公开(公告)号：US5995380A

公开(公告)日：1999-11-30

申请号：US76269

申请日：1998-05-12

Applicant: H. Winston Maue ,  Bert W. Eakins

Inventor： H. Winston Maue ,  Bert W. Eakins

IPC: B60R16/02 ,  B60R16/023 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K3/18 ,  H05K3/36 ,  H02B1/20 ,  H01R9/09

CPC classification number: B60R16/0238 ,  H05K1/119 ,  H05K1/095 ,  H05K1/144 ,  H05K2201/0187 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2203/0113 ,  H05K3/182 ,  H05K3/368 ,  Y10S439/949

Abstract: An electrical junction box has a first insulating polymeric portion and a second polymeric portion defining multiple electrically conductive circuits. The circuits are at least partially separated by the first insulating polymeric portion and at least some of the circuits electrically connect together wire harness connector portions. A further aspect of the present invention junction box causes a section of the first insulating polymeric portion to concurrently act as a segment of an outer protective cover for the junction box.

Abstract translation: 电接线盒具有限定多个导电电路的第一绝缘聚合物部分和第二聚合物部分。 电路至少部分地由第一绝缘聚合物部分分开，并且至少一些电路将线束连接器部分电连接在一起。 本发明接线盒的另一方面使得第一绝缘聚合物部分的一部分同时作为用于接线盒的外部保护盖的部分。

公开(公告)号：US5377081A

公开(公告)日：1994-12-27

申请号：US956063

申请日：1992-10-02

Applicant: Tatsuo Bizen ,  Atsushi Inoue ,  You Funada ,  Masao Uno ,  Toshio Hata ,  Kouichi Kongo

Inventor： Tatsuo Bizen ,  Atsushi Inoue ,  You Funada ,  Masao Uno ,  Toshio Hata ,  Kouichi Kongo

IPC: H01L23/00 ,  H01L25/16 ,  H05K1/00 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K5/00 ,  H05K9/00

CPC classification number: H05K1/141 ,  H01L25/165 ,  H05K5/0091 ,  H05K9/0007 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K2201/045 ,  H05K2201/0999 ,  H05K2201/10371 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/368

Abstract: The size precision of a surface mountable electronic part is improved and a production thereof is simplified. The surface mountable electronic part is constructed such that a circuit substrate is housed in a shield case of which an end side is open, and the shield case is a resin case having a shield film. A connection pattern is formed on the inner surface of the case, with one end of the connection pattern being disposed so as to correspond to an external connection land of the circuit substrate, and with the other end of the connection pattern extending to the open end of the case.

Abstract translation: 表面安装电子部件的尺寸精度得到改善并且其生产简化。 可表面安装的电子部件被构造成使得电路基板容纳在端侧敞开的屏蔽壳体中，并且屏蔽壳体是具有屏蔽膜的树脂壳体。 连接图案形成在壳体的内表面上，连接图案的一端设置成与电路基板的外部连接台相对应，连接图案的另一端延伸到开口端 的情况。

公开(公告)号：US5329696A

公开(公告)日：1994-07-19

申请号：US900121

申请日：1992-06-18

Applicant: Takeshi Morita ,  Osamu Hayashi

Inventor： Takeshi Morita ,  Osamu Hayashi

IPC: H05K1/18 ,  B29C33/14 ,  B29C45/14 ,  B29C70/68 ,  H05K3/00 ,  H05K3/28 ,  H05K7/14 ,  H05K3/30

CPC classification number: H05K3/284 ,  B29C33/14 ,  B29C45/14639 ,  B29C70/68 ,  H05K3/0014 ,  H05K3/0058 ,  B29C2045/14114 ,  B29C2045/14852 ,  B29K2069/00 ,  B29L2031/3406 ,  B29L2031/3425 ,  B29L2031/3481 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10689 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1327 ,  Y10S428/901 ,  Y10T29/49146 ,  Y10T29/49155

Abstract: An electronic device comprises a housing made of a polycarbonate resin, and a novel double-sided printed circuit board. The printed circuit board has one side embedded in the housing, and the other side exposed to the interior of the housing. A plurality of refractory electronic components are mounted onto one side of the printed circuit board and include a resistor and a capacitor. A plurality of lower refractory electronic components are mounted onto the other side of the housing and include a semiconductor integrated circuit, and a transformer. Preferably, an insulating layer is applied to cover the one side of the printed circuit board and the refractory electronic components. Also, a metal layer is applied to cover the insulating layer and the inner surface of the housing.

