公开(公告)号：US20140301080A1

公开(公告)日：2014-10-09

申请号：US14211046

申请日：2014-03-14

Applicant: LG Innotek Co., Ltd.

Inventor： Dong Nyung LIM ,  Do Hwan KIM ,  Sang Hoon LEE ,  Keun Tak JOO ,  Tae Young CHOI

IPC: F21V29/00

CPC classification number: F21V29/773 ,  F21K9/23 ,  F21K9/238 ,  F21K9/90 ,  F21V23/006 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10106

Abstract: A lighting device may be provided that includes: a heat sink; a light source module which is disposed on the heat sink, includes a substrate having at least one hole, and includes a plurality of light emitting devices disposed on a top surface of the substrate; a power supply unit which is disposed within the heat sink and includes a support plate and a plurality of parts disposed on the support plate; and a soldering portion which connects the substrate and the support plate. The support plate includes an extended substrate which is disposed in the hole of the substrate. The extended substrate includes a through-portion which has passed through the hole of the substrate. The soldering portion electrically connects the through-portion of the extended substrate and the top surface of the substrate.

Abstract translation: 可以提供照明装置，其包括：散热器; 设置在散热器上的光源模块包括具有至少一个孔的衬底，并且包括设置在衬底顶表面上的多个发光器件; 电源单元，其设置在所述散热器内，并且包括支撑板和设置在所述支撑板上的多个部件; 以及连接基板和支撑板的焊接部。 支撑板包括设置在基板的孔中的延伸基板。 延伸的基板包括穿过基板的孔的通孔部分。 焊接部电连接延伸基板的贯通部和基板的上表面。

公开(公告)号：US08832932B2

公开(公告)日：2014-09-16

申请号：US13305756

申请日：2011-11-29

Applicant: Xiao-Hui Zhou ,  Hong Li ,  Ping Li ,  Rui Li

Inventor： Xiao-Hui Zhou ,  Hong Li ,  Ping Li ,  Rui Li

IPC: H05K3/30 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K3/0052 ,  H05K3/306 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09145 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A printed circuit board assembly (PCBA) includes a printed circuit board (PCB) with through holes, a supporting member standing on the PCB adjacent to the through holes, and an electronic component mounted on the PCB is provided. The electronic component includes a component body and a plurality of conductive leads. Fixing ends of the conductive leads of the electronic component is received in the though hole and electrically and mechanically fixed to the PCB. The component body of the electronic component is supported by the supporting member.

Abstract translation: 印刷电路板组件（PCBA）包括具有通孔的印刷电路板（PCB），邻近通孔站立在PCB上的支撑构件，以及安装在PCB上的电子部件。 电子部件包括部件主体和多个导电引线。 电子部件的导电引线的固定端部被容纳在通孔中，并且电和机械地固定到PCB。 电子部件的部件主体由支撑部件支撑。

公开(公告)号：US20140027158A1

公开(公告)日：2014-01-30

申请号：US13707572

申请日：2012-12-06

Applicant: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., ,  HON HAI PRECISON INDUSTRY CO., LTD.

Inventor： SHIN-WEN CHEN ,  WEN-HSIUNG CHEN ,  YU-TSAN CHENG ,  WEN-CHANG CHEN ,  SHU-SHENG PENG

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H05K1/02 ,  H05K1/18 ,  H05K3/0061 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/093

Abstract: A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.

Abstract translation: 电路板组件包括柔性电路板，电介质层和加强板。 柔性电路板包括表面。 铜镀层位于表面。 镀铜层包括电路部分和接地部分。 电路部分被电介质层完全覆盖。 接地部分暴露在电介质层的外部。 介电层包括接合部分。 加强板包括连接表面。 连接表面限定空间对应于结合部分的空腔。 连接表面还包括相对于空腔的底表面膨胀的延伸部分。 延伸部在空间上对应于接地部。 接合部分被容纳在空腔中，其中延伸部分借助于导电粘合剂与接地部分接触并电连接。

公开(公告)号：US08570745B2

公开(公告)日：2013-10-29

申请号：US13310101

申请日：2011-12-02

Applicant: Ted Ju ,  Chin Chi Lin

Inventor： Ted Ju ,  Chin Chi Lin

IPC: H05K7/20 ,  H05K1/14

CPC classification number: H01L23/36 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/10477 ,  H01L2924/00

Abstract: The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board.

