公开(公告)号：US6081996A

公开(公告)日：2000-07-04

申请号：US177586

申请日：1998-10-23

Applicant: Victor David Kruppa ,  Maurice Lydell Dantzler ,  Robert Ray Voltenburg, Jr.

Inventor： Victor David Kruppa ,  Maurice Lydell Dantzler ,  Robert Ray Voltenburg, Jr.

IPC: H05K3/34 ,  H05K3/40 ,  H01R9/00 ,  H05K3/38

CPC classification number: H01R12/57 ,  H05K3/4046 ,  H05K2201/10295 ,  H05K3/3447 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: In a preferred embodiment, a through hole connector pin for a circular through hole defined through a printed circuit board substrate, including: a vertical cylindrical portion of the connector pin for insertion in the circular through hole, the vertical cylindrical portion having a diameter less than that of the circular through hole; and a horizontal offset head portion of the connector pin formed integrally with the vertical cylindrical portion, the horizontal offset head portion having a shape approximating that of a conductive pad disposed on an upper surface of the printed circuit board substrate.

Abstract translation: 在一个优选实施例中，一个用于通过印刷电路板基板限定的圆形通孔的通孔连接器销，包括：用于插入圆形通孔的连接器销的垂直圆柱形部分，垂直圆柱形部分的直径小于 圆形通孔; 以及与所述垂直圆柱形部分一体形成的所述连接器销的水平偏移头部，所述水平偏移头部具有与设置在所述印刷电路板基板的上表面上的导电焊盘的形状近似的形状。

公开(公告)号：US5890284A

公开(公告)日：1999-04-06

申请号：US978110

申请日：1997-11-25

Applicant: Richard L. Chartrand ,  Wai-Mon Ma ,  Roger A. Stinemire

Inventor： Richard L. Chartrand ,  Wai-Mon Ma ,  Roger A. Stinemire

IPC: H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/40

CPC classification number: H05K3/3436 ,  H05K1/114 ,  H05K3/225 ,  H05K2201/09581 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10734 ,  H05K2201/10962 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K3/3426 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49167 ,  Y10T29/49728 ,  Y10T29/4973

Abstract: In aspect, the present invention is directed to a method of modifying a circuit board having at least one Ball Grid Array (BGA). The method includes removing the via portion of the BGA pad from the circuit board to sever the connection between the via and the circuit, attaching the pad connector to the circuit board, and connecting the pad connector to the circuit of the circuit board.

Abstract translation: 在本发明中，本发明涉及一种修改具有至少一个球栅阵列（BGA）的电路板的方法。 该方法包括从电路板去除BGA焊盘的通孔部分，以切断通孔和电路之间的连接，将焊盘连接器连接到电路板，以及将焊盘连接器连接到电路板的电路。

公开(公告)号：US5619018A

公开(公告)日：1997-04-08

申请号：US415413

申请日：1995-04-03

Applicant: Markku J. Rossi

Inventor： Markku J. Rossi

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/308 ,  H01R12/523 ,  H05K3/4046 ,  H05K3/4641 ,  H05K1/0272 ,  H05K1/09 ,  H05K2201/0352 ,  H05K2201/09063 ,  H05K2201/0919 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K3/4676 ,  H05K3/4697

Abstract: A multilayer printed circuit board comprising conducting layers of a first material and conducting layers of a second material includes noncorrosive low resistance electrical contacts between conducting layers of the first and second material. The noncorrosive low resistance contacts allow the use of light weight conducting materials for particular layers of the circuit board to produce a light weight multilayer circuit board.

Abstract translation: 包括第一材料的导电层和第二材料的导电层的多层印刷电路板包括在第一和第二材料的导电层之间的非腐蚀性低电阻电接触。 非腐蚀性低电阻触点允许使用用于电路板的特定层的重量轻的导电材料来制造重量轻的多层电路板。

公开(公告)号：US5334059A

公开(公告)日：1994-08-02

申请号：US931064

申请日：1992-08-17

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01L23/498 ,  H01R4/02 ,  H01R12/55 ,  H01R43/02 ,  H01R43/16 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01R4/02 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/3405 ,  H05K3/366 ,  H01L2924/0002 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/3421 ,  H05K3/3447 ,  Y10T29/49179 ,  Y10T29/49204

Abstract: A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.

Abstract translation: 一种用于连接到衬底表面的焊接轴，其中离散质量的焊料被引线牢固地机械地保持在允许靠近衬底表面的位置，以将引线与电气和机械接合 在焊料熔化时，引线体具有部分地环绕焊料块的一对指状物，其中指状物之间的间隙提供用于熔化的焊料到衬底的畅通无阻的流动。 引线还可以用于将第一衬底互连到第二衬底，在两个衬底上的导电区域之间形成结合。

公开(公告)号：US5267125A

公开(公告)日：1993-11-30

申请号：US958305

申请日：1992-10-08

Applicant: Morgan C. Liu

Inventor： Morgan C. Liu

IPC: H01R4/64 ,  H05K9/00 ,  H01R4/66 ,  H01R23/68 ,  H05K5/02

CPC classification number: H01R12/585 ,  H01R4/64 ,  H05K9/0039 ,  H01R23/68 ,  H05K1/0215 ,  H05K1/184 ,  H05K2201/10295 ,  Y10T24/304 ,  Y10T24/42

