公开(公告)号：US4728534A

公开(公告)日：1988-03-01

申请号：US892629

申请日：1986-08-04

Applicant: Roland K. Ho ,  Richard H. Jung

Inventor： Roland K. Ho ,  Richard H. Jung

IPC: H01C17/28 ,  H05K1/09 ,  H05K1/16 ,  H05K3/46 ,  B05D5/12

CPC classification number: H05K1/167 ,  H01C17/28 ,  H05K3/4685 ,  H05K1/092 ,  H05K2201/035 ,  H05K2203/1453

Abstract: In one embodiment of the present invention a thick film resistor structure comprising common materials is disclosed. The structure includes a supporting carrier as a base for the thick film resistor arrangement, which comprises a resistive material printed on the carrier, first and second noble metal terminating layers connected to either side of the resistive material, first and second barrier layers respectively connected to the first and second noble metal terminating layers, and first and second conducting layers respectively connected to said first and second barrier layers. The barrier layers are preferably composed of nickel or tungsten, whereas the noble metal terminating layers are preferably composed of silver. The resistive material, being formed between the terminating layers, is electrically connected to said copper conducting layers to form a precise thick film resistor structure whose resistance is measurable between said conducting layers.

Abstract translation: 在本发明的一个实施例中，公开了包含普通材料的厚膜电阻器结构。 该结构包括作为厚膜电阻器布置的基底的支撑载体，其包括印刷在载体上的电阻材料，连接到电阻材料的任一侧的第一和第二贵金属端接层，第一和第二阻挡层分别连接到 第一和第二贵金属端接层，以及分别连接到所述第一和第二阻挡层的第一和第二导电层。 阻挡层优选由镍或钨构成，而贵金属端接层优选由银构成。 形成在端接层之间的电阻材料电连接到所述铜导电层以形成精确的厚膜电阻器结构，其电阻可在所述导电层之间测量。

公开(公告)号：US4600663A

公开(公告)日：1986-07-15

申请号：US659503

申请日：1984-10-10

Applicant: Brian T. Robertson

Inventor： Brian T. Robertson

IPC: H01P3/08 ,  H01P11/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  C03C27/02

CPC classification number: H01P3/081 ,  H01P11/003 ,  H05K1/0242 ,  H05K3/245 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2201/098 ,  H05K2203/1476 ,  Y10S428/925 ,  Y10T428/12396 ,  Y10T428/12611

Abstract: A method for fabricating a microstrip resonator line permitting precise control of line width, edge definition and thickness. On a substrate, there is printed a first conductive layer having a precisely controlled width. This first layer has a thickness less than the desired thickness of the resonator line. Further conductive layers are printed over the first layer to build up to the desired thickness of the resonator line based on skin depth requirement at the frequency of operation. Each of the further conductive layers for building the thickness of the line has a width less than that of the first conductive layer so that resonator line width is controlled by the width of the first layer.

Abstract translation: 一种用于制造微带谐振器线的方法，其允许精确控制线宽，边缘清晰度和厚度。 在基板上印刷具有精确控制宽度的第一导电层。 该第一层的厚度小于谐振器线的所需厚度。 基于在操作频率下的皮肤深度要求，在第一层上印刷进一步的导电层以形成谐振器线的期望厚度。 用于构建线的厚度的每个另外的导电层具有小于第一导电层的宽度的宽度，使得谐振器线宽度受到第一层的宽度的控制。

公开(公告)号：US4331700A

公开(公告)日：1982-05-25

申请号：US258433

申请日：1981-04-28

Applicant: Robert L. Schelhorn

Inventor： Robert L. Schelhorn

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K3/245 ,  H05K1/092 ,  H05K1/0306 ,  H05K1/117 ,  H05K2201/035 ,  H05K2203/1476 ,  Y10T29/49162 ,  Y10T29/49163

Abstract: An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.

