a multilayer printed circuit, the lattice structure having an arrangement of nodes consisting of two input nodes, two output nodes, a center node and four other nodes which are connected by quarter-wavelength lines. An input node is connected to both a first node and a second node by a quarter-wavelength line, and the other input node is connected to both the first node and a third node by a quarter-wavelength line. Similarly, an output node is connected to both the third node and a fourth node, the other output node to both the fourth node and the second node, the center node to the four nodes, by quarter-wavelength lines, respectively. A first input signal of a predetermined frequency applied to the first input node appears on only the first output node, and the second input signal of the same frequency applied to the second input node appears on only the second output node.
Abstract:
A heating arrangement for heating a seat has a temperature responsive element and a control circuit for controlling the supply of electrical current to the heating element which is embedded in the seat. The control circuits formed of components mounted on a flexible printed circuit board.