公开(公告)号：US20080151516A1

公开(公告)日：2008-06-26

申请号：US11959232

申请日：2007-12-18

Applicant: Daigo Suzuki ,  Minoru Takizawa ,  Nobuhiro Yamamoto ,  Hidenori Tanaka

Inventor： Daigo Suzuki ,  Minoru Takizawa ,  Nobuhiro Yamamoto ,  Hidenori Tanaka

IPC: H05K1/18 ,  H05K3/36 ,  H05K1/02

CPC classification number: H05K1/186 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19043 ,  H05K1/113 ,  H05K3/4611 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y10T29/49126 ,  H01L2224/05599

Abstract: According to one embodiment, there is provided a printed-wiring board, includes a first base member including a component mounting face, a first electronic component with a through-electrode mounted on the component mounting face, a second base member stacked on the first base member via an insulating layer covering the first electronic component, a hole part provided in the second base member and communicating with the through-electrode of the first electronic component, and a second electronic component mounted on the second base member and circuit-connected directly to the through-electrode via the hole part.

Abstract translation: 根据一个实施例，提供了一种印刷电路板，包括：第一基座构件，包括部件安装面;第一电子部件，其具有安装在部件安装面上的通孔;第二基座部件，堆叠在第一基座 构件，其经由覆盖所述第一电子部件的绝缘层，设置在所述第二基座构件中并与所述第一电子部件的通孔连通的孔部，以及安装在所述第二基座构件上的电路部件， 通孔通过孔部分。

公开(公告)号：US07307293B2

公开(公告)日：2007-12-11

申请号：US10426930

申请日：2003-04-29

Applicant: Joseph C. Fjelstad ,  Para K. Segaram ,  Belgacem Haba

Inventor： Joseph C. Fjelstad ,  Para K. Segaram ,  Belgacem Haba

IPC: H01L31/0336 ,  H05K3/22 ,  H05K1/00 ,  H01R12/00

CPC classification number: H05K1/147 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0228 ,  H05K1/0237 ,  H05K3/222 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.

Abstract translation: 一种直接连接信号系统，包括印刷电路板和布置在印刷电路板上的第一和第二集成电路封装。 多个电信号导体在悬挂在印刷电路板上的第一和第二集成电路封装之间延伸。

公开(公告)号：US20070278639A1

公开(公告)日：2007-12-06

申请号：US11572873

申请日：2005-07-21

Applicant: Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

Inventor： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC: H01L23/02 ,  H01L21/00 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

Abstract translation: 公开了一种具有布线基板和半导体器件堆叠的中间布线板的半导体堆叠和半导体基底器件。 在一个实施例中，半导体芯片布置在中间布线板和布线基板之间，该布线基板一方面通过布线基板与布线基板的下侧的外部触点电连接，另一方面与布线基板 布线基板的边缘区域的区域。 中间布线板具有成角度的外部扁平导体，其电连接在布线板的接触端子区域中。 此外，在中间布线板的上侧，布置在内部扁平导体的自由端上的是外部接触端子区域，其尺寸和布置对应于要堆叠的半导体器件的外部触点。

公开(公告)号：US20070262434A1

公开(公告)日：2007-11-15

申请号：US11782102

申请日：2007-07-24

Applicant: Chin-Tien Chiu ,  Cheemen Yu ,  Hem Takiar ,  Jack Chien ,  Meng-Ju Tsai

Inventor： Chin-Tien Chiu ,  Cheemen Yu ,  Hem Takiar ,  Jack Chien ,  Meng-Ju Tsai

IPC: H01L23/02

CPC classification number: H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06562 ,  H01L2225/1005 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/142 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/1053 ,  H05K2201/10727 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The panel includes a plurality of through-holes drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads. After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.

Abstract translation: 公开了一种电子部件，其包括以并排配置焊接在一起的多个半导体封装。 包装在基板上进行批量处理。 面板包括穿过面板钻出的多个通孔，随后填充有诸如铜或金的金属。 这些填充的通孔沿着相邻封装之间的切割线位于相邻封装之间的切割线处，使得在分离时，填充的通孔被切割并且一部分填充的通孔在单个封装的侧边缘处露出。 填充的通孔的这些暴露部分形成垂直表面贴装技术（SMT）焊盘。 在半导体封装被单个化并且SMT焊盘限定在侧边缘中之后，使用SMT来将第一半导体封装的SMT焊盘焊接到第二半导体封装的相应SMT焊盘，以将两个封装结合和电耦合在一起 旁边。

公开(公告)号：US07291901B2

公开(公告)日：2007-11-06

申请号：US10803879

申请日：2004-03-19

Applicant: Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

Inventor： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC: H01L23/02 ,  H01L23/48

CPC classification number: H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

Abstract translation: 包装方法，包装结构和包装是能够抑制薄膜基板翘曲的基板，提高产品收率，并且在安装具有高放热量的LSI的情况下建立足够的冷却能力的基板。 本发明的封装基板1使得在第一基板12中形成开口11，在第一基板12上层叠薄膜基板（第二基板）13，开口11被薄膜基板13覆盖 。 接下来，将电容器（第一电子部件）14插入到开口11中并且结合到薄膜基板上，树脂15将开口11的内部填充到固定或更大的厚度并被硬化，薄膜基板13 并且电容器14由树脂15维持，应该连接到电容器14的LSI 16（第二电子部件）被接合到薄膜基板13的暴露侧的表面上，并且电容器 14连接到LSI 16。

