公开(公告)号：US09825014B2

公开(公告)日：2017-11-21

申请号：US15226209

申请日：2016-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Goo Cha ,  Yong Ii Kim ,  Wan tae Lim

IPC: H01L33/60 ,  H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H05K1/00 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/505 ,  H01L33/62 ,  H05K1/00 ,  H05K1/181 ,  H05K1/183 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2201/209 ,  H05K2203/104 ,  H05K2203/168 ,  Y02P70/611

Abstract: A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

公开(公告)号：US20170330708A1

公开(公告)日：2017-11-16

申请号：US15592480

申请日：2017-05-11

Applicant: CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN WATCH CO., LTD.

Inventor： Ryo WAKUDA

IPC: H01H13/14 ,  H05K1/18 ,  H01H13/04 ,  H05K1/11 ,  H01H13/52

CPC classification number: H01H13/14 ,  H01H13/04 ,  H01H13/52 ,  H01H2013/525 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/10053

Abstract: A switch component includes a spring plate and a cover of rubber. The cover of rubber covers at least one part of an upper surface of the spring plate. The cover of rubber includes at least one pair of supporting portions that support the spring plate.

公开(公告)号：US09622352B2

公开(公告)日：2017-04-11

申请号：US14429741

申请日：2012-09-26

Applicant: MEIKO ELECTRONICS CO., LTD.

Inventor： Ryoichi Shimizu ,  Mitsuo Iwamoto ,  Mitsuaki Toda

IPC: H05K3/30 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

Abstract: In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.

公开(公告)号：US09524931B2

公开(公告)日：2016-12-20

申请号：US14592105

申请日：2015-01-08

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Satoshi Shiraki

IPC: H01L23/12 ,  H01L23/053 ,  H01L21/20 ,  H01L21/36 ,  H01L23/498 ,  H05K1/11 ,  H01L25/10 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H05K1/14 ,  H05K3/00 ,  H01L23/29

CPC classification number: H01L23/49838 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1533 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: A wiring substrate includes a block with substrates laid out in an array. The block includes corners and a plan view center. Each substrate includes a substrate body. Pads are formed on the substrate body. Each pad includes a pad surface. The pads of the substrates include first pads, which are the pads of one of the substrates located in at least one of the corners of the block. The pad surface of each of the first pads includes a first axis extending from the first pad toward the plan view center of the block. The pad surface of each of the first pads has a first length along the corresponding first axis and a second length along a second axis, which is orthogonal to the first axis. The first length is longer than the second length.

Abstract translation: 布线基板包括具有布置在阵列中的基板的块。 该块包括角落和平面图中心。 每个基板包括基板主体。 垫片形成在基板主体上。 每个垫包括垫表面。 衬底的焊盘包括第一焊盘，其是位于块的至少一个角落中的一个衬底的焊盘。 每个第一焊盘的焊盘表面包括从第一焊盘朝向块的平面图中心延伸的第一轴。 每个第一焊盘的焊盘表面具有沿着对应的第一轴线的第一长度和沿着与第一轴线正交的第二轴线的第二长度。 第一长度比第二长度长。

公开(公告)号：US20160163610A1

公开(公告)日：2016-06-09

申请号：US14428376

申请日：2013-08-28

Applicant: Shimon PODVAL ,  QUBEICON LTD.

Inventor： Shimon Podval

IPC: H01L23/13 ,  H05K1/11 ,  H05K1/02 ,  H01L25/065 ,  H01L23/498 ,  H05K1/14

CPC classification number: H01L23/13 ,  H01L23/49838 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/49113 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81385 ,  H01L2924/00014 ,  H01L2924/15162 ,  H01L2924/15192 ,  H05K1/0204 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3442 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/0939 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

Abstract translation: 一种用于将半导体器件连接到外部电路的基座，所述基座包括：平面基板，由绝缘材料形成并且具有相对窄的边缘表面和第一和第二相对大的表面; 沿着边缘表面形成的至少一个凹部; 形成在所述至少一个凹部中的每一个的表面上的导电材料层; 所述第一表面上的第一多个焊盘被配置为与半导体器件电接触; 以及导电连接，每个导电连接将所述第一多个焊盘中的焊盘电连接到所述至少一个凹部的凹部的导电材料层。

公开(公告)号：US09192044B2

公开(公告)日：2015-11-17

申请号：US13862038

申请日：2013-04-12

Applicant: CANON KABUSHIKI KAISHA

Inventor： Seiji Hayashi ,  Takuya Kondo ,  Shoji Matsumoto

IPC: H05K1/16 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01L23/498

CPC classification number: H05K1/0216 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/48227 ,  H05K1/0228 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/114 ,  H05K1/116 ,  H05K1/14 ,  H05K1/141 ,  H05K1/162 ,  H05K1/18 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09454 ,  H05K2201/09463 ,  H05K2201/09636 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.

