公开(公告)号：US20100265671A1

公开(公告)日：2010-10-21

申请号：US12537441

申请日：2009-08-07

Applicant: CHIA-HSI TSAI ,  CHENG-TE TSENG ,  TZU-KAN CHEN ,  YI-TING LIN

Inventor： CHIA-HSI TSAI ,  CHENG-TE TSENG ,  TZU-KAN CHEN ,  YI-TING LIN

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H01L23/49805 ,  H01L24/45 ,  H01L27/14618 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10689 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y10T29/49124 ,  H01L2224/48

Abstract: The package structure of the PCB comprises a substrate and a frame. The frame is located at the top of the substrate, and the substrate and the frame define a receiving space. The electronic components are mounted on the substrate and distributed in the receiving space. Because of the protection of the frame, the electronic components are effectively protected from the collision of installation in the process or use in the process. The substrate can be a flexible circuit board or a rigid-flex PCB and the electronic components are directly embedded in the substrate. Therefore the thickness of the package structure is reduced.

Abstract translation: PCB的封装结构包括衬底和框架。 框架位于基板的顶部，并且基板和框架限定了接收空间。 电子部件安装在基板上并分布在接收空间中。 由于保护框架，电子元件在过程中被有效地保护免受安装过程的冲击或使用。 基板可以是柔性电路板或刚性柔性PCB，并且电子部件直接嵌入基板中。 因此，封装结构的厚度减小。

公开(公告)号：US07797823B2

公开(公告)日：2010-09-21

申请号：US11967756

申请日：2007-12-31

Applicant: Fabien Létourneau ,  Stefano DeCecco ,  Peter Serjak

Inventor： Fabien Létourneau ,  Stefano DeCecco ,  Peter Serjak

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/301 ,  H05K2201/09072 ,  H05K2201/09127 ,  H05K2201/10522 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.

Abstract translation: 用于提供高密度组件组件的装置和方法，例如机电或电光组件。

公开(公告)号：US20100232991A1

公开(公告)日：2010-09-16

申请号：US12298969

申请日：2008-06-27

Applicant: Takashi Nakagami ,  Shunsuke Yakushiji ,  Koji Nakano ,  Masahiko Asai ,  Makoto Hattori ,  Kazuki Niwa

Inventor： Takashi Nakagami ,  Shunsuke Yakushiji ,  Koji Nakano ,  Masahiko Asai ,  Makoto Hattori ,  Kazuki Niwa

IPC: F04C18/02

CPC classification number: H05K3/368 ,  F04B39/121 ,  H02K11/33 ,  H02M7/003 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/09409 ,  H05K2201/10303 ,  H05K2201/2018

Abstract: In an inverter control apparatus in which a control circuit board is fixed by use of pin-like terminals provided in a power board, the breakage of the pin-like terminals is prevented. The power board 160 is provided with a plurality of signal transmission terminals 210a, 210b, 220a, 220b for signal transmission to and from the control circuit board 150 and for grounding along each of a pair of opposed sides, the control circuit board 150 is electrically connected to the plurality of signal transmission terminals 210a etc. and is fixed by soldering to the plurality of signal transmission terminals 210a etc., and the plurality of signal transmission terminals 210a etc. are arranged along each of the pair of sides in a plurality of rows.

Abstract translation: 在通过使用设置在电源板中的销状端子来固定控制电路板的逆变器控制装置中，防止了销状端子的破损。 电源板160设置有多个信号传输端子210a，210b，220a，220b，用于向控制电路板150发送信号和从控制电路板150传输信号，并且用于沿着一对相对侧中的每一个接地，控制电路板150电气 连接到多个信号传输端子210a等，并且通过焊接固定到多个信号传输端子210a等，并且多个信号传输端子210a等沿着多个侧面中的每一侧布置 行。

公开(公告)号：US07787257B2

公开(公告)日：2010-08-31

申请号：US12362149

申请日：2009-01-29

Applicant: Kenji Fukuzono

Inventor： Kenji Fukuzono

IPC: H05K7/00

CPC classification number: H05K1/0271 ,  H05K3/0058 ,  H05K3/301 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0311 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: A printed wiring board unit includes an electronic circuit component, a printed wiring board, a plurality of first conductive terminals disposed between the electronic circuit component and the printed wiring board, at least one of the first conductive terminals arranged along a quadrangular outline, and a plurality of second conductive terminals disposed between the electronic circuit component and the printed wiring board, the second conductive terminals arranged at a corner of the quadrangular outline, and the second conductive terminals contacting at least one of the printed wiring board and the electronic circuit component in a relatively displaceable manner.

