公开(公告)号：US20170085015A1

公开(公告)日：2017-03-23

申请号：US15124519

申请日：2015-02-25

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/58 ,  H05K1/11

CPC classification number: H01R12/58 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10818

Abstract: The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

公开(公告)号：US09521751B2

公开(公告)日：2016-12-13

申请号：US14085613

申请日：2013-11-20

Applicant: Intel Corporation

Inventor： Mihir K. Roy ,  Mathew J. Manusharow

IPC: H01B7/00 ,  H01B3/50 ,  H05K1/16 ,  H01B7/08 ,  H01B3/48 ,  H01F17/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/40 ,  H01B3/04 ,  H01B7/02 ,  H05K1/02 ,  H05K3/04 ,  H05K3/26

CPC classification number: H05K3/10 ,  H01B3/485 ,  H01B3/50 ,  H01B7/083 ,  H01F17/0006 ,  H05K1/0222 ,  H05K1/038 ,  H05K1/165 ,  H05K3/043 ,  H05K3/103 ,  H05K3/22 ,  H05K3/26 ,  H05K3/30 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/029 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/1081 ,  H05K2203/0228 ,  H05K2203/025 ,  H05K2203/1461 ,  H05K2203/175 ,  H05K2203/30

Abstract: A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

Abstract translation: 衬底封装包括织造织物，其具有在导电股线之间编织的非导电股线，包括线股，同轴股线和/或股线的电感器图案。 封装可以通过廉价且高通量的工艺来形成，该工艺首先在导电股线之间编织非导电股线（例如玻璃），以形成机织织物中导电股线的电路板图案。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 随后将固化的织物的上表面和下表面平坦化。 平面化节段并露出导线，同轴和电感图案线的端部。 由于导电丝线整体地形成在平面织造织物内，所以基底具有高的机械稳定性，并提供了在基底包装中原位构建的基于导线的电气部件。

公开(公告)号：US20150222265A1

公开(公告)日：2015-08-06

申请号：US14606447

申请日：2015-01-27

Applicant: Anden Co., Ltd.

Inventor： Hideyuki OHTANI ,  Naoyuki YASUDA

IPC: H03K17/693 ,  H03K17/687

CPC classification number: H03K17/693 ,  H03K17/6874 ,  H03K17/6877 ,  H05K3/3426 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10833 ,  H05K2201/10871 ,  Y02P70/613

Abstract: In a relay module device, a signal converting section transmits driving signals of switching elements when receiving input signals from an external device and sets a relationship between the input signals and the driving signals. The relationship includes a first mode in which the signal converting section transmits the driving signals to separately control one of the switching elements with respect to one of the input signals, and a second mode in which the signal converting section transmits the driving signals to concurrently control two or more of the switching elements with respect to one of the input signals.

Abstract translation: 在继电器模块装置中，当从外部装置接收输入信号时，信号转换部分传输开关元件的驱动信号，并设定输入信号与驱动信号之间的关系。 该关系包括第一模式，其中信号转换部分发送驱动信号以相对于输入信号之一单独控制开关元件之一;以及第二模式，其中信号转换部分将驱动信号传输到同时控制 相对于输入信号之一的两个或多个开关元件。

公开(公告)号：US20150138743A1

公开(公告)日：2015-05-21

申请号：US14085613

申请日：2013-11-20

Applicant: Mihir K. ROY ,  Mathew J. Manusharow

Inventor： Mihir K. ROY ,  Mathew J. Manusharow

IPC: H05K1/02 ,  H05K1/16 ,  H05K1/18

CPC classification number: H05K3/10 ,  H01B3/485 ,  H01B3/50 ,  H01B7/083 ,  H01F17/0006 ,  H05K1/0222 ,  H05K1/038 ,  H05K1/165 ,  H05K3/043 ,  H05K3/103 ,  H05K3/22 ,  H05K3/26 ,  H05K3/30 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/029 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/1081 ,  H05K2203/0228 ,  H05K2203/025 ,  H05K2203/1461 ,  H05K2203/175 ,  H05K2203/30

Abstract: A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

Abstract translation: 衬底封装包括织造织物，其具有在导电股线之间编织的非导电股线，包括线股，同轴股线和/或股线的电感器图案。 封装可以通过廉价且高通量的工艺来形成，该工艺首先在导电股线之间编织非导电股线（例如玻璃），以形成机织织物中导电股线的电路板图案。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 随后将固化的织物的上表面和下表面平坦化。 平面化节段并露出导线，同轴和电感图案线的端部。 由于导电丝束在平面织造织物内整体形成，所以基底具有高的机械稳定性，并提供了在基底包装中原位构建的基于导线的电气部件。

公开(公告)号：US20130342986A1

公开(公告)日：2013-12-26

申请号：US13533681

申请日：2012-06-26

Applicant: Tsung-Yu Chen ,  Rebecca Shia

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H05K1/11 ,  H05K3/10 ,  H01L23/48

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

Abstract translation: 示出了引脚连接，电子设备和方法的实施例，其包括引脚配置以减少引脚连接操作期间的空隙和引脚倾斜以及其它问题，诸如附接到芯片封装引脚网格阵列。 引脚头被显示为包括诸如凸表面，多个腿和销头表面中的通道的特征。

