公开(公告)号：US20180192204A1

公开(公告)日：2018-07-05

申请号：US15861787

申请日：2018-01-04

Applicant: Robert Bosch GmbH

Inventor： Ahmad Mansour ,  Daniel Pantel ,  Fabian Purkl ,  Kerrin Doessel ,  Thomas Buck ,  Thomas Northemann

IPC: H04R17/02 ,  H04R17/00 ,  H04R31/00 ,  B81B3/00

CPC classification number: H04R17/025 ,  B81B3/0051 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0118 ,  H04R17/005 ,  H04R31/006

Abstract: A micromechanical sound transducer system includes a substrate that includes (a) a cavity with a cavity edge area, (b) a front side, and (c) a rear side; a piezoelectric vibrating beam that is elastically suspended on the front side and that extends across the cavity; and, for the piezoelectric vibrating beam, a respective deflection limiting device that is on a front edge area of the respective vibrating beam and that is configured to limit a deflection of the respective vibrating beam to a limiting deflection by causing the respective front edge area of the respective vibrating beam to interact with the cavity edge area or an opposing front edge area of another vibrating beam.

公开(公告)号：US20180180873A1

公开(公告)日：2018-06-28

申请号：US15594287

申请日：2017-05-12

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto Carminati ,  Domenico Giusti ,  Sonia Constantini

IPC: G02B26/08 ,  B81B3/00 ,  G02B26/10 ,  H04N9/31

CPC classification number: G02B26/0858 ,  B81B3/0083 ,  B81B2201/032 ,  B81B2203/0118 ,  G02B26/105 ,  H04N9/3129

Abstract: A MEMS device includes a fixed structure and suspended structure including an internal structure and a first arm and a second arm. Each arm has a first end fixed to the fixed structure and a second end fixed to the internal structure. The ends are angularly arranged at a distance apart. Piezoelectric actuators mounted to the arms are driven so as to cause deformation of the arm and produce a rotation of the internal structure. In a resting condition, each of the first and second arms has a respective elongated portion with a respective concavity. The internal structure extends in part within the concavities of the elongated portions of the first and second arms.

公开(公告)号：US20180179053A1

公开(公告)日：2018-06-28

申请号：US15902570

申请日：2018-02-22

Applicant: UBEAM INC.

Inventor： Andrew Joyce ,  Sean Taffler ,  Paul Reynolds ,  Nicholas Lavada Nemeth ,  Adam Stephen Elhadad ,  Boozarjomehr Faraji

IPC: B81C1/00 ,  H01L21/00 ,  F16B11/00 ,  G03F7/00

CPC classification number: B81C1/00182 ,  B81B2201/0271 ,  B81B2201/032 ,  B81B2203/0127 ,  B81C2203/032 ,  F16B11/006 ,  G03F7/00 ,  H01L21/00

Abstract: Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.

公开(公告)号：US20180088321A1

公开(公告)日：2018-03-29

申请号：US15699346

申请日：2017-09-08

Applicant: Yuki MARUYAMA ,  Tsukasa YAMADA

Inventor： Yuki MARUYAMA ,  Tsukasa YAMADA

IPC: G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0858 ,  B81B3/0072 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/058 ,  G02B26/10

Abstract: An optical scanning device is provided. The optical scanning device includes a mirror having an optical reflection surface, a movable frame supporting the mirror, a pair of drive beams supporting the movable frame from both sides, a drive source, disposed on the drive beams, that causes the movable frame to be swung around a predetermined axis, a fixed frame supporting the drive beams. Each of the drive source includes a lower electrode formed on the drive beams, a piezoelectric thin film formed on the lower electrode, an upper electrode formed on the piezoelectric thin film, and a stress counter film, formed on the upper electrode or formed between the piezoelectric thin film and the upper electrode, that generates a compressive stress on the drive beams.

公开(公告)号：US09866971B2

公开(公告)日：2018-01-09

申请号：US15305089

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo Zou ,  Zhe Wang ,  Jifang Tao ,  Guanxun Qiu

IPC: H04R25/00 ,  H04R19/02 ,  H04R7/06 ,  H04R31/00 ,  H04R19/01 ,  B81B7/00 ,  B81C1/00

CPC classification number: H04R19/02 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/0197 ,  H04R7/06 ,  H04R19/013 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2307/027

Abstract: The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.

公开(公告)号：US20170309808A1

公开(公告)日：2017-10-26

申请号：US15638861

申请日：2017-06-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： TAKUO HADA ,  Kansho Yamamoto

IPC: H01L41/09 ,  H01L41/33 ,  H01L41/113 ,  H01L41/253 ,  H04R31/00 ,  H04R17/10

CPC classification number: H01L41/09 ,  B81B2201/0271 ,  B81B2201/032 ,  B81C1/00682 ,  H01L41/094 ,  H01L41/0973 ,  H01L41/113 ,  H01L41/253 ,  H01L41/33 ,  H04R17/00 ,  H04R17/10 ,  H04R31/006 ,  H04R2201/003

Abstract: A method for manufacturing a piezoelectric device that includes a substrate and a vibration portion that can include a membrane or a beam that is directly or indirectly supported by the substrate and arranged above the substrate. Moreover, the vibration portion includes a piezoelectric layer and the method includes forming the vibration portion and adjusting a resonance frequency of the vibration portion by locally subjecting a region including the vibration portion to heat treatment.

