公开(公告)号：US20050230146A1

公开(公告)日：2005-10-20

申请号：US11101163

申请日：2005-04-07

Applicant: Hideki Koyama

Inventor： Hideki Koyama

IPC: H01L23/498 ,  H01P3/08 ,  H05K1/11 ,  H05K1/16 ,  H05K3/42 ,  H05K3/46 ,  H05K7/06

CPC classification number: H01L23/49822 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01P3/088 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/115 ,  H05K1/162 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/10674

Abstract: A multilayer printed board comprising a plurality of capacitive coupling layers (6) each consisting of a dielectric layer (4) and a power supply layer (3) and a ground layer (5) facing each other while sandwiching the dielectric layer (4), first vias (7) connecting between the power supply layers (3) included in the plurality of capacitive coupling layers (6), and second vias (8) connecting between the ground layers (5) included in the plurality of capacitive coupling layers (6).

Abstract translation: 一种多层印刷电路板，包括多个电容耦合层（6），每个电容耦合层由电介质层（4）和电源层（3）和接地层（5）组成，同时夹着电介质层（4）， 连接在多个电容耦合层（6）中的电源层（3）之间的第一通孔（7）和连接在多个电容耦合层（6）中包括的接地层（5）之间的第二通孔（8） ）。

公开(公告)号：US20050205293A1

公开(公告)日：2005-09-22

申请号：US10902157

申请日：2004-07-30

Applicant: Akira Yamada ,  Ayumi Nozaki ,  Shu Yamashita

Inventor： Akira Yamada ,  Ayumi Nozaki ,  Shu Yamashita

IPC: B32B7/02 ,  C04B35/10 ,  C04B35/14 ,  C04B35/185 ,  C04B35/581 ,  C04B35/584 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40

CPC classification number: H01L23/13 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/538 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/246 ,  H05K3/4061 ,  H05K2201/0175 ,  H05K2201/0347 ,  H05K2201/09045 ,  H05K2201/09436 ,  H05K2203/0594 ,  Y10T428/24926 ,  H01L2924/00

Abstract: A substrate has a base, an intermediate layer a conductive layer, and conductive films. The base is a ceramic insulator. The intermediate layer on a main surface of the base. The conductive layer is on the intermediate layer The conductive films are on the conductive layer, covering an exposed portion of the conductive layer.

Abstract translation: 衬底具有基底，中间层，导电层和导电膜。 基座是陶瓷绝缘体。 基底主表面上的中间层。 导电层在中间层上。导电膜位于导电层上，覆盖导电层的暴露部分。

公开(公告)号：US20050111162A1

公开(公告)日：2005-05-26

申请号：US10974789

申请日：2004-10-28

Applicant: Tetsuya Osaka ,  Ichiro Koiwa ,  Akira Hashimoto ,  Yoshimi Sato

Inventor： Tetsuya Osaka ,  Ichiro Koiwa ,  Akira Hashimoto ,  Yoshimi Sato

IPC: H01G4/12 ,  H01G2/00 ,  H01G4/008 ,  H01G4/06 ,  H01G4/30 ,  H01G4/33 ,  H01G13/00 ,  H01G13/06 ,  H01L21/822 ,  H01L27/04 ,  H05K1/16 ,  H05K3/38 ,  H05K3/46

CPC classification number: H01G4/33 ,  H01G4/008 ,  H01G4/1227 ,  H01G13/006 ,  H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: A capacitor capable of being incorporated into a packaging substrate, characterized in that the capacitor comprises a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.

Abstract translation: 一种能够结合到封装基板中的电容器，其特征在于，电容器包括高介电常数层，以及从上侧和下侧夹着高介电常数层的上电极层和下电极层 侧。 还提供了包含该电容器的封装基板及其制造方法。

公开(公告)号：US20040202823A1

公开(公告)日：2004-10-14

申请号：US10352514

申请日：2003-01-28

Inventor： Hideki Yoshikawa ,  Takashi Umemoto ,  Keiichi Kuramoto ,  Hitoshi Hirano

IPC: B32B001/00

CPC classification number: C04B37/005 ,  B32B18/00 ,  B32B2315/02 ,  C04B37/025 ,  C04B2235/483 ,  C04B2235/94 ,  C04B2237/062 ,  C04B2237/068 ,  C04B2237/34 ,  C04B2237/346 ,  C04B2237/40 ,  C04B2237/60 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/706 ,  H03H2001/0085 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/165 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0175 ,  H05K2201/086 ,  H05K2203/121 ,  Y10T428/24628

Abstract: Between dielectric ceramic sheets 11A-11C and magnetic ceramic sheets 13A-13C, metallic alkoxide solution films are formed so as not to interfere with wiring patterns 12A-12C and 14A-14C. Thereafter, the dielectric ceramic sheets 11A-11C and the magnetic ceramic sheets 13A-13C are stacked and heat-treated at the temperature of about 200-400null C. This heat treatment leads to a sol-gel reaction of the metallic alkoxide solution, thereby providing intermediate layers 15. Through the intermediate layers 15, the adjacent ceramic sheets are coupled with each other. Since the ceramic sheets are coupled with each other using the sol-gel reaction which proceeds at a low temperature of about 200-400null C., the ceramic laminate is prevented from being deformed due to a difference in the thermal shrinkage coefficient between the ceramic sheets, thereby providing a ceramic laminate with no warpage and peeling.

