Soft impact dispense nozzle
    61.
    发明授权
    Soft impact dispense nozzle 失效
    软冲击分配喷嘴

    公开(公告)号:US5954877A

    公开(公告)日:1999-09-21

    申请号:US823815

    申请日:1997-03-24

    Applicant: Bruce L. Hayes

    Inventor: Bruce L. Hayes

    CPC classification number: H01L21/6715 B05B1/265 B05C11/08 H01L21/6708

    Abstract: An apparatus and a method of dispensing process liquid from a liquid source onto a surface of a semiconductor wafer is disclosed in accordance with the present invention. The apparatus includes a nozzle having a bore with a longitudinal axis in fluid communication with the liquid source and a flow surface having a perimeter. The flow surface is oriented at a first angle relative to the axis and in fluid communication with the bore to dispense a sheet of process liquid from the perimeter onto a wafer surface. In a preferred embodiment, the nozzle is axisymmetric and includes a housing having a source portion connected to the liquid source and a dispense portion, and the bore traverses the source and dispense portions. An insert is provided having a first section disposed in the dispense portion of the bore adjacent to the source portion and a second section including the flow surface which is fully circumferential and continuous. The flow surface is in close proximity to the dispense portion, so as to define a flow path along the flow surface to control the flow of the process liquid. In the method of the invention, the nozzle is positioned to dispense a sheet of process liquid onto the wafer surface, while the surface is being rotated. The nozzle is radially offset from the center of the surface such that a portion of the continuous sheet of process liquid is dispensed directly onto the center of the wafer surface.

    Abstract translation: 根据本发明公开了一种将液体源的处理液体分配到半导体晶片的表面上的装置和方法。 该装置包括具有孔的喷嘴,该孔具有与液体源流体连通的纵向轴线和具有周界的流动表面。 流动表面相对于轴线以第一角度定向并且与孔流体连通以将一片处理液体从周边分配到晶片表面上。 在优选实施例中,喷嘴是轴对称的,并且包括具有连接到液体源的源部分和分配部分的壳体,并且孔穿过源和分配部分。 提供了插入件,其具有设置在邻近源部分的孔的分配部分中的第一部分和包括完全圆周和连续的流动表面的第二部分。 流动表面靠近分配部分,以便限定沿着流动表面的流动路径以控制处理液体的流动。 在本发明的方法中,喷嘴定位成在表面旋转的同时将一片工艺液体分配到晶片表面上。 喷嘴从表面的中心径向偏移,使得连续的处理液体片的一部分直接分配到晶片表面的中心。

    Processing apparatus and processing method
    64.
    发明授权
    Processing apparatus and processing method 失效
    处理装置及处理方法

    公开(公告)号:US5871584A

    公开(公告)日:1999-02-16

    申请号:US929106

    申请日:1997-09-15

    Abstract: A develop processing apparatus is provided for processing an object with a developing solution, comprising a retaining member for rotatably retaining the object, a developing solution supply nozzle for supplying the developing solution to the object, a developing solution sucking nozzle for sucking the developing solution supplied to the object, a developing solution supply nozzle moving mechanism for moving the developing solution supply nozzle above the object, a developing solution sucking nozzle moving mechanism for moving the developing solution sucking nozzle above the object. After the developing solution is supplied to the object subsequent to moving the developing solution supply nozzle, the developing solution sucking nozzle is moved and the developing solution on the object is sucked.

    Abstract translation: 一种显影处理装置,用于处理具有显影液的物体,包括用于可旋转地保持物体的保持构件,用于将显影液供给到物体的显影液供给喷嘴,用于吸取供给的显影液的显影液吸嘴 本发明的目的是提供一种用于使显影液供给喷嘴在物体上方移动的显影液供给喷嘴移动机构,用于将显影液吸引喷嘴移动到物体上方的显影液吸引喷嘴移动机构。 在显影液供给喷嘴移动之后向显影液供给显影液后,使显影液吸引喷嘴移动,并将吸收对象物的显影液。

    Detachable sponge device for spin-coating machines
    65.
    发明授权
    Detachable sponge device for spin-coating machines 失效
    可剥离海绵装置用于旋涂机