Abstract translation: 改进的复合衬底包括难熔金属的图案化表面导电层和图案化补偿导电层。 图案化补偿层完全覆盖并延伸超过收缩的图案化导电层。 此外，制造诸如电阻器的厚膜元件并且接触图案化补偿导电层的选定区域。

公开(公告)号：US3971610A

公开(公告)日：1976-07-27

申请号：US468652

申请日：1974-05-10

Applicant: Leonard S. Buchoff ,  Joseph P. Kosiarski ,  Chris A. Dalamangas

Inventor： Leonard S. Buchoff ,  Joseph P. Kosiarski ,  Chris A. Dalamangas

IPC: G04C3/00 ,  G04G17/06 ,  H01R12/51 ,  H01R13/24 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K1/04

CPC classification number: H01R13/2414 ,  G04C3/005 ,  G04G17/06 ,  H01R12/714 ,  H05K3/247 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/0314 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/1059 ,  H05K2203/0113 ,  H05K2203/0134 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/1233 ,  H05K3/306 ,  H05K3/4015

Abstract: Contacts of electrically conductive elastomers, integrally fixed to conductors by bonding or molding in place, are situated to contact, with little resistance, mating electrical conductors and elastically deform under the contacting forces to seal the mated conductor surface thereby inhibiting corrosion and maintaining electrical contact.

Abstract translation: 导电弹性体的接触通过接合或成型在一体地固定到导体，被定位成以很小的阻力接触配合的电导体并且在接触力下弹性变形以密封配合的导体表面，从而抑制腐蚀并保持电接触。

公开(公告)号：US3648364A

公开(公告)日：1972-03-14

申请号：US3648364D

申请日：1970-04-30

Applicant: HOKURIKU ELECT IND

Inventor： ENDO TSUNEHIKO

IPC: H01C1/14 ,  H01C7/00 ,  H05K1/09 ,  H05K1/16 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01C17/00

CPC classification number: H05K1/167 ,  H01C1/14 ,  H01C7/00 ,  H05K1/095 ,  H05K3/06 ,  H05K3/28 ,  H05K3/386 ,  H05K3/42 ,  H05K3/427 ,  H05K3/4664 ,  H05K2201/0323 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2201/09881 ,  H05K2203/1453 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/4913

Abstract: A printed resistor comprising an insulating matrix board, copper layers printed on one side of said board by etching and having predetermined patterns, impedance layers screen printed on the other side of said board, and conductors applied in holes formed in said board and extending through said holes for electrically connecting between selected ones of said copper layers and said impedance layers and the process for producing said printed resistor.

Abstract translation: 一种印刷电阻器，包括绝缘矩阵板，通过蚀刻印刷在所述板的一侧上并具有预定图案的铜层，印刷在所述板的另一侧上的阻挡层丝网印刷，以及施加在形成在所述板中并延伸穿过所述板的孔中的导体 用于电连接所述铜层中的所选铜层和所述阻抗层的孔以及用于制造所述印刷电阻器的工艺。

公开(公告)号：US11751336B2

公开(公告)日：2023-09-05

申请号：US17994551

申请日：2022-11-28

Applicant: LUMET TECHNOLOGIES LTD.

Inventor： Benzion Landa ,  Haim Touitou ,  Stanislav Thygelbaum ,  Naomi Elfassy

IPC: H05K3/20 ,  H05K3/38 ,  B41M1/12 ,  H01L31/0224 ,  H05K3/34 ,  H05K1/03 ,  H05K1/09 ,  H01L31/0216 ,  H01L31/0392 ,  H01L31/20 ,  H05K1/16

CPC classification number: H05K3/207 ,  B41M1/12 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/03926 ,  H01L31/206 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/3485 ,  H05K3/386 ,  H05K1/165 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/10098 ,  H05K2203/0139 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/1476 ,  H05K2203/1545 ,  Y02E10/50

Abstract: An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises:



respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another,
a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated,
a cooling station for cooling the web after passage through the nip, and
a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

公开(公告)号：US09888585B2

公开(公告)日：2018-02-06

申请号：US14865143

申请日：2015-09-25

Applicant: Tokyo Electron Limited ,  A School Corporation Kansai University

Inventor： Shoso Shinguhara ,  Kohei Ota ,  Mitsuaki Iwashita ,  Nobutaka Mizutani

IPC: H05K3/00 ,  H05K3/42 ,  H05K1/03 ,  H05K3/24

CPC classification number: H05K3/422 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/0044 ,  H05K3/247 ,  H05K3/421 ,  H05K2201/035 ,  H05K2203/025 ,  H05K2203/073

