公开(公告)号：US20080036094A1

公开(公告)日：2008-02-14

申请号：US11896580

申请日：2007-09-04

Applicant: Yoshihiro Yoneda

Inventor： Yoshihiro Yoneda

IPC: H01L23/48

CPC classification number: H01L21/563 ,  H01L23/10 ,  H01L23/13 ,  H01L23/564 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H05K3/303 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/10674 ,  H05K2203/1147 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This disclosure provides a technique that prevents debonding at an interface between a functional device and a resin on reflow soldering in a functional device-mounted module requiring a hollow structure. Also disclosed is a functional device having a functional portion mounted on a substrate formed with predetermined wiring patterns, wherein the functional portion of the functional device is arranged in a receiving space, and the substrate is provided with a hole which communicates with the receiving space and a solder-introducing portion made of a metallic material compatible with solder. During solder reflowing, the functional device-mounted module is placed on a mounting substrate such that the solder-introducing portion of the functional device-mounted module contacts a solder paste, and solder is melted with heat. Water inside the receiving space is thus discharged, and solder is introduced into the hole due to surface tension, and the interior of the receiving space is sealed.

Abstract translation: 本公开提供了一种在需要中空结构的功能装置安装的模块中防止回流焊上的功能元件与树脂之间的界面脱粘的技术。 还公开了具有安装在形成有预定布线图案的基板上的功能部分的功能装置，其中功能装置的功能部分布置在接收空间中，并且基板设置有与接收空间连通的孔， 由与焊料相容的金属材料制成的焊料引入部。 在焊锡回流期间，功能元件安装模块被放置在安装基板上，使得功能元件安装模块的焊料引入部分接触焊膏，并且焊料被热熔化。 接收空间内的水因此被排出，并且由于表面张力将焊料引入孔中，并且容纳空间的内部被密封。

公开(公告)号：US20050063162A1

公开(公告)日：2005-03-24

申请号：US10327839

申请日：2002-12-23

Applicant: Tina Barcley

Inventor： Tina Barcley

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/09781

Abstract: A densely packed electronic assemblage has a substrate media for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the at least one heat generating component by absorbing heat from the at least one heat generating component.

Abstract translation: 密集封装的电子组件具有用于支撑至少一个发热部件的基板介质和用于降低至少一个发热部件的温度的装置。 散热器与除热元件配合，用于通过从至少一个发热部件吸收热量来减少至少一个发热部件的热量。

公开(公告)号：US20040207073A1

公开(公告)日：2004-10-21

申请号：US10844392

申请日：2004-05-13

Inventor： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC: H01L023/10

CPC classification number: H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

公开(公告)号：US20040187975A1

公开(公告)日：2004-09-30

申请号：US10820272

申请日：2004-04-08

Applicant: Fujikura Ltd.

Inventor： Tatsuo Suemasu ,  Takashi Takizawa

IPC: C22F001/00

CPC classification number: H01L21/76877 ,  C23C2/00 ,  C23C2/02 ,  C23C2/26 ,  H01L21/288 ,  H01L21/76882 ,  H01L21/76898 ,  H01L25/0657 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4076 ,  H05K3/426 ,  H05K2201/0305 ,  H05K2201/09572 ,  H05K2203/044 ,  H05K2203/085 ,  H05K2203/1394 ,  Y10S428/901 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2224/05599

Abstract: In the formation of through wirings in a silicon substrate and so forth, there was a need for the development of a technology that would allow metal to be reliably filled particularly in the vicinity of openings of through holes and other fine holes. This invention provides a metal filling method and member with filled metal sections in which, in the inflow and filling of a plating solution into through holes 11 of a substrate 10 by immersing said substrate 10 in heated and melted conductive metal, filled metal sections are formed by preliminarily forming a metal layer 15 on the inner surface of one of the ends of through holes 11 of this substrate 10 as well as on substrate top surface 13 around those openings, removing substrate 10 on which inflow and filling of the plating solution into through holes 11 has been completed from the plating solution, and then cooling to solidify the plating solution that has been filled into the through holes.

Abstract translation: 在硅衬底等中形成通过布线的方法中，需要开发一种能够使金属被可靠地填充到特别是通孔和其它细孔的开口附近的技术。 本发明提供了一种金属填充方法和具有填充金属部分的部件，其中，通过将所述基板10浸入加热和熔化的导电金属中，在将电镀液流入和填充到基板10的通孔11中时，形成填充的金属部分 通过在该基板10的通孔11的一个端部的内表面以及围绕这些开口的基板顶表面13上预先形成金属层15，去除基板10，电镀液的流入和填充通过 从电镀液中完成孔11，然后冷却固化已经填充到通孔中的电镀液。

公开(公告)号：US06784366B1

公开(公告)日：2004-08-31

申请号：US10457914

申请日：2003-06-10

Applicant: Edmund B. Boucher ,  Harold M. Cook ,  Jose N. Diaz

Inventor： Edmund B. Boucher ,  Harold M. Cook ,  Jose N. Diaz

IPC: H05K506

CPC classification number: H05K1/0206 ,  H05K7/205 ,  H05K2201/09572 ,  H05K2201/10166

Abstract: An electronic component (202), such as a power transistor, is formed of a molded plastic package having top (206), bottom (204) and side (208) surfaces and electrical contacts. A lead frame (210) attaches to one of the contacts and wraps about the component (202) so as to provide heat dissipation capability from the bottom and top surfaces of the molded plastic package.

