公开(公告)号：US20090096842A1

公开(公告)日：2009-04-16

申请号：US12288056

申请日：2008-10-16

Applicant: Tomoyuki Kubo ,  Koji Imai

Inventor： Tomoyuki Kubo ,  Koji Imai

IPC: B41J2/045 ,  B21D53/76

CPC classification number: B41J2/1609 ,  B41J2/14209 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14419 ,  B41J2002/14491 ,  H05K1/092 ,  H05K3/245 ,  H05K3/3452 ,  H05K3/363 ,  H05K2201/09427 ,  H05K2201/099 ,  H05K2203/0465 ,  Y10T29/49401

Abstract: A liquid droplet jetting apparatus includes: a liquid droplet jetting head which jets liquid droplets when an actuator is driven; and a wiring member via which a drive signal is outputted to a surface electrode formed in the actuator. The wiring member includes a substrate, a wire provided on the substrate, and a covering member having an insulating property and covering the wire. The wire has an electrode land which is stacked on the surface electrode to be connected to the surface electrode, and the covering member has a first covering layer in which a first opening to expose the electrode land therein is formed and a second covering layer having a second opening communicating with the first opening and covering the first covering layer. The surface electrode and the electrode land are connected in a state that an electroconductive material is interposed therebetween through the first and second openings.

Abstract translation: 液滴喷射装置包括：液滴喷射头，其在致动器被驱动时喷射液滴; 以及通过其将驱动信号输出到形成在致动器中的表面电极的配线构件。 布线构件包括基板，设置在基板上的线材和具有绝缘性且覆盖线材的覆盖部件。 导线具有层叠在表面电极上以与表面电极连接的电极焊盘，并且覆盖部件具有第一覆盖层，第一覆盖层形成有第一开口以暴露其中的电极焊盘;以及第二覆盖层，其具有 第二开口与第一开口连通并覆盖第一覆盖层。 表面电极和电极焊盘之间通过第一和第二开口插入导电材料的状态下连接。

公开(公告)号：US07518228B2

公开(公告)日：2009-04-14

申请号：US11819334

申请日：2007-06-27

Applicant: Shinji Moriyama ,  Tomio Yamada

Inventor： Shinji Moriyama ,  Tomio Yamada

IPC: H01L23/48

CPC classification number: H01L23/13 ,  H01L23/10 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H03G3/3042 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/183 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10371 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.

Abstract translation: 具有高安装可靠性的混合集成电路装置包括：模块基板，其是陶瓷布线基板，布置在模块基板的主表面上的多个电子部件部件，布置在模块基板的后表面上的多个电极端子 模块基板和固定到模块基板以覆盖模块基板的主表面的盖。 电极端子包括沿着模块基板的边缘排列的多个电极端子和位于内部的电源电压端子。 沿着基板边缘排列的电极端子至少在其靠近基板边缘的部分中涂覆有几十微米或更小的厚度的保护膜。 连接加强端子由彼此独立的多个分开的端子组成，并且是接地端子。

公开(公告)号：US07495866B2

公开(公告)日：2009-02-24

申请号：US10893301

申请日：2004-07-19

Applicant: Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

Inventor： Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

IPC: G11B5/55 ,  G11B21/08

CPC classification number: G11B33/121 ,  G11B5/4846 ,  G11B33/08 ,  G11B33/122 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/0133 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09918 ,  H05K2201/10386 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/166 ,  H05K2203/167

Abstract: A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are overlaid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.

Abstract translation: 固定构件与头致动器间隔预定距离。 柔性印刷电路板至少从头致动器延伸到固定构件。 柔性印刷电路板叠置在固定部件的表面上。 粘弹性层和保护层覆盖在柔性印刷电路板的表面上。 A夹将所有固定构件，柔性印刷电路板，粘弹性层和保护层夹在一起。 当头部滑块定位时，头部致动器相对于记录盘改变其姿态。 当致动器块停止转动时，基于旋转的惯性力使第一柔性印刷电路板振动。 粘弹性层用于吸收第一柔性印刷电路板的残余振动。 可以抑制柔性印刷电路板的振动。