Abstract translation: 电子设备包括由聚碳酸酯树脂制成的壳体和新颖的双面印刷电路板。 印刷电路板的一侧嵌入壳体中，另一侧暴露于壳体的内部。 多个难熔电子部件安装在印刷电路板的一侧，并且包括电阻器和电容器。 多个下部耐火电子部件安装在壳体的另一侧，并且包括半导体集成电路和变压器。 优选地，施加绝缘层以覆盖印刷电路板和难熔电子部件的一侧。 此外，施加金属层以覆盖绝缘层和壳体的内表面。

公开(公告)号：US5285010A

公开(公告)日：1994-02-08

申请号：US976444

申请日：1992-11-13

Applicant: Elmar Huber

Inventor： Elmar Huber

IPC: H01R12/04 ,  H01R13/03 ,  H05K3/40 ,  H05K5/00 ,  H05K1/14

CPC classification number: H05K5/0069 ,  H05K3/4092 ,  H01R13/035 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/0999 ,  Y10S439/931

Abstract: In a control device (11), the strip conductors (29) are applied to the interior wall (28) of the housing (15), consisting of plastic, with integrated plugs (16) with the aid of novel deposition processes. In this case the laser-assisted deposition process or the Ivonding.RTM. process can be used in a particularly advantageous manner. It is possible by means of these types of manufacture to dispose the plug connectors (24) in a simple manner in a through-bore (23) in the housing (15) and to connect them directly with the strip conductors (29) on the interior wall (28). Bonded connections (31) for connecting hybrid circuits (13), for example, can be attached in a simple manner at the other end of the strip conductors (29). Because of this, it is possible to automate the manufacturing process to a large degree and to make it inexpensive.

Abstract translation: 在控制装置（11）中，带状导体（29）借助于新颖的沉积工艺被施加到由塑料构成的壳体（15）的内壁（28）上，并具有集成塞子（16）。 在这种情况下，可以以特别有利的方式使用激光辅助沉积工艺或Ivonding（商标）工艺。 通过这些类型的制造可以将插头连接器（24）以简单的方式设置在壳体（15）中的通孔（23）中并将它们直接连接到壳体（15）中的带状导体（29）上 内墙（28）。 用于连接混合电路（13）的接合连接（31）例如可以以简单的方式附接在带状导体（29）的另一端。 因此，可以在很大程度上使制造过程自动化并使其便宜。

公开(公告)号：US5246386A

公开(公告)日：1993-09-21

申请号：US857159

申请日：1992-03-25

Applicant: Hideo Nanjo

Inventor： Hideo Nanjo

IPC: H01H9/02 ,  H01R13/03 ,  H01R13/658 ,  H01R13/66 ,  H01R33/76 ,  H05K1/11

CPC classification number: H05K1/119 ,  H01R13/035 ,  H01R13/6658 ,  H01R13/6599 ,  H05K2201/09118 ,  H05K2201/0999 ,  Y10S439/931 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: A structure for a terminal plug includes a thermoplastic resin base having a key boss and a plurality of protruding shafts formed integrally on a front side thereof. Terminal pins are formed on the plurality of protruding shafts by a chemical plating process. Connection patterns are disposed on the front side of the thermoplastic resin base and connected to said terminal pins, and circuit patterns are disposed on the back side of the thermoplastic resin base. A plurality of through-holes are formed in the thermoplastic resin base which electrically connect the connection patterns and the circuit patterns.

