公开(公告)号：US3891789A

公开(公告)日：1975-06-24

申请号：US30519272

申请日：1972-11-09

Applicant: AMP INC

Inventor： SWENGEL SR ROBERT CHARLES ,  CRUMLEY J A

IPC: B23K9/22 ,  H01R4/02 ,  H01R43/02 ,  H05K3/32 ,  H05K3/40 ,  H05K1/18

CPC classification number: H01R4/029 ,  B23K9/22 ,  H01R43/02 ,  H05K3/328 ,  H05K3/4046 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10628

Abstract: A welding method and means is disclosed utilizing a conductive foil disposed between or adjacent members to be welded together with the foil serving as one electrode and one or both of the members serving as another electrode of the welding circuit and with the members being forced together or with the foil being forced against the members by a separate electrode.

公开(公告)号：US3353263A

公开(公告)日：1967-11-21

申请号：US38990064

申请日：1964-08-17

Applicant: TEXAS INSTRUMENTS INC

Inventor： DOUGLAS HELMS JOHN

IPC: H01L23/538 ,  H05K3/10 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06

CPC classification number: H01L23/5383 ,  H01L2924/0002 ,  H05K3/103 ,  H05K3/328 ,  H05K3/4015 ,  H05K7/06 ,  H05K2201/09754 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2203/1189 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49162 ,  H01L2924/00

公开(公告)号：US3315133A

公开(公告)日：1967-04-18

申请号：US49134265

申请日：1965-09-29

Applicant: MOTOROLA INC

Inventor： WALKER JOHN S

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  H05K3/32 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K3/062 ,  H05K1/09 ,  H05K1/112 ,  H05K3/328 ,  H05K3/384 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/10628 ,  H05K2203/0361 ,  H05K2203/063 ,  H05K2203/1572

公开(公告)号：US3233034A

公开(公告)日：1966-02-01

申请号：US42287064

申请日：1964-10-26

Applicant: GRABBE DIMITRY G

Inventor： GRABBE DIMITRY G

IPC: H05K3/32

CPC classification number: H05K3/328 ,  H01R12/58 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/10628 ,  H05K2201/10962 ,  Y10T29/49945

公开(公告)号：US20230262899A1

公开(公告)日：2023-08-17

申请号：US18082924

申请日：2022-12-16

Applicant: The Johns Hopkins University

Inventor： Konstantinos Gerasopoulos ,  Jason E. Tiffany ,  Seppo J. Lehtonen ,  Vanessa O. Rojas ,  Spencer A. Langevin ,  Bing Tan

IPC: H05K1/18 ,  H01M10/04 ,  H01M10/6569 ,  H01M50/519

CPC classification number: H05K1/181 ,  H01M10/0431 ,  H01M10/0468 ,  H01M10/6569 ,  H01M50/519 ,  H01M50/105 ,  H01M2300/0082 ,  H05K2201/10037 ,  H05K2201/10568 ,  H05K2201/10628

Abstract: An apparatus for mounting on a circuit board is provided. The apparatus may include a circuit board mount packaging and a battery. The circuit board mount packaging may include a cavity, a first internal lead, and a second internal lead. The first internal lead may be connect to a first external pin and the second internal lead may be connected to a second external pin. The battery may be disposed within the cavity of the circuit board mount packaging. The battery may comprise an anode and a cathode. The anode may be wire bond connected to the first internal lead and the cathode may be wire bond connected to the second internal lead.

公开(公告)号：US20230156917A1

公开(公告)日：2023-05-18

申请号：US17983107

申请日：2022-11-08

Applicant: Amphenol Corporation

Inventor： Paul R. Taylor ,  Jim Hileman ,  Trent K. Do

IPC: H05K1/11 ,  H01L23/498

CPC classification number: H05K1/113 ,  H01L23/49838 ,  H05K2201/10378 ,  H05K2201/0311 ,  H05K2201/10628 ,  H05K2201/10325

Abstract: An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

公开(公告)号：US20190124771A1

公开(公告)日：2019-04-25

申请号：US15987360

申请日：2018-05-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK ,  Gu Won JI ,  Se Hun PARK

IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01G4/224

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/2045

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1≤G/CT≤0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

公开(公告)号：US20180310416A1

公开(公告)日：2018-10-25

申请号：US15738074

申请日：2016-06-16

Applicant: Ronald NEHRING ,  Mokhtar ROUABHI ,  Reginald SIMPSON

Inventor： Ronald NEHRING ,  Mokhtar ROUABHI ,  Reginald SIMPSON

IPC: H05K3/34 ,  H05K1/02

CPC classification number: H05K3/3405 ,  H05K1/0243 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10628 ,  H05K2201/10818 ,  H05K2201/10969

Abstract: Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).

公开(公告)号：US20180270957A1

公开(公告)日：2018-09-20

申请号：US15459787

申请日：2017-03-15

Applicant: Intel Corporation

Inventor： Rajasekaran Swaminathan ,  Ram S. Viswanath

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/183 ,  H05K1/0216 ,  H05K1/113 ,  H05K1/141 ,  H05K3/0014 ,  H05K3/303 ,  H05K3/46 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10628 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: Embodiments of the present disclosure provide techniques for a printed circuit board (PCB) with a recess to accommodate discrete components of a package attachable to the PCB, in accordance with some embodiments. In one embodiment, a PCB may include a recess disposed in at least a portion of the PCB, to receive at least a portion of a package. The package may be attachable to the PCB via a plurality of connectors. The connectors may be disposed on a side of the package that faces the PCB. The portion of the package may include one or more discrete components disposed on the side of the package that faces the PCB. The recess may have a depth to accommodate those discrete components that have a height that is greater than a height of the connectors. Other embodiments may be described and/or claimed.

公开(公告)号：US20180160545A1

公开(公告)日：2018-06-07

申请号：US15673001

申请日：2017-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Dal KIM ,  Oh Hyuck KWON ,  Han Vit KANG ,  Jun Young KIM ,  Moon Kyeong KIM ,  Sang Seob KIM ,  Jung Sik PARK ,  Hee Seok JUNG ,  Sung CHO ,  Heung Sik SHIN ,  Ji Woong OH

IPC: H05K3/36 ,  H04M1/02 ,  G02F1/1333 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K3/363 ,  A61B5/1172 ,  G02F1/1333 ,  G02F1/13338 ,  G02F1/13452 ,  G06F1/1637 ,  G06K9/00013 ,  G06K9/0004 ,  H04M1/0277 ,  H04M2250/16 ,  H05K1/028 ,  H05K1/147 ,  H05K1/188 ,  H05K1/189 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/056 ,  H05K2201/099 ,  H05K2201/10128 ,  H05K2201/10628

Abstract: An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.