公开(公告)号：US20090040450A1

公开(公告)日：2009-02-12

申请号：US12162810

申请日：2006-11-15

Applicant: Hiroaki Nakaminami

Inventor： Hiroaki Nakaminami

IPC: G02F1/1343 ,  H01R9/00

CPC classification number: H05K1/147 ,  G02F1/13452 ,  G02F2201/50 ,  G02F2202/22 ,  H05K1/0254 ,  H05K1/111 ,  H05K1/14 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/099 ,  H05K2201/09954 ,  H05K2201/10136 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2203/0191

Abstract: A circuit board capable of preventing driver ICs and electronic and electrical components from being affected by static electricity, a liquid crystal display module having the same, and a display device having the same. The liquid crystal display module includes a liquid crystal display panel, gate side common circuit boards including FPC connector bonding lands placed at both ends in longitudinal directions of the gate side common circuit boards, and source side common circuit boards, wherein the FPC connector bonding lands adjacent to the source side common circuit boards are mounted with FPC connectors and are electrically connected with the source side common circuit boards, and surfaces of the FPC connector bonding lands placed at the other ends are covered with an electrical insulating coating.

Abstract translation: 能够防止驱动IC和电子电气部件受静电影响的电路板，具有该电路板的液晶显示模块和具有该电路板的显示装置。 液晶显示模块包括液晶显示面板，栅极侧公共电路板，栅极侧公共电路基板，栅极侧公共电路基板的长度方向的两端侧的FPC连接器接合焊盘以及源极侧公共电路基板， 与源极侧公共电路板相邻地安装有FPC连接器并与源极公共电路板电连接，并且在另一端放置的FPC连接器接合面的表面被电绝缘涂层覆盖。

公开(公告)号：US07488898B2

公开(公告)日：2009-02-10

申请号：US11270102

申请日：2005-11-09

Applicant: Koji Otani

Inventor： Koji Otani

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: A land part where a connection part of an electronic part is soldered, includes a head end part. The head end part includes an inclination part. The inclination part may be formed by an end side. The end side may make a designated angle from an end line of the connection part of the electronic part.

Abstract translation: 焊接电子部件的连接部分的地面部分包括头端部。 头端部包括倾斜部。 倾斜部分可以由端部侧面形成。 端部可以从电子部件的连接部分的端部线形成指定角度。

公开(公告)号：US20090001139A1

公开(公告)日：2009-01-01

申请号：US12143429

申请日：2008-06-20

Applicant: Katsuhiko Tanno

Inventor： Katsuhiko Tanno

IPC: B23K1/20

CPC classification number: B23K1/20 ,  H01L21/4853 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/4602 ,  H05K2201/094 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/1476 ,  H01L2224/05599

Abstract: A method for manufacturing a printed wiring board, the method including forming a solder resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective joint pad. A metal ball having a first diameter is mounted in the small-diameter aperture by using a mask for small diameter metal balls, which includes a small-diameter aperture area that corresponds to the small-diameter aperture on the solder resist layer. A metal ball having a second diameter larger than the first diameter is mounted in the large-diameter aperture by using a mask for large diameter metal balls, which includes a large-diameter aperture area that corresponds to the large-diameter aperture on the solder resist layer. A small-diameter bump is formed from the metal ball having a first diameter and a large-diameter bump is formed from the metal ball having a second diameter by heating each of the metal ball with a first diameter and the metal ball with a second diameter to at least their respective reflow temperatures.

Abstract translation: 一种制造印刷电路板的方法，该方法包括形成具有小直径孔径和大直径孔径的阻焊层，每个孔暴露相应的接合垫。 具有第一直径的金属球通过使用用于小直径金属球的掩模安装在小直径孔中，该掩模包括对应于阻焊层上的小直径孔的小直径孔径区域。 通过使用大直径金属球的掩模将大直径大于第一直径的第二直径的金属球安装在大直径孔中，该掩模包括对应于阻焊层上的大直径孔的大直径开口面积 层。 由具有第一直径的金属球形成小直径凸块，并且通过加热具有第一直径的金属球的每个金属球，由具有第二直径的金属球形成大直径凸块，并且具有第二直径的金属球 至少其各自的回流温度。

公开(公告)号：US07453046B2

公开(公告)日：2008-11-18

申请号：US11698034

申请日：2007-01-26

Applicant: Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

Inventor： Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

IPC: H05K1/00

CPC classification number: G11B33/121 ,  G11B5/4846 ,  G11B33/08 ,  G11B33/122 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/0133 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09918 ,  H05K2201/10386 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/166 ,  H05K2203/167

Abstract: A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are overlaid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.