Abstract: A flexible grounding element comprises a rectangular base portion, and a pair of side portions extending obliquely and upward from the edges of the base portion. Each of the side portions includes a pair of slots at the intermediate portion of its edges. One of the side portions bends toward the other one of the side portions at the location adjacent to the slot to form a bend portion. The front end of the bend portion bends upward to form an end portion which contactably touches the inner side of the other side portion. As the side portions are being pressed, a portion of each side portion will pass through the hole of a mother board, and as the side portions are released, the slots thereof will urge against the inner rim of the hole to effect positioning. Furthermore, each corner of the base portion has a flexible plate which includes a protrusion at the bottom thereof. After the flexible grounding element has been inserted into the mother board, the base portion will urge against the surface of the base plate, thereby exerting a compressive force on the protrusions of the flexible plates. The flexible plates will be urged to bend upward and the resulted counter force will force the flexible grounding element to firmly engage between the mother board and base plate.

Abstract translation: 柔性接地元件包括矩形基部和从基部的边缘倾斜向上延伸的一对侧部。 每个侧部分在其边缘的中间部分包括一对槽。 侧面部分中的一个在邻近狭槽的位置处朝着另一个侧部弯曲以形成弯曲部分。 弯曲部分的前端向上弯曲以形成可接触地接触另一侧部分的内侧的端部。 当侧部被按压时，每个侧部的一部分将穿过母板的孔，并且当侧部被释放时，其槽将推动抵靠孔的内边缘以实现定位。 此外，基部的每个角部具有柔性板，该柔性板在其底部包括突起。 在将柔性接地元件插入母板之后，基部将推动抵靠基板的表面，从而对柔性板的突起施加压缩力。 柔性板将被推动向上弯曲，并且产生的反作用力将迫使柔性接地元件牢固地接合在母板和基板之间。

公开(公告)号：US4977042A

公开(公告)日：1990-12-11

申请号：US446762

申请日：1989-12-06

Applicant: Masanobu Chiyajo ,  Toshio Kuroki ,  Eiji Sakata

Inventor： Masanobu Chiyajo ,  Toshio Kuroki ,  Eiji Sakata

IPC: B26B19/28 ,  B26B19/38 ,  H01M2/10 ,  H01M2/20 ,  H01M2/34 ,  H01M10/46 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/18 ,  B26B19/286 ,  B26B19/3853 ,  B26B19/3873 ,  H01M10/46 ,  H01M2/1055 ,  H01M2/20 ,  H05K1/0293 ,  H05K1/117 ,  H01M2/34 ,  H05K1/0292 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/094 ,  H05K2201/10037 ,  H05K2201/10295 ,  H05K2201/10606 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/175 ,  H05K2203/176 ,  H05K3/3447

Abstract: A rechargeable type small electric appliance including a rechargeable battery having negative and positive terminals, the negative and positive terminals being, respectively, connected to a wiring board by a pair of lead members, in which at least one of the lead members is bent in an inverse U-shape so as to have first and second pieces and a bent portion connecting the first and second pieces, the first piece being secured to the wiring board, while the second piece is clamped, at a clamp portion thereof, to a corresponding one of the negative and positive terminals, the bent portion projecting outwardly beyond the clamp portion of the second piece in a radial direction of the rechargeable battery.

公开(公告)号：US4623206A

公开(公告)日：1986-11-18

申请号：US687528

申请日：1984-12-28

Applicant: James T. Fuller

Inventor： James T. Fuller

IPC: G06F1/20 ,  H01M2/10 ,  H01R12/55 ,  H05K3/30 ,  H05K3/34 ,  H05K5/00 ,  H01R9/09 ,  A47B97/00

CPC classification number: H05K3/301 ,  H01M2/1044 ,  H05K5/0086 ,  H01R12/58 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10643 ,  H05K3/3447

Abstract: There is disclosed herein a spring battery retainer that is used to secure a small "coin" or "button" battery to a printed circuit (PC) card or the like. Use of the spring battery retainer provides for positive location of the battery, inexpensive electrical contacts for the battery terminals and positive spring compression that is necessary to insure hard contact with the cathode and the anode terminals of the battery. The battery is easily installed and removed by slightly lifting one end of the battery retainer and sliding the battery in or out. A bend in the spring battery retainer provides sufficient hold-down pressure so that the battery makes reliable contact with an electrical pad located on a PC board. The spring battery retainer is inserted into the PC card and then soldered to it in much the same way as a standard electrical component such as a resistor. The dimensions of the spring battery retainer can be varied so that coin or button batteries of various sizes can be securely fastened to a PC card.