Abstract translation: 印刷电路板单元包括电子电路部件，印刷线路板，布置在电子电路部件和印刷线路板之间的多个第一导电端子，沿着四边形轮廓布置的至少一个第一导电端子，以及 设置在电子电路部件和印刷线路板之间的多个第二导电端子，布置在四边形轮廓的角部的第二导电端子和与印刷线路板和电子电路部件中的至少一个接触的第二导电端子 相对位移的方式。

公开(公告)号：US20100213836A1

公开(公告)日：2010-08-26

申请号：US12422279

申请日：2009-04-12

Applicant: Yu-Pin LIAO ,  Ying-Ju LIU

Inventor： Yu-Pin LIAO ,  Ying-Ju LIU

IPC: H01J1/54

CPC classification number: G09F9/33 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/5237 ,  H01L51/5281 ,  H01L2251/558 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10128 ,  H05K2201/2018

Abstract: A character display module comprises a character organic light emitting diode panel, a printed circuit which is electrically connected to the character organic light emitting diode panel, a drive controller which is disposed on the printed circuit board to drive and control the character organic light emitting diode panel, and a frame which is used to position the character organic light emitting diode panel on the printed circuit board. Therefore, such an arrangement provides a lighter, thinner, high quality, cost-saving and energy-saving character display module.

Abstract translation: 字符显示模块包括字符有机发光二极管面板，电连接到字符有机发光二极管面板的印刷电路，设置在印刷电路板上以驱动和控制字符有机发光二极管的驱动控制器 面板和用于将字符有机发光二极管面板定位在印刷电路板上的框架。 因此，这种布置提供了更轻，更薄，高质量，节省成本和节能的字符显示模块。

公开(公告)号：US07759784B2

公开(公告)日：2010-07-20

申请号：US11196269

申请日：2005-08-04

Applicant: Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

Inventor： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

IPC: H01L23/02

CPC classification number: H05K1/183 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/0278

Abstract: A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

Abstract translation: 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。

公开(公告)号：US20100170700A1

公开(公告)日：2010-07-08

申请号：US12377134

申请日：2008-05-28

Applicant: Tadashi Nakamura ,  Fumio Echigo ,  Takayuki Kita ,  Kota Fukasawa ,  Shogo Hirai

Inventor： Tadashi Nakamura ,  Fumio Echigo ,  Takayuki Kita ,  Kota Fukasawa ,  Shogo Hirai

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4697 ,  H05K1/183 ,  H05K1/189 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/061 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.

Abstract translation: 通过粘接具有不同形状的上下印刷电路板并且在其表面上形成布线来制造实心印刷电路板。 接合层由含有分散在其中的热固性树脂和无机填料的绝缘材料制成，并且具有填充在接合层的预定位置穿孔的通孔的由导电膏制成的通孔导体。 该电路板提供了实现小尺寸和厚度的三维安装，适用于高性能和多引脚结构半导体的封装结构。

公开(公告)号：US20100155927A1

公开(公告)日：2010-06-24

申请号：US12317434

申请日：2008-12-23

Applicant: Kee Leong Cheah ,  Eu Soon Lee

Inventor： Kee Leong Cheah ,  Eu Soon Lee

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L23/49833 ,  H01L23/16 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/023 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10962 ,  H05K2201/2009 ,  H05K2201/2018 ,  H01L2924/00

Abstract: Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals of the semiconductor package.

Abstract translation: 本发明的实施例涉及半导体封装，其中将电力输送到可拆卸地安装在形成在封装加强件和电导体之间的插座中的裸片侧部件。 为此，封装加强件和电导体可以电耦合到半导体封装的电源和接地端子。

公开(公告)号：US20100044100A1

公开(公告)日：2010-02-25

申请号：US12065042

申请日：2006-08-03

Applicant: Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

Inventor： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

IPC: H01L23/28

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K7/20463 ,  H05K9/0083 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018 ,  H01L2224/0401

Abstract: A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided.A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

Abstract translation: 具有通过一次操作涂覆多个电子部件的树脂部件的基板结构被确定，并且确保了电子部件相对于基板的安装强度，并且提供了包括该基板结构的电子设备。 基板结构10包括基板11，沿着基板11安装的多个电子部件12以及与基板11保持紧密接触的，用树脂18涂覆各电子部件12的树脂部13。 同时保持与基板11紧密接触的每个电子部件12的框体15和封闭框体15中的开口16的盖部17，并且树脂18填充在框体15的内部。

公开(公告)号：US07663886B2

公开(公告)日：2010-02-16

申请号：US12003037

申请日：2007-12-19

Applicant: Kazuo Aoki ,  Junji Tsuruoka ,  Seiji Yasui ,  Yasushi Kabata ,  Shin Soyano

Inventor： Kazuo Aoki ,  Junji Tsuruoka ,  Seiji Yasui ,  Yasushi Kabata ,  Shin Soyano

IPC: H05K7/20 ,  H01L23/02

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L24/40 ,  H01L25/072 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/10924 ,  H05K2201/2018 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.

Abstract translation: 电子电路装置包括形成有主电路的下侧基板; 形成有驱动控制主电路的驱动控制电路的上侧基板; 以硬化状态的树脂位于下侧基板的上方固定的支撑体; 以及壳体，具有外周面，外周面具有至少一部分驱动控制电路的外部引出端子和主电路，以及基板收纳空间，其在下侧容纳下侧基板 从周边部分向内。