    公开(公告)号:US5868843A

    公开(公告)日:1999-02-09

    申请号:US783103

    申请日:1997-01-14

    CPC classification number: H01L21/6715 B05C11/08 B05C11/1039

    Abstract: A detachable sponge device for a spin coating machine used to coat a liquid material over a semiconductor wafer is provided. The detachable sponge device is used to prevent the solvent that is jetted on the edge of the wafer from being oversprayed elsewhere on the wafer. The detachable sponge device is composed of a curved mounting piece and a corrugated piece of sponge attached on the curved inner side of the mounting piece. The mounting piece can be detachably mounted on the spin coating machine. The corrugated piece of sponge can absorb splattered particles of solvent from the wafer which can thus be prevented from bouncing back onto the wafer. The planarization of the coating of SOG on the wafer thus will not be affected by splattering particles of the solvent. Excellent results of planarization of SOG or photoresist layers can thus be achieved.

    Abstract translation: 提供了一种用于在半导体晶片上涂覆液体材料的旋涂机的可拆卸海绵装置。 可拆卸的海绵装置用于防止喷射在晶片边缘上的溶剂在晶片上的其他地方被过度喷涂。 可拆卸海绵装置由安装在安装件的弯曲内侧上的弯曲安装件和波纹状海绵构成。 安装件可拆卸地安装在旋涂机上。 波纹状海绵片可以从晶片吸收飞溅的溶剂颗粒,从而可以防止其从反弹回到晶片上。 因此,晶片上的SOG涂层的平面化不会受到溶剂的飞溅颗粒的影响。 因此可以实现SOG或光致抗蚀剂层的平坦化的优异结果。

    Apparatus and method for breaking up bubbles in a liquid flow
    66.
    发明授权
    Apparatus and method for breaking up bubbles in a liquid flow 失效
    用于分解液体流中气泡的装置和方法

    公开(公告)号:US5857619A

    公开(公告)日:1999-01-12

    申请号:US907724

    申请日:1997-08-08

    CPC classification number: G03F7/162 B05C11/10 B05C11/08

    Abstract: The present invention discloses an apparatus and a method for breaking up air bubbles in a liquid flow which is conveyed in a fluid conduit by providing sharp protuberances on the inside wall of the conduit. The sharp protuberances break up large air bubbles into small air bubbles or micro-bubbles such that they can be easier disposed of after passing through a liquid dispensing nozzle. Various designs on the inner wall of the present invention fluid conduit can be provided as long as sharp protuberances exist for dividing the bubbles.

    Abstract translation: 本发明公开了一种通过在导管的内壁上提供锋利的突起来分解液体流中的气泡的设备和方法,该液体流在流体导管中输送。 尖锐的突起将大气泡分解成小的气泡或微气泡,使得它们在通过液体分配喷嘴之后可以更容易地处理。 只要存在用于分割气泡的尖锐突起,就可以提供本发明流体导管的内壁上的各种设计。

    Apparatus for applying coatings to lenses and curing the coatings
    67.
    发明授权
    Apparatus for applying coatings to lenses and curing the coatings 失效
    将涂层涂覆到透镜并固化涂层的装置

    公开(公告)号:US5820673A

    公开(公告)日:1998-10-13

    申请号:US748124

    申请日:1996-11-12

    CPC classification number: B29D11/00865 B05C11/08

    Abstract: An apparatus for coating a lens and curing the coating on the lens including a lens carrier for griping and holding the lens, a housing having a first set of walls defining a coating chamber with an opening in one of the first walls, the housing also having a second set of walls defining a curing chamber with an opening in one of the second walls. An arrangement for applying a coating to the lens within the coating chamber, an arrangement for projecting ultraviolet radiation within the curing chamber for curing the coating on the lens, and an arrangement for selectively blocking the ultraviolet radiation from passing into the coating chamber are provided. A carriage supports the lens carrier and the lens held thereby and moves the lens carrier and the lens along a predetermined path of motion within the housing, the path of motion moving the lens carrier and the lens through the coating chamber opening into the coating chamber so that the lens is in an inverted disposition during coating of the lens by the arrangement for coating, and moving the lens carrier and the lens through the curing chamber opening into the curing chamber so that the lens is in a vertically oriented disposition during curing of the coating on the lens by the ultraviolet radiation.