公开(公告)号：US5124508A

公开(公告)日：1992-06-23

申请号：US567194

申请日：1990-08-14

Applicant: Denyse DuBrucq

Inventor： Denyse DuBrucq

IPC: H01L23/58 ,  H01M2/10 ,  H01M2/20 ,  H01M6/16 ,  H01M6/40 ,  H01M6/42 ,  H01M10/42 ,  H01M10/46 ,  H02J7/35 ,  H05K1/16

CPC classification number: H01M10/4257 ,  H01L23/58 ,  H01M10/46 ,  H01M2/1066 ,  H02J7/355 ,  H05K1/16 ,  H01L2924/0002 ,  H01M2/20 ,  H01M6/16 ,  H01M6/40 ,  H01M6/42 ,  H05K2201/0999

Abstract: Using sheet battery material as a circuit board substrate eliminates the weight and bulk of batteries as a separate circuit component and also eliminates the weight and bulk of fiberglass substrate or flex substrate as printed circuit materials. Insets with wiring built in can give vertical wiring between two or more circuit layers and can support electronic components which have leads connecting wiring on more than one layer of a printed circuit. Connector clips inserted when the connector pins are polarized target connection to power and to ground components of one or more layers of sheet battery. Using these connections between battery substrate components of the structure allows a single power source as A-C or solar to recharge all battery substrate in the electronic component. The effect of application of these discoveries is to reduce the size and mass of the circuit and thus reduce the size and weight of electrronic devices from hearing aids and flash lights to portable computers, from video cameras to mini and portable television sets and radios.

Abstract translation: 使用片状电池材料作为电路板基板消除了作为单独的电路部件的电池的重量和体积，并且还消除了作为印刷电路材料的玻璃纤维基板或柔性基板的重量和体积。 内置线路的插座可以在两个或更多个电路层之间提供垂直布线，并且可以支持具有引线的电子部件，该引线在多个印刷电路层上连接布线。 当连接器引脚极化时插入的连接器夹具目标连接到电源和一层或多层片状电池的接地部件。 使用结构的电池基板部件之间的这些连接允许单个电源作为A-C或太阳能来对电子部件中的所有电池基板进行再充电。 这些发现的应用的效果是减小电路的尺寸和质量，从而将电子设备的尺寸和重量从助听器和闪光灯减小到便携式计算机，从摄像机到迷你和便携式电视机和无线电。

公开(公告)号：US5003693A

公开(公告)日：1991-04-02

申请号：US443402

申请日：1989-09-11

Applicant: Anthony Atkinson ,  Richard Gray ,  Oscar L. Denes

Inventor： Anthony Atkinson ,  Richard Gray ,  Oscar L. Denes

IPC: B29C45/14 ,  B29C70/78 ,  H01B13/00 ,  H01C17/06 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16 ,  H05K3/00 ,  H05K3/20

CPC classification number: B29C45/1418 ,  B29C45/0053 ,  B29C45/0055 ,  B29C70/78 ,  H05K3/0014 ,  H05K3/207 ,  B29C2045/14237 ,  B29C2791/006 ,  B29C45/14639 ,  B29C45/14778 ,  B29C45/14827 ,  B29C51/082 ,  B29C51/10 ,  B29C51/14 ,  B29K2067/00 ,  B29K2995/0005 ,  B29L2009/008 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/165 ,  H05K2201/0376 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/0156 ,  H05K2203/1327 ,  H05K3/007 ,  Y10T29/4916

Abstract: A method of providing an electrical circuit wherein a carrier, which is a film of insulating plastic material with a circuit pattern thereon is supported in a mould and a moulding material is applied by the application of heat and pressure to provide a substrate so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.

公开(公告)号：US4884125A

公开(公告)日：1989-11-28

申请号：US107990

申请日：1987-10-13

Applicant: Norio Miura

Inventor： Norio Miura

IPC: H01L23/14 ,  H01L25/16 ,  H05K1/05 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01L23/142 ,  H01L25/165 ,  H05K3/366 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/3025 ,  H05K1/056 ,  H05K1/118 ,  H05K1/144 ,  H05K2201/0999 ,  H05K2201/10424 ,  H05K2201/10946 ,  H05K3/363

Abstract: A hybrid integrated circuit device comprises a metal substrate, a casing member and external leads. An insulating film is formed on the metal substrate, conductive paths are formed on the insulating film, circuit elements are connected to the conductive paths, and conductive pads are formed in the tip portions of the conductive paths. The casing member comprises a sealing portion surrounding the circuit elements and a connector portion projected from the bottom portion of the sealing portion and extending beyond an end of the metal substrate, and formed of insulating resin. Each of the external leads has one end connected to each of the conductive pads and supported by the side surface of the connector portion.