Abstract translation: 在电介质陶瓷片11A-11C和磁性陶瓷片13A-13C之间，形成金属醇盐溶液膜，以便不干扰布线图形12A-12C和14A-14C。 然后，介电陶瓷片11A-11C和磁性陶瓷片13A-13C在约200-400℃的温度下堆叠并热处理。该热处理导致金属醇盐溶液的溶胶 - 凝胶反应， 从而提供中间层15.通过中间层15，相邻的陶瓷片彼此连接。 由于使用在约200-400℃的低温下进行的溶胶 - 凝胶反应使陶瓷片彼此结合，因此陶瓷层压体由于陶瓷的热收缩系数的差异而被防止变形 从而提供没有翘曲和剥离的陶瓷层压体。

公开(公告)号：US06673388B2

公开(公告)日：2004-01-06

申请号：US09844019

申请日：2001-04-27

Applicant: Thomas N. Blanton ,  Syamal K. Ghosh ,  Donn B. Carlton ,  Dilip K. Chatterjee

Inventor： Thomas N. Blanton ,  Syamal K. Ghosh ,  Donn B. Carlton ,  Dilip K. Chatterjee

IPC: B05D512

CPC classification number: H05K1/162 ,  C23C18/14 ,  H05K3/1241 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/0126 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/121

Abstract: A method of making a charge containing element including the steps of depositing and patterning a dielectric material on a surface wherein the dielectric material includes a metallo-organic component and a liquid component; and decomposing by laser light the deposited dielectric material to substantially evaporate the liquid component to cause the metallic portion of the metallo-organic component to react with oxygen causing the dielectric material to have charge-holding properties.

Abstract translation: 一种制造含电荷元素的方法，包括以下步骤：在介电材料包括金属有机组分和液体组分的表面上沉积和图案化电介质材料; 并通过激光分解沉积的电介质材料，以使液体组分基本蒸发，使金属 - 有机组分的金属部分与氧反应，导致电介质材料具有电荷保持性能。

公开(公告)号：US20030219991A1

公开(公告)日：2003-11-27

申请号：US10462476

申请日：2003-06-16

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Joseph E. Geusic ,  Alan R. Reinberg

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H01L21/76852 ,  H01L21/288 ,  H01L21/321 ,  H01L21/32135 ,  H01L21/76823 ,  H01L21/76825 ,  H01L21/76838 ,  H01L21/76841 ,  H01L21/76856 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76885 ,  H01L21/76888 ,  H05K3/02 ,  H05K3/105 ,  H05K3/108 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/1142 ,  H05K2203/1157

Abstract: A patterning method includes providing a first material (e.g., copper) and transforming at a least a surface region of the first material to a second material (e.g., copper oxide). One or more portions of the second material (e.g., copper oxide) are converted to one or more converted portions of first material (e.g., copper) while one or more portions of the second material (e.g., copper oxide) remain. One or more portions of the remaining second material (e.g., copper oxide) are removed selectively relative to converted portions of first material (e.g., copper). Further, a thickness of the converted portions may be increased. Yet further, a diffusion barrier layer may be used for certain applications.

Abstract translation: 图案化方法包括提供第一材料（例如铜）并在第一材料的至少一个表面区域转化为第二材料（例如氧化铜）。 第二材料（例如氧化铜）的一个或多个部分被转换成第一材料（例如铜）的一个或多个转换部分，同时保留第二材料（例如氧化铜）的一个或多个部分。 选择性地相对于第一材料（例如铜）的转化部分去除剩余的第二材料（例如，氧化铜）的一个或多个部分。 此外，可以增加转换部分的厚度。 此外，扩散阻挡层可以用于某些应用。

公开(公告)号：US20030145458A1

公开(公告)日：2003-08-07

申请号：US10279980

申请日：2002-10-25

Applicant: FUJITSU LIMITED

Inventor： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe

IPC: H05K003/36 ,  H05K003/02 ,  H05K003/10

CPC classification number: H05K3/4661 ,  H05K3/108 ,  H05K3/38 ,  H05K3/389 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/066 ,  H05K2203/1152 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar structure which includes insulating layers and a wiring pattern. The method includes at least the steps of sticking a support whose surface has been treated with a coupling agent onto an insulating layer with a coupling agent interposed therebetween, and transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer.