    Abstract translation: 一种用于涂覆透镜并固化透镜上的涂层的装置,包括用于夹持和保持透镜的透镜载体,具有限定涂覆室的第一组壁的壳体,该涂覆室在第一壁之一中具有开口,壳体还具有 限定固化室的第二组壁,其中一个第二壁具有开口。 提供了一种用于将涂层施加到涂覆室内的透镜的布置,用于在固化室内投射紫外线辐射以固化透镜上的涂层的布置以及用于选择性地阻挡紫外线辐射进入涂覆室的布置。 托架支撑透镜托架和由此固定的透镜,并且沿着壳体内的预定的运动路径移动透镜托架和透镜,运动路径将透镜托架和透镜通过涂布室开口移动到涂布室中 透镜在通过涂布装置涂覆透镜期间处于倒置的位置,并且将透镜载体和透镜通过固化室开口移动到固化室中,使得透镜在固化期间处于垂直取向的布置 通过紫外线照射在镜片上。

    Processing apparatus and processing method
    68.
    发明授权
    Processing apparatus and processing method 失效
    处理装置及处理方法

    公开(公告)号:US5815762A

    公开(公告)日:1998-09-29

    申请号:US878960

    申请日:1997-06-19

    CPC classification number: G03D5/04 B05C11/08 G03F7/3021 G03F7/16 Y10S134/902

    Abstract: A development processing apparatus includes a processing unit for storing a substrate S and a processing solution supply nozzle arranged above the substrate S stored in the processing unit. A processing solution storage is formed inside the supply nozzle. A supply passage for supplying the processing solution into the solution storage is connected to the supply nozzle. A plurality of eject holes for ejecting the processing solution in the solution storage are formed in a lower surface of the supply nozzle. In this processing apparatus, the upper surface of the solution storage consists of at least one inclined surface, and an exhaust port is formed in a high portion of the inclined surface.

    Abstract translation: 显影处理装置包括:处理单元,用于存储设置在处理单元中的基板S上方的基板S和处理液供给喷嘴。 在供给喷嘴内部形成有处理液储存部。 用于将处理溶液供应到溶液储存器中的供应通道连接到供应喷嘴。 在供给喷嘴的下表面形成有用于将溶液储存部中的处理液喷出的多个排出孔。 在该处理装置中,溶液储存器的上表面由至少一个倾斜表面构成,并且排出口形成在倾斜表面的高部分中。

    Substrate spin treating method and apparatus
    69.
    发明授权
    Substrate spin treating method and apparatus 失效
    底物旋转处理方法和装置

    公开(公告)号:US5788773A

    公开(公告)日:1998-08-04

    申请号:US731245

    申请日:1996-10-11

    CPC classification number: H01L21/6715 B05C11/08 Y10S134/902

    Abstract: A baffle is placed in a position opposed to discharge openings of a treating solution supply nozzle and between the discharge openings and the surface of a substrate. The baffle intercepts a treating solution discharged from the discharge openings, whereby the treating solution is supplied evenly to the surface of the substrate by flowing over a surface of the baffle and falling from an edge of the baffle to the substrate, instead of falling from the discharge openings directly to the substrate. No microbubbles are formed in the treating solution on the substrate, which would cause an unevenness of treatment. The discharge openings may be defined by a plurality of circular bores formed in the supply nozzle. Each circular bore may have a diameter at least equal to a spacing between an adjacent pair of circular bores.

    Abstract translation: 挡板被放置在与处理溶液供应喷嘴的排放口相对的位置和排放口与基板的表面之间。 挡板拦截从排出口排出的处理溶液,由此通过流过挡板的表面并从挡板的边缘落到基板而将处理溶液均匀地供给到基板的表面,而不是从 将开口直接排放到基板。 在基材上的处理溶液中不会形成微泡,这会导致处理不均匀。 排出口可以由形成在供给喷嘴中的多个圆形孔限定。 每个圆形孔可以具有至少等于相邻的一对圆形孔之间的间距的直径。

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