Abstract translation: 第一和第二信号布线图案形成在第一导体层中。 通过第一通孔电连接到第一信号布线图案的第一电极焊盘和通过第二通孔电连接到第二信号布线图案的第二电极焊盘形成在作为表面层的第二导体层中。 第三导体层设置在第一导体层和第二导体层之间，绝缘体插在这些导体层之间。 电连接到第一通孔的第一焊盘形成在第三导体层中。 第一焊盘包括与垂直于印刷电路板的表面的方向观察的与第二电极焊盘重叠并且通过绝缘体与第二电极焊盘相对的相对部分。 这使得能够减少在信号布线之间引起的串扰噪声。

公开(公告)号：US20150263250A1

公开(公告)日：2015-09-17

申请号：US14657474

申请日：2015-03-13

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA

IPC: H01L33/56 ,  H01L33/38 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/16225 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2203/048 ,  Y02P70/611

Abstract: Provided is an illumination device that includes a light emitting device having a first electrode and a second electrode and a mounting substrate including a first wiring pattern and a second wiring pattern. The first wiring pattern and the second wiring pattern face and are bonded to the first electrode and the second electrode, respectively, through a bonding material. The second electrode and the second wiring pattern are configured to be at least partially overlapped with each other in a plan view irrespective of an orientation of the light emitting device, under condition that the first electrode and the first wiring pattern are at least partially overlapped with each other in the plan view.

Abstract translation: 提供一种照明装置，其包括具有第一电极和第二电极的发光装置和包括第一布线图案和第二布线图案的安装基板。 第一布线图案和第二布线图案分别通过接合材料接合到第一电极和第二电极。 在第一电极和第一布线图案至少部分地与第一电极和第二布线图案重叠的条件下，第二电极和第二布线图案被配置为在平面图中至少部分地彼此重叠，而与发光器件的取向无关 在平面图中彼此相处。

公开(公告)号：US08610001B2

公开(公告)日：2013-12-17

申请号：US13106991

申请日：2011-05-13

Applicant: Hisashi Kato

Inventor： Hisashi Kato

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/3489 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/0939 ,  H05K2201/0969 ,  H05K2203/041 ,  H05K2203/0557

Abstract: A printed wiring board including an insulation layer, a conductive circuit on the insulation layer, an outermost interlayer resin insulation layer formed on the insulation layer and the conductive circuit and having a via-conductor opening connected to the conductive circuit, a land structure including a first land formed on the outermost interlayer resin insulation layer around the via-conductor opening and a second land formed on the outermost interlayer resin insulation layer around the first land, and a via conductor formed in the via-conductor opening through the outermost interlayer resin insulation layer such that the first land of the land structure on the outermost interlayer resin insulation layer is connected to the conductive circuit on the insulation layer. The land structure has a space between the first land and second land of the land structure, and the first land of the land structure is directly connected to the via conductor.

Abstract translation: 一种印刷线路板，包括绝缘层，绝缘层上的导电电路，形成在绝缘层上的最外层间树脂绝缘层和导电电路，并具有连接到导电电路的通路导体开口， 在通孔导体开口周围的最外层间树脂绝缘层上形成的第一焊盘和形成在第一焊盘周围的最外层间树脂绝缘层上的第二焊盘，以及通过最外层间树脂绝缘体形成在通孔导体开口中的通孔导体 使得最外层间树脂绝缘层上的焊盘结构的第一焊盘与绝缘层上的导电电路连接。 土地结构在土地结构的第一个土地和第二个土地之间有一个空间，土地结构的第一个土地直接连接到通道。

公开(公告)号：US20130048363A1

公开(公告)日：2013-02-28

申请号：US13304374

申请日：2011-11-24

Applicant: CHENG-FEI WENG ,  ZHENG-HENG SUN

Inventor： CHENG-FEI WENG ,  ZHENG-HENG SUN

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0293 ,  H05K2201/0305 ,  H05K2201/0939 ,  H05K2201/09909 ,  H05K2203/1105 ,  H05K2203/173 ,  Y10T29/49124

Abstract: A circuit board includes a board, a first signal trace and a second signal trace on the board, a first solder pad formed on the board and connected to a terminal of the first signal trace near to one end of the second signal trace, and a second pad formed on the board and connected to a terminal of the second signal trace near to the first solder pad. The second pad is apart from the first pad. The first pad or the second pad is coated with solder. After heated, the solder melts and spread to the second pad or the first pad, thereby connecting the first signal trace to the second signal trace.

Abstract translation: 电路板包括板上的第一信号迹线和板上的第二信号迹线，形成在板上并连接到靠近第二信号迹线的一端的第一信号迹线的端子的第一焊盘，以及 第二焊盘形成在板上并连接到靠近第一焊盘的第二信号迹线的端子。 第二垫与第一垫不同。 第一焊盘或第二焊盘涂覆有焊料。 加热后，焊料熔化并扩散到第二焊盘或第一焊盘，从而将第一信号迹线连接到第二信号迹线。

公开(公告)号：US08179690B2

公开(公告)日：2012-05-15

申请号：US12841336

申请日：2010-07-22

Applicant: Hsiang-Chih Ni ,  Ching-Feng Hsieh

Inventor： Hsiang-Chih Ni ,  Ching-Feng Hsieh

IPC: H05K7/06 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/78 ,  H01L2224/85399 ,  H01L2924/00014 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2203/048 ,  Y02P70/611 ,  Y10T29/49133 ,  Y10T29/49169 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least two cut edges, and the solder pads are installed in an alignment direction on the printed circuit board, such that the cut-edge positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract translation: 尖端定位型焊接结构和防止引脚偏移的方法可以防止当引脚​​通过焊料焊接到印刷电路板上时电子部件的多个引脚偏离，并且至少两个焊料 焊盘包括至少两个切割边缘，并且焊盘沿着印刷电路板上的排列方向安装，使得切边定位型焊接结构和防止引脚偏移的方法可以提高制造工艺的效率， 降低制造成本。