Abstract: Adhesion of an underlying diffusion barrier metal film and an electroless copper plating film with respect to an insulating film can be improved. A method for manufacturing a wiring structure includes a process of forming the underlying diffusion barrier metal film 5, including a base metal with respect to copper, on the insulating film 1; and a process of forming the electroless copper plating film 6 on the underlying diffusion barrier metal film 5 by performing an electroless copper displacement plating process with a copper displacement plating solution. The copper displacement plating solution is an acidic copper displacement plating solution of pH1 to pH4, in which copper ions are contained but a reducing agent for reducing the copper ions is not contained.

公开(公告)号：US09768036B2

公开(公告)日：2017-09-19

申请号：US12152021

申请日：2008-05-12

Applicant: Christian Göbl ,  Heiko Braml

Inventor： Christian Göbl ,  Heiko Braml

IPC: H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L23/373 ,  H01L23/00 ,  H05K3/12 ,  H05K3/24 ,  C04B35/645 ,  C04B37/02 ,  H01L23/498 ,  H01L25/07 ,  H05K1/03 ,  H05K3/06

CPC classification number: H01L21/4867 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/05644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/75317 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/1283 ,  H05K3/247 ,  H05K2201/0133 ,  H05K2201/035 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A power semiconductor substrate comprising an insulating planar base, at least one conductor track and at least one contact area as part of the conductor track, wherein a layer of a metallic material is disposed on the contact area by means of pressure sintering. The associated method comprises the steps of: producing a power semiconductor substrate that includes a planar insulating base, conductor tracks and contact areas; arranging a pasty layer, composed of a metallic material and a solvent, on at least one contact area of the power semiconductor substrate; and applying pressure to the pasty layer.

公开(公告)号：US09699902B1

公开(公告)日：2017-07-04

申请号：US14340432

申请日：2014-07-24

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  David Geiger ,  Anwar Mohammed

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/09 ,  H05K3/46 ,  H05K1/02 ,  H05K3/36 ,  H05K3/42

CPC classification number: H05K1/144 ,  H05K1/0271 ,  H05K1/09 ,  H05K1/097 ,  H05K1/115 ,  H05K1/116 ,  H05K3/36 ,  H05K3/42 ,  H05K3/4623 ,  H05K2201/035 ,  H05K2201/0394 ,  H05K2201/044 ,  H05K2201/096 ,  H05K2203/0545 ,  H05K2203/061 ,  H05K2203/1131

Abstract: A printed circuit board is formed from a plurality of thinner PCBs stacked on top of each other with an intermediate metal interconnect material selectively positioned between adjacent PCBs. The metal interconnect material is selectively positioned on surface contact points of correspondingly aligned plated through holes on the adjacent printed circuit boards. The stacked printed circuit boards and intermediate metal interconnect material are laminated, thereby sintering the metal interconnect material and the surface contact points of the plated through holes to form electrical interconnects between plated through holes on adjacent printed circuit boards. The metal interconnect material is preferably the same as the plating material used to plate the through holes, such as copper.

公开(公告)号：US09426885B2

公开(公告)日：2016-08-23

申请号：US14261465

申请日：2014-04-25

Applicant: Todd Mathew Spath ,  Ronald Steven Cok

Inventor： Todd Mathew Spath ,  Ronald Steven Cok

IPC: H05K1/09 ,  H05K3/24 ,  G06F3/044 ,  G06F3/041 ,  H05K1/18

CPC classification number: H05K1/097 ,  G06F3/047 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/189 ,  H05K3/1258 ,  H05K3/247 ,  H05K2201/0108 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/1545

Abstract: A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking.

Abstract translation: 一种耐裂纹的多层微线结构，包括具有表面的基底，在基底中形成的一个或多个微通道，形成位于每个微通道中的第一层的导电第一材料组合物，以及导电 第二材料组合物具有比形成位于每个微通道中的第二层的第一材料组合物更大的拉伸延展性，第一材料组合物和第二材料组合物电接触以在每个微通道中形成导电多层微线 通道，由此多层微线耐开裂。