Abstract translation: 固定构件与头致动器间隔预定距离。 柔性印刷电路板至少从头致动器延伸到固定构件。 柔性印刷电路板叠置在固定部件的表面上。 粘弹性层和保护层覆盖在柔性印刷电路板的表面上。 A夹将所有固定构件，柔性印刷电路板，粘弹性层和保护层夹在一起。 当头部滑块定位时，头部致动器相对于记录盘改变其姿态。 当致动器块停止转动时，基于旋转的惯性力使第一柔性印刷电路板振动。 粘弹性层用于吸收第一柔性印刷电路板的残余振动。 可以抑制柔性印刷电路板的振动。

公开(公告)号：US20080277783A1

公开(公告)日：2008-11-13

申请号：US11760010

申请日：2007-06-08

Applicant: Seong Cheol KIM ,  Myung Geun PARK

Inventor： Seong Cheol KIM ,  Myung Geun PARK

IPC: H01L23/48

CPC classification number: H05K1/111 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/15311 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A printed circuit board and a flip chip package using the same are designed to minimize thermal stress due to different thermal coefficients present in areas having metal lines and solder resist versus other areas on the printed circuit board. The printed circuit board includes an insulation layer; a first metal line formed on one surface of the insulation layer and having at one end thereof a bump land and a projection which integrally extends from the bump land; a second metal line formed on the other surface of the insulation layer and having at one end thereof a ball land; a via metal line formed through the insulation layer to connect the first and second metal lines to each other; and solder resists formed on the upper and lower surfaces of the insulation layer to expose the bump land and the ball land.

Abstract translation: 印刷电路板和使用其的倒装芯片封装被设计成使得存在于具有金属线和阻焊剂的区域中存在的不同热系数与印刷电路板上的其它区域的热应力最小化。 印刷电路板包括绝缘层; 形成在所述绝缘层的一个表面上的第一金属线，并且在其一个端部处具有凸起区域和从所述凸起区域整体延伸的突起; 形成在所述绝缘层的另一个表面上并且在其一个端部处具有球形区域的第二金属线; 通过绝缘层形成的通孔金属线，以将第一和第二金属线彼此连接; 以及形成在绝缘层的上表面和下表面上的阻焊剂，以暴露凸起部分和球状区域。

公开(公告)号：US07414317B2

公开(公告)日：2008-08-19

申请号：US11105908

申请日：2005-04-13

Applicant: Hyo Soo Lee ,  Tae Gon Lee ,  Sung Eun Park

Inventor： Hyo Soo Lee ,  Tae Gon Lee ,  Sung Eun Park

IPC: H01L23/48 ,  H05K7/10

CPC classification number: H05K1/111 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05599 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/282 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/0353 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a periphery. With this bent structure of the dish configuration, the bonding pad provides an increased bonding area for the solder, so that the BGA package substrate is enhanced in reliability.

Abstract translation: 在BGA封装及其制造方法中，将接合焊盘从暴露表面蚀刻到绝缘层涂覆区域的一部分，以形成具有盘形结构的焊料接触侧，其在底部中心是平面的并且倾斜 在外围。 利用这种弯曲结构的配置，焊盘为焊料提供了增加的焊接面积，从而提高了BGA封装衬底的可靠性。

公开(公告)号：US07399694B2

公开(公告)日：2008-07-15

申请号：US11482764

申请日：2006-07-10

Applicant: Takashi Kikuchi ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Hiroshi Kawakukbo

Inventor： Takashi Kikuchi ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Hiroshi Kawakukbo

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H05K1/111 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2203/043 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.

Abstract translation: 通过制备具有多个NSMD结构的焊盘的封装衬底以及连接到每个焊盘并且已经以180度对称的位置相互布置的输出布线和虚拟布线，以及通过印刷方法印刷焊料 在封装组装之后的焊盘上的焊接层的高度的变化可以减小，并且实现了LGA（半导体器件）的安装性能的提高。