Abstract translation: 提供一种用于制造多层布线板的方法，其中在绝缘层和布线图案之间实现良好的粘合。 多层布线基板具有包括绝缘层和布线图案的层状结构。 该方法至少包括以下步骤：将其表面已经用偶联剂处理的载体粘附到绝缘层上，其间插入有偶联剂，并且通过在离开偶联剂的同时除去载体将偶联剂转移到绝缘层上 绝缘层。

公开(公告)号：US06602653B1

公开(公告)日：2003-08-05

申请号：US09648884

申请日：2000-08-25

Applicant: Joseph E. Geusic ,  Alan R. Reinberg

Inventor： Joseph E. Geusic ,  Alan R. Reinberg

IPC: G03C500

CPC classification number: H01L21/76852 ,  H01L21/288 ,  H01L21/321 ,  H01L21/32135 ,  H01L21/76823 ,  H01L21/76825 ,  H01L21/76838 ,  H01L21/76841 ,  H01L21/76856 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76885 ,  H01L21/76888 ,  H05K3/02 ,  H05K3/105 ,  H05K3/108 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/1142 ,  H05K2203/1157

Abstract: A patterning method includes providing a first material (e.g., copper) and transforming at a least a surface region of the first material to a second material (e.g., copper oxide). One or more portions of the second material (e.g., copper oxide) are converted to one or more converted portions of first material. (e.g., copper) while one or more portions of the second material (e.g., copper oxide) remain. One or more portions of the remaining second material (e.g., copper oxide) are removed selectively relative to converted portions of first material (e.g., copper). Further, a thickness of the converted portions may be increased. Yet further, a diffusion barrier layer may be used for certain applications.

Abstract translation: 图案化方法包括提供第一材料（例如铜）并在第一材料的至少一个表面区域转化为第二材料（例如氧化铜）。 第二材料（例如氧化铜）的一个或多个部分被转换成第一材料的一个或多个转换部分。 （例如铜），而第二材料（例如氧化铜）的一个或多个部分保留。 选择性地相对于第一材料（例如铜）的转化部分去除剩余的第二材料（例如，氧化铜）的一个或多个部分。 此外，可以增加转换部分的厚度。 此外，扩散阻挡层可以用于某些应用。

公开(公告)号：US06593255B1

公开(公告)日：2003-07-15

申请号：US09705353

申请日：2000-11-03

Applicant: Ernest L. Lawton ,  Vedagiri Velpari ,  William B. Rice ,  Walter J. Robertson ,  Bruce E. Novich ,  Xiang Wu ,  Kami Lammon-Hilinski

Inventor： Ernest L. Lawton ,  Vedagiri Velpari ,  William B. Rice ,  Walter J. Robertson ,  Bruce E. Novich ,  Xiang Wu ,  Kami Lammon-Hilinski

IPC: B32B900

CPC classification number: B32B9/00 ,  C03C25/00 ,  C03C25/10 ,  C03C25/26 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2964 ,  Y10T442/20 ,  Y10T442/3049

Abstract: A fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals. A reinforced laminate comprising: (a) at least one matrix material; and (b) at least one fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 0.2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals.

Abstract translation: 一种织物，其包含至少一根纤维束，其包含多根纤维，并且在所述至少一条纤维束的至少一个表面上具有树脂相容的涂料组合物，其中所述至少一条纤维束具有更大的空气喷射输送阻力值 通过具有直径为2毫米的内部空气喷射室的针气喷嘴单元确定的每克质量的绞线的100,000克力和具有274米长度的绞线进给速度的20厘米长度的喷嘴出口管 分钟，气压310千帕。 一种增强层压板，包括：（a）至少一种基体材料; 和（b）至少一种织物，其包含至少一根包含多根纤维并且在所述至少一根纤维束的至少一个表面上具有树脂相容性涂料组合物的纤维束，其中所述至少一根纤维束具有空气喷射 运输阻力通过具有直径为0.2毫米的内部空气喷射室的针空气喷嘴单元和在一根股线上具有20厘米长度的喷嘴出口管确定的每克质量的股线的大于100,000克力的运输阻力值 进料速度为274米/分钟，空气压力为310千帕。

公开(公告)号：US06524352B2

公开(公告)日：2003-02-25

申请号：US10043830

申请日：2002-01-09

Applicant: Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

Inventor： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

IPC: H01G900

CPC classification number: H05K1/053 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/162 ,  H05K3/403 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0338 ,  H05K2201/0919 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y10T29/417 ,  H01L2924/00

Abstract: A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.