公开(公告)号：US20110290534A1

公开(公告)日：2011-12-01

申请号：US12818111

申请日：2010-06-17

Applicant: YI RUI ,  LI FAN ,  MEI HUANG ,  LIANG GUO ,  JIAN LUO ,  HONG-LIAN HUANG

Inventor： YI RUI ,  LI FAN ,  MEI HUANG ,  LIANG GUO ,  JIAN LUO ,  HONG-LIAN HUANG

IPC: H05K1/02

CPC classification number: H05K1/0295 ,  H01R12/712 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1081

Abstract: A printed circuit board includes a mounting area. The mounting area includes a first mounting portion and a second mounting portion. The first and second mounting portions partially overlap. The first mounting portion includes a number of first holes, a number of second holes, and a third hole. The first holes, the second holes, and the third hole are configured for the mounting of signal pins of a universal serial bus (USB) pin. The second mounting portion includes the first holes and a number of fixing holes. The first holes are configured for the mounting of signal pins of a USB connector. The fixing holes are configured for the mounting of fixing pins of the USB connector.

Abstract translation: 印刷电路板包括安装区域。 安装区域包括第一安装部和第二安装部。 第一和第二安装部分重叠。 第一安装部分包括多个第一孔，多个第二孔和第三孔。 第一个孔，第二个孔和第三个孔被配置为安装通用串行总线（USB）引脚的信号引脚。 第二安装部分包括第一孔和多个固定孔。 第一个孔被配置用于安装USB连接器的信号引脚。 固定孔配置为安装USB连接器的固定销。

公开(公告)号：US07172439B1

公开(公告)日：2007-02-06

申请号：US11528177

申请日：2006-09-26

Applicant: Masayuki Yokobatake ,  Hiroyuki Arai ,  Yuzen Chin ,  Shigeru Yokota ,  Yoshikazu Kawai

Inventor： Masayuki Yokobatake ,  Hiroyuki Arai ,  Yuzen Chin ,  Shigeru Yokota ,  Yoshikazu Kawai

IPC: H05K1/00

CPC classification number: H05K1/141 ,  H01R43/205 ,  H04N5/64 ,  H05K3/0052 ,  H05K3/3447 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/1081 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49789 ,  Y10T29/49798

Abstract: The present invention makes it possible to fix connector pins at low cost. Connector pins penetrate both a holding substrate and a main substrate. The connecter pins can be restrained from an outward radial direction by both wall surfaces of pin holes of the holding substrate, and wall surfaces of through-holes of the main substrate, thus improving upright-standability of the connector pins. The holding substrate is formed of a same raw substrate as the main substrate is formed of, and permanent resists which are laminated on the holding substrate, and ink used for silk screen printing to which the holding substrate is subjected, are made of a same material of the main substrate, so that fire resistance of the holding substrate and fire resistance of the main substrate are same. Therefore, if the main substrate clears a predetermined fire-resistance standard, the holding substrate also inevitably clears the predetermined fire-resistance standard.

Abstract translation: 本发明使得可以以低成本固定连接器引脚。 连接器引脚穿过保持基板和主基板。 连接器销可以通过保持基板的销孔的两个壁面和主基板的通孔的壁面从外径向限制，从而提高连接器销的直立性。 保持基板由与主基板相同的原料基板形成，并且层压在保持基板上的永久性抗蚀剂和用于丝网印刷的用于保持基板的油墨由相同的材料制成 使得保持基板的耐火性和主基板的耐火性相同。 因此，如果主基板清除预定的耐火标准，则保持基板也不可避免地清除预定的耐火标准。

公开(公告)号：US07085146B2

公开(公告)日：2006-08-01

申请号：US10378549

申请日：2003-03-03

Applicant: Lennart Pitzele

Inventor： Lennart Pitzele

IPC: H02M1/00 ,  H01R23/72

CPC classification number: H05K7/142 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Abstract translation: DC / DC转换器安装到具有刚性端子引脚的印刷电路板上，该引脚延伸到转换器基板中以提供与基板上的电路的电连接。 端子销包括与印刷电路板抵接并将转换器基板与印刷电路板隔开的凸缘。 与印刷电路板的连接是由法兰和电路板之间的焊料制成的。

公开(公告)号：US06896526B2

公开(公告)日：2005-05-24

申请号：US10721833

申请日：2003-11-25

Applicant: Lennart Pitzele

Inventor： Lennart Pitzele

IPC: H01R12/55 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/14 ,  H01R23/72 ,  H05K1/02

CPC classification number: H05K7/142 ,  H01R12/58 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Abstract translation: DC / DC转换器安装到具有刚性端子引脚的印刷电路板上，该引脚延伸到转换器基板中以提供与基板上的电路的电连接。 端子销包括与印刷电路板抵接并将转换器基板与印刷电路板隔开的凸缘。 与印刷电路板的连接是由法兰和电路板之间的焊料制成的。

公开(公告)号：US20040259434A1

公开(公告)日：2004-12-23

申请号：US10895749

申请日：2004-07-20

Applicant: SynQor, Inc.

Inventor： Lennart Pitzele

IPC: H01R009/24

CPC classification number: H05K7/142 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Abstract translation: DC / DC转换器安装到具有刚性端子引脚的印刷电路板上，该引脚延伸到转换器基板中以提供与基板上的电路的电连接。 端子销包括与印刷电路板抵接并将转换器基板与印刷电路板隔开的凸缘。 与印刷电路板的连接是由法兰和电路板之间的焊料制成的。