公开(公告)号：US07268002B2

公开(公告)日：2007-09-11

申请号：US11265107

申请日：2005-11-03

Applicant: Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

Inventor： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC: H01L21/66 ,  H01L21/44

CPC classification number: H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

公开(公告)号：US20070049070A1

公开(公告)日：2007-03-01

申请号：US11497347

申请日：2006-08-02

Applicant: Hirohiko Fujimaki

Inventor： Hirohiko Fujimaki

IPC: H05K1/00

CPC classification number: B60R16/0239 ,  H05K1/18 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10689

Abstract: An electrical module and electrical unit, by which workability of the connection work can be improved without deteriorating reliability of the connection, are provided. The electrical module includes: a receiving member for receiving electronic components; a plurality of terminals extending outside the receiving member on a condition that the terminals are electrically connected to the electronic components, the terminals being loosely inserted in insertion holes of a connector so that the electrical module is connected to the connector; a positioning means for positioning the terminals with regard to the insertion holes of the connector; and a fixing means for fixing the receiving member at a position positioned by the positioning means.

Abstract translation: 提供了一种电气模块和电气单元，其可以在不降低连接可靠性的情况下提高连接作业的可操作性。 电气模块包括：用于接收电子部件的接收部件; 多个端子，其在端子电连接到电子部件的状态下延伸到接收部件外部，端子松动地插入连接器的插入孔中，使得电气模块连接到连接器; 定位装置，用于相对于连接器的插入孔定位端子; 以及用于将所述接收构件固定在由所述定位装置定位的位置的固定装置。

公开(公告)号：US07163137B2

公开(公告)日：2007-01-16

申请号：US10863398

申请日：2004-06-08

Applicant: Yuusuke Yamamoto

Inventor： Yuusuke Yamamoto

IPC: B23K31/02

CPC classification number: H05K3/341 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06568 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/613 ,  H01L2224/05599

Abstract: The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by mounting a first electronic part 11 and a second electronic part 12 each having a solder bump in its bottom plane on a substrate 3 in stacked plural levels, after the first electronic part 11 is mounted on the substrate 3 that has been fed with solder, the solder bump 18 of the second electronic part 12 is mounted on the electrode 17 provided on the upper plane of the first electronic part 11, and thereafter the substrate 3 is heated in a reflow step to solder-bond the first electronic part 11 to substrate 3 along with solder-bonding the second electronic part 12 to the first electronic part 11. By such process, a stacked structure can be applied to a wide variety of electronic parts at a low cost.

Abstract translation: 目的是提供一种能够以低成本广泛采用堆叠结构的安装板的制造方法的能力。 作为解决方案，在制造安装基板的方法中，其中通过将底部平面上具有焊料凸块的第一电子部件11和第二电子部件12以多个层叠的方式安装在基板3上来制造， 在将第一电子部件11安装在已经供给焊料的基板3上之后，将第二电子部件12的焊料凸块18安装在设置在第一电子部件11的上平面上的电极17上， 衬底3在回流步骤中被加热，以将第一电子部件11焊接到衬底3上，同时将第二电子部件12焊接到第一电子部件11.通过这种工艺，堆叠结构可以应用于宽 各种电子零件成本低廉。

公开(公告)号：US20060267176A1

公开(公告)日：2006-11-30

申请号：US11416757

申请日：2006-05-03

Applicant: Bert Offrein ,  Stefano Oggioni ,  Mauro Spreafico

Inventor： Bert Offrein ,  Stefano Oggioni ,  Mauro Spreafico

IPC: H01L23/52

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/522 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/167 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81143 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/222 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/10121 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.

Abstract translation: 一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械连接到所述模块基板 以及第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。 电耦合包括在第一和第二电子部件之间特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。

公开(公告)号：US20060231947A1

公开(公告)日：2006-10-19

申请号：US11105113

申请日：2005-04-13

Applicant: Eiichi Hosomi ,  Paul Harvey

Inventor： Eiichi Hosomi ,  Paul Harvey

IPC: H01L23/34

CPC classification number: H01L23/50 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00

Abstract: Systems and methods for reducing switching noise in an integrated circuit. In one embodiment, decoupling capacitors are connected to the integrated circuit from the underside of the substrate on which the integrated circuit die is manufactured. The decoupling capacitors are positioned with a higher concentration in the “hot spot” areas of the integrated circuit instead of being evenly distributed. In one embodiment, the decoupling capacitors and the corresponding hole(s) in a circuit board on which the integrated circuit is mounted are positioned so that the circuit board provides support for the central portion of the integrated circuit and thereby prevents the integrated circuit from flexing away from the heat sink/spreader. In one embodiment, the concentration of vias connecting the different ground planes and/or power planes within the integrated circuit is higher in hot spots than in other areas.