Abstract translation: 混合集成电路装置包括金属基板，壳体构件和外部引线。 在金属基板上形成绝缘膜，在绝缘膜上形成导电路径，将电路元件与导电路径连接，在导电路径的前端形成导电焊盘。 壳体构件包括围绕电路元件的密封部分和从密封部分的底部突出并延伸超过金属基底的端部并由绝缘树脂形成的连接器部分。 每个外部引线的一端连接到每个导电焊盘并由连接器部分的侧表面支撑。

公开(公告)号：US4727285A

公开(公告)日：1988-02-23

申请号：US751889

申请日：1985-07-05

Applicant: Koki Taniguchi

Inventor： Koki Taniguchi

IPC: G02F1/13 ,  G02F1/1333 ,  G09F9/00 ,  H05K1/00 ,  H05K1/05 ,  H05K1/18 ,  H05K3/32 ,  H01J5/50

CPC classification number: G02F1/13452 ,  G09F9/00 ,  H05K1/0284 ,  H05K3/325 ,  G02F2001/133334 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/0314 ,  H05K2201/0999 ,  H05K2203/302

Abstract: A PC board consisting of a conductive layer laid through an insulating layer on a metal plate surface is easily bendable to make any desirable shape. This permits any desired distance to be provided between the display element and the PC board. In addition, it is possible to form display element-fixing angles integrally with the PC board. As a result, the number of components required is decreased and production efficiency improved. Moreover, the metal plate of the PC board protects the display device from unnecessary radiation, external noises and/or static electricity.

Abstract translation: 由金属板表面上的绝缘层铺设的导电层构成的PC板容易弯曲以形成所需的形状。 这允许在显示元件和PC板之间提供任何期望的距离。 此外，可以与PC板一体地形成显示元件固定角度。 因此，需要的部件数量减少，生产效率提高。 此外，PC板的金属板保护显示装置免受不必要的辐射，外部噪声和/或静电。

公开(公告)号：US3755891A

公开(公告)日：1973-09-04

申请号：US3755891D

申请日：1971-06-03

Applicant: HAWKINS S ,  MUCKELROY W

Inventor： MUCKELROY W ,  HAWKINS S

IPC: H01R12/55 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16 ,  H05K1/18 ,  H05K1/04

CPC classification number: H05K1/189 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/16 ,  H05K2201/09018 ,  H05K2201/09181 ,  H05K2201/0999 ,  H05K2201/10363 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10651 ,  Y10T29/49155

Abstract: Three Dimensional Circuit Modules For Thick-Film Circuits And The Like And Methods For Making Same are provided in which such circuits are printed in selected portions on both the internal and external walls of a hollow cylindrical substrate to remove the crossovers normally present in an equivalent planar circuit configuration. The circuit sections are disposed on the substrate such that common connections therebetween are effected by conductive clips straddling the end faces of the substrate in notches or declivities formed therein to receive the clips. Like declivities are utilized to both physically and electrically interconnect a plurality of substrates and/or external circuit components and the like. These substrates also comprise a housing for self-contained functional circuit modules of the foregoing type.

Abstract translation: 提供用于厚膜电路等的三维电路模块及其制造方法相同的方法，其中这些电路以中空圆柱形基板的内壁和外壁的选定部分印刷，以去除通常存在于等效平面中的交叉 电路配置。 电路部分设置在基板上，使得它们之间的公共连接通过以形成在其中的凹口或倾斜度跨接在基板的端面上的导电夹来实现，以接收夹子。 类似的表现被用于物理和电互连多个基板和/或外部电路部件等。 这些基板还包括用于上述类型的独立功能电路模块的壳体。