Abstract translation: 诸如功率晶体管的电子部件（202）由具有顶部（206），底部（204）和侧面（208）表面和电触点的模制塑料封装形成。 引线框架（210）附接到触点中的一个并围绕部件（202）包裹，以便从模塑塑料封装的底表面和顶表面提供散热能力。

公开(公告)号：US06737770B2

公开(公告)日：2004-05-18

申请号：US10042305

申请日：2002-01-11

Applicant: Hideki Sunaga ,  Takeshi Ohba ,  Hiromi Kawarai ,  Kazunori Yamada ,  Narihito Sano

Inventor： Hideki Sunaga ,  Takeshi Ohba ,  Hiromi Kawarai ,  Kazunori Yamada ,  Narihito Sano

IPC: H01H3776

CPC classification number: H05K1/0201 ,  H01H37/761 ,  H01H2037/046 ,  H01H2037/763 ,  H02K11/01 ,  H02K11/21 ,  H02K11/215 ,  H02K11/25 ,  H02K11/27 ,  H02K11/33 ,  H05K1/0206 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/09572 ,  H05K2201/10181 ,  H05K2203/0455 ,  H05K2203/176

Abstract: A brushless motor for a blower fan unit has a circuit structure constituted by a drive control circuit and a fuse member. The drive control circuit supplying drive current comprises a first circuit section for eliminating surges of electric power and a second circuit section for controlling magnetic field generated by the stator. The first and second circuit sections are three-dimensionally arranged with a predetermined space therebetween. The fuse member electrically connects the first and second circuit sections. An end portion of the fuse member is welded with the first circuit section, and the other end portion of the fuse member is soldered with the second circuit section. The fuse member cuts an electrical connection between the first and second circuit sections when a temperature of solder becomes higher than a predetermined temperature.

Abstract translation: 用于鼓风机单元的无刷电动机具有由驱动控制电路和保险丝构件构成的电路结构。 提供驱动电流的驱动控制电路包括用于消除电力浪涌的第一电路部分和用于控制由定子产生的磁场的第二电路部分。 第一和第二电路部分三维地布置有它们之间的预定间隔。 保险丝构件电连接第一和第二电路部分。 保险丝部件的端部与第一电路部分焊接，并且熔丝部件的另一端部与第二电路部分焊接。 当焊料的温度变得高于预定温度时，熔丝部件切割第一和第二电路部分之间的电连接。

公开(公告)号：US20040084211A1

公开(公告)日：2004-05-06

申请号：US10284892

申请日：2002-10-30

Applicant: Sensonix, Inc.

Inventor： Robert T. Fayfield

IPC: H05K001/11

CPC classification number: H01L23/49805 ,  H01L23/49838 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09572 ,  H05K2201/10454 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2924/00

Abstract: A z-axis package for an electronic device and a method for making the z-axis packaging for the electronic device. The z-axis package is inexpensive to manufacture and can be assembled with automated surface mount equipment by the end user.

Abstract translation: 用于电子设备的z轴封装以及用于制造用于电子设备的z轴封装的方法。 z轴封装制造成本低廉，可由最终用户与自动表面贴装设备组装。

公开(公告)号：US06708873B2

公开(公告)日：2004-03-23

申请号：US10191378

申请日：2002-07-08

Applicant: Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

Inventor： Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

IPC: B23K3102

CPC classification number: H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  H01L2924/00

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e., at least 5:1 to be filled with an electrically conductive material such as a solder or a conductive polymer such that vias or interconnects can be formed in electronic substrates. The present invention apparatus and method can be advantageously used in fabricating substrates for display panels by forming conductive vias and interconnects for placing a voltage potential on pixel display elements formed on the display panels.

Abstract translation: 公开了一种用于填充电子基板中的高纵横比孔的装置和方法，其可以有利地用于填充具有大于5:1的纵横比的孔。 在装置中，填充板和真空板与连接装置结合使用，使得在两个板之间形成间隙以容纳配备有高纵横比通孔的电子基板。 填充板配备有注入槽，而真空板配备有真空槽，使得当基板夹在其中时，通孔可以从空气排出并同时从液体的底侧和顶侧注入液体 底物。 本发明的新型设备和方法允许填充具有小直径，即小至10um，高纵横比（即至少5:1）的通孔，以填充诸如焊料的导电材料 或导电聚合物，使得可以在电子基板中形成通孔或互连。 本发明的装置和方法可以有利地用于制造用于显示面板的基板，通过形成用于在形成在显示面板上的像素显示元件上放置电压电位的导电通孔和互连。

公开(公告)号：US20030111518A1

公开(公告)日：2003-06-19

申请号：US10017598

申请日：2001-12-18

Applicant: Xerox Corporation

Inventor： Robert J. Dances

IPC: B23K031/02 ,  B23K005/22 ,  B23K037/06 ,  B23K020/14

CPC classification number: H05K3/363 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/0061 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/10666

Abstract: A method and apparatus for depositing solder paste on a printed wiring board has a stencil with a pattern of multiple apertures. The pattern aligns with a through-hole in the printed wiring board when the stencil is in physical contact with the printed wiring board. A squeegee arrangement applies solder paste through the multiple apertures in the stencil through the through-hole of the printed wiring board to the upper surface of the printed wiring board for securely mounting electronic components to the upper surface of the printed wiring board, for providing a thermal path for the heat sinks of the electronic components and for providing a low inductance electrical path to ground for the electrical components.

公开(公告)号：US06555761B2

公开(公告)日：2003-04-29

申请号：US09751946

申请日：2000-12-29

Applicant: Dudi Amir

Inventor： Dudi Amir

IPC: H01R1204

CPC classification number: H05K3/0094 ,  H05K3/3484 ,  H05K3/429 ,  H05K2201/09572 ,  H05K2203/1394 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A plated-through hole via is substantially filled with solder rather than with traditional polymer to reduce printed circuit board failure due to outgassing from improperly cured polymer via fill. The solder via fill is in some embodiments eutectic or high-temperature solder, and in some further embodiments is capped at least one end with a barrier.