Abstract translation: 这里公开了用于将小的“硬币”或“按钮”电池固定到印刷电路（PC）卡等的弹簧电池保持器。 使用弹簧电池固定器可以提供电池的正确位置，为电池端子提供便宜的电气触点和正确的弹簧压缩，以确保与电池的阴极和阳极端子的硬接触。 通过轻轻抬起电池固定器的一端并将电池滑入或滑出即可轻松安装和拆卸电池。 弹簧电池固定器中的弯曲部提供足够的压紧压力，使得电池与位于PC板上的电焊垫可靠接触。 将弹簧电池固定器插入PC卡，然后以与电阻器等标准电气部件相同的方式焊接到PC卡。 可以改变弹簧电池固定器的尺寸，使得各种尺寸的硬币或纽扣电池可以牢固地固定在PC卡上。

公开(公告)号：US4072377A

公开(公告)日：1978-02-07

申请号：US684884

申请日：1976-05-10

Applicant: Harley J. Van de Loo ,  Hans J. Ziegler

Inventor： Harley J. Van de Loo ,  Hans J. Ziegler

IPC: H01R9/24 ,  H02G15/076 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H05K1/10

CPC classification number: H05K1/118 ,  H01R12/58 ,  H01R9/2466 ,  H02G15/076 ,  H05K3/308 ,  H01R12/613 ,  H01R12/62 ,  H05K1/0393 ,  H05K2201/096 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/1078 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/1446 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/3447

Abstract: A terminal block includes a printed circuit element which has conductive paths deposited on one of its surfaces, with each path extending from a terminal area surrounding an opening in the element to a centralized area. In one embodiment, the printed circuit element is a rigid board and terminals are mounted on the board and extend through each opening and project outwardly on the opposite surface of the board. The terminals are swedged at one end to physically retain them on the board and to electrically connect them to the conductive path. The rigid board is attached to an open box-like shell through which a cable carrying wire conductor extends and connects, interior to the block, to the conductive paths on the circuit board. In another embodiment, the circuit element is a flat, flexible sheet which is disposed against a support board provided with apertures aligned with the openings in the flexible sheet. The terminals extend through both the board and the sheet and may be swedged at one end to grip the support board and flexible element and to electrically connect the terminals to the conductive path. Alternately, the terminals may be soldered to the terminal area surrounding an opening of the flexible sheet. A back plate may be connected to the board to sandwich the flexible sheet therebetween.

Abstract translation: 端子块包括具有沉积在其表面之一上的导电路径的印刷电路元件，每个路径从围绕元件中的开口的端子区域延伸到集中区域。 在一个实施例中，印刷电路元件是刚性板，并且端子安装在板上并延伸穿过每个开口并在板的相对表面上向外突出。 端子在一端被摆动，以物理地将它们保持在板上并将它们电连接到导电路径上。 刚性板连接到敞开的箱状壳体上，电缆承载线导体通过该外壳延伸并连接到块体内部到电路板上的导电路径。 在另一个实施例中，电路元件是平坦的柔性片材，其被设置为抵靠设置有与柔性片材中的​​开口对准的孔的支撑板。 端子延伸穿过板和板，并且可以在一端被卷绕以夹持支撑板和柔性元件并且将端子电连接到导电路径。 或者，端子可以焊接到围绕柔性片的开口的端子区域。 背板可以连接到板以将柔性片夹在其间。

公开(公告)号：US3891789A

公开(公告)日：1975-06-24

申请号：US30519272

申请日：1972-11-09

Applicant: AMP INC

Inventor： SWENGEL SR ROBERT CHARLES ,  CRUMLEY J A

IPC: B23K9/22 ,  H01R4/02 ,  H01R43/02 ,  H05K3/32 ,  H05K3/40 ,  H05K1/18

CPC classification number: H01R4/029 ,  B23K9/22 ,  H01R43/02 ,  H05K3/328 ,  H05K3/4046 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10628

Abstract: A welding method and means is disclosed utilizing a conductive foil disposed between or adjacent members to be welded together with the foil serving as one electrode and one or both of the members serving as another electrode of the welding circuit and with the members being forced together or with the foil being forced against the members by a separate electrode.

公开(公告)号：US3875479A

公开(公告)日：1975-04-01

申请号：US35806973

申请日：1973-05-07

Applicant: JAGGAR GILBERT R

Inventor： JAGGAR GILBERT R

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/308 ,  H05K1/0298 ,  H05K1/112 ,  H05K2201/0919 ,  H05K2201/09472 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10871 ,  H05K2201/10962

Abstract: Internal printed circuits on multi-layer or laminated circuit boards are electrically connected to resistors, capacitors and the like circuit components by connector pins that abut the internal printed circuit at an end extremity and are frictionally held in a hole in the board that to the exterior of the board only at the component mounting side of the board. The pins have a shoulder that limits the penetration during assembly procedures and another hole in which the lead wire of the circuit component is frictionally engaged.

Abstract translation: 多层或层压电路板上的内部印刷电路通过连接器引脚电连接到电阻器，电容器和类似的电路部件，连接器引脚在端部端部与内部印刷电路相接触，并摩擦地保持在板上的孔中 仅在板的元件安装侧。 销具有限制装配过程中的穿透的肩部，以及电路部件的引线摩擦接合的另一个孔。