公开(公告)号：US20170304867A1

公开(公告)日：2017-10-26

申请号：US15515856

申请日：2015-09-30

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  STMicroelectronics (Crolles 2) SAS ,  UNIVERSITE GRENOBLE ALPES

Inventor： Fabrice CASSET ,  Skandar BASROUR ,  Cédrick CHAPPAZ ,  Jean-Sébastien DANEL

IPC: B06B3/00 ,  H01L41/18 ,  B06B1/06 ,  H01L41/25 ,  B06B1/04

CPC classification number: B06B3/00 ,  B06B1/045 ,  B06B1/06 ,  B81B3/0021 ,  B81B3/0024 ,  B81B2201/032 ,  H01L41/094 ,  H01L41/18 ,  H01L41/25

Abstract: A mechanical structure comprising a stack including an active substrate and at least one actuator designed to generate vibrations at the active substrate, the stack comprises an elementary structure for amplifying the vibrations: positioned between the actuator and the active substrate, the structure designed to transmit and amplify the vibrations; and comprising at least one trench, located between the actuator and the active substrate. A method for manufacturing the structure comprising the use of a temporary substrate is provided.

公开(公告)号：US09523849B2

公开(公告)日：2016-12-20

申请号：US14388213

申请日：2013-04-24

Applicant: PANASONIC CORPORATION

Inventor： Toshiaki Horie ,  Soichiro Hiraoka ,  Shinsuke Nakazono ,  Kazuki Komaki

IPC: G02B26/08 ,  G02B26/10 ,  B81B3/00

CPC classification number: G02B26/0858 ,  B81B3/0043 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/0163 ,  G02B26/0833 ,  G02B26/10 ,  G02B26/101 ,  G02B26/105

Abstract: An optical reflecting device includes a mirror part, a pair of joints, a pair of vibration parts, a plurality of driving parts, and a fixed part. Each of the joints has a first end connected to respective one the facing positions to each other on the mirror part and a second end opposite to the first end, and extends along a first axis. Each of the vibration parts has a central portion connected to the second end of respective one of the joints. A plurality of driving parts are disposed in each of the pair of vibration parts, and rotate the mirror part. Both ends of each of the pair of vibration parts are connected to the fixed part. The beam width defined as the length of each of the joints in a direction orthogonal to the first axis is greater than the beam width of each of the pair of vibration parts.

Abstract translation: 光反射装置包括镜部，一对接头，一对振动部，多个驱动部以及固定部。 每个接头具有在反射镜部分上彼此相对的相应位置的第一端和与第一端相对的第二端，并且沿着第一轴线延伸。 每个振动部分具有连接到相应的一个接头的第二端的中心部分。 在所述一对振动部的每一个中设置有多个驱动部，并且旋转所述镜部。 一对振动部的两端部与固定部连接。 被定义为与第一轴正交的方向上的每个接头的长度的梁宽度大于该对振动部分中的每一个的梁宽度。

公开(公告)号：US09511994B2

公开(公告)日：2016-12-06

申请号：US14480051

申请日：2014-09-08

Applicant: INVENSENSE, INC.

Inventor： Julius Ming-Lin Tsai ,  Michael J. Daneman

IPC: H01L29/84 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B3/0029 ,  B81B2201/032 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00182 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0792

Abstract: A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a third surface bonded to the insulating layer and a fourth surface; a piezoelectric layer deposited over the fourth surface of the device layer; a metal conductivity layer disposed over the piezoelectric layer; a bond layer disposed over a portion of the metal conductivity layer; and a stand-off formed on the first silicon substrate; wherein the first silicon substrate is bonded to a second silicon substrate, comprising: a metal electrode configured to form an electrical connection between the metal conductivity layer formed on the first silicon substrate and the second silicon substrate.

Abstract translation: 公开了一种微机电系统装置。 微机械系统装置包括第一硅衬底，其包括：手柄层，包括第一表面和第二表面，所述第二表面包括空腔; 沉积在手柄层的第二表面上的绝缘层; 具有结合到绝缘层的第三表面和第四表面的器件层; 沉积在器件层的第四表面上的压电层; 设置在所述压电层上的金属导电层; 设置在所述金属导电层的一部分上的接合层; 以及在所述第一硅衬底上形成的间隔件; 其中所述第一硅衬底接合到第二硅衬底，包括：金属电极，被配置为在所述第一硅衬底上形成的所述金属传导层与所述第二硅衬底之间形成电连接。

公开(公告)号：US20160340178A1

公开(公告)日：2016-11-24

申请号：US15154900

申请日：2016-05-13

Applicant: uBeam Inc.

Inventor： Andrew Joyce ,  Sean Taffler ,  Paul Reynolds ,  Nicholas Lavada Nemeth ,  Adam Stephen Elhadad ,  Boozarjomehr Faraji

IPC: B81C1/00 ,  B29C65/52 ,  B29C65/48 ,  B81B3/00

CPC classification number: B81C1/00182 ,  B81B2201/0271 ,  B81B2201/032 ,  B81B2203/0127 ,  B81C2203/032 ,  F16B11/006 ,  G03F7/00 ,  H01L21/00

Abstract: Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.

Abstract translation: 提供了用于膜结合的系统和技术。 可以将光致抗蚀剂施加到超声波装置。 光刻胶的一部分可以被去除。 粘合剂可以施加未被除去的光致抗蚀剂的一部分。 膜可以放置在超声波装置上，使得膜通过粘合剂和光致抗蚀剂与超声波装置接触。 膜和超声波装置可以放置在第一平板和第二平板之间，使得第二平板位于膜的顶部上。 可以对膜施加轻微的压力。 轻压力可以通过第二平板的一个或多个重量和对第一平板和第二平板中的任一个或两者施加压力的压力提供装置施加。