Abstract translation: 本发明涉及电连接器组件。 电连接器组件包括具有通孔的主电路板，处理器和辅助电路板。 处理器包括芯片和基板。 芯片电连接到基板并位于通孔中。 衬底至少部分地位于通孔中。 辅助电路板具有过渡连接面。 电连接的第一导电区域和第二导电区域设置在过渡连接面上。 第一导电区域电连接到基板，并且第二导电区域电连接到主电路板。

公开(公告)号：US20130244490A1

公开(公告)日：2013-09-19

申请号：US13879883

申请日：2011-11-29

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H01R31/06 ,  H05K3/12 ,  H05K3/10

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract translation: 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。

公开(公告)号：US20130135836A1

公开(公告)日：2013-05-30

申请号：US13682485

申请日：2012-11-20

Applicant: John Clark Roberts ,  Robert Wayne Ridgeway

Inventor： John Clark Roberts ,  Robert Wayne Ridgeway

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/10

CPC classification number: H05K1/14 ,  H01R12/722 ,  H05K3/10 ,  H05K3/325 ,  H05K3/366 ,  H05K2201/048 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A first printed circuit board (PCB) assembly can include an embedded electrical connector configured to be mechanically coupled to a corresponding tab-shaped portion of a second PCB assembly, such as to permit insertion of the tab-shaped portion of the second PCB assembly into the embedded electrical connector when the second PCB assembly is aligned in a specified orientation. In an example, the second PCB assembly can include an approximately planar conductive antenna.

Abstract translation: 第一印刷电路板（PCB）组件可以包括被配置为机械耦合到第二PCB组件的相应的凸片状部分的嵌入式电连接器，例如允许将第二PCB组件的凸片状部分插入 当第二PCB组件以指定的方向对准时，嵌入式电连接器。 在一个示例中，第二PCB组件可以包括大致平面的导电天线。

公开(公告)号：US08373816B2

公开(公告)日：2013-02-12

申请号：US12607846

申请日：2009-10-28

Applicant: Kwang-Jae Kim ,  Han-Jin Ryu ,  Sang-Moon Moh ,  Hong-Sig Chu ,  Sang-Don Bae ,  In-Jae Hwang

Inventor： Kwang-Jae Kim ,  Han-Jin Ryu ,  Sang-Moon Moh ,  Hong-Sig Chu ,  Sang-Don Bae ,  In-Jae Hwang

IPC: G02F1/13357 ,  H01J9/20

CPC classification number: G02F1/133608 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/009 ,  G02F2001/133612 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/048 ,  H05K2201/10106

Abstract: A liquid crystal display (LCD) device includes an LCD panel displaying an image, a light source providing the LCD panel with light, a light source flexible printed circuit board (FPCB), a printed circuit board (PCB), and a receiving container. The PCB is electrically connected to the LCD panel. The PCB is in contact with two ends of the light source FPCB. The receiving container is combined with the light source FPCB and the PCB. The receiving container has a through-hole through which the light source FPCB passes. According to the present invention, the receiving container applies pressure so that both ends of the light source FPCB make contact with the PCB and the light source FPCB is electrically connected to the PCB. The light source FPCB, the receiving container, and the PCB are secured to each other. Therefore, the number of steps required to assembly the LCD device may be reduced.

Abstract translation: 液晶显示（LCD）装置包括显示图像的LCD面板，向LCD面板提供光的光源，光源柔性印刷电路板（FPCB），印刷电路板（PCB）和接收容器。 PCB电连接到LCD面板。 PCB与光源FPCB的两端接触。 接收容器与光源FPCB和PCB组合。 接收容器具有光源FPCB穿过的通孔。 根据本发明，接收容器施加压力，使得光源FPCB的两端与PCB接触，并且光源FPCB电连接到PCB。 光源FPCB，接收容器和PCB彼此固定。 因此，可以减少组装LCD装置所需的步骤数量。

公开(公告)号：US08206006B2

公开(公告)日：2012-06-26

申请号：US12601020

申请日：2007-05-22

Applicant: Andreas Huber ,  Ralf Hying ,  Peter Niedermeier

Inventor： Andreas Huber ,  Ralf Hying ,  Peter Niedermeier

IPC: F21V21/00

CPC classification number: H05B33/0803 ,  H05K1/147 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/048 ,  H05K2201/10106 ,  H05K2201/1034 ,  H05K2201/10446

Abstract: An illumination device may include a flexible printed circuit board; a power electronics module; and a light-emitting diode module, which is electrically connected to the power electronics module by means of the flexible printed circuit board.

Abstract translation: 照明装置可以包括柔性印刷电路板; 电力电子模块; 以及通过柔性印刷电路板电连接到电力电子模块的发光二极管模块。

公开(公告)号：US07944707B2

公开(公告)日：2011-05-17

申请号：US12030565

申请日：2008-02-13

Applicant: Chih-pin Hung ,  Ying-te Ou

Inventor： Chih-pin Hung ,  Ying-te Ou

IPC: H05K1/18

CPC classification number: H05K1/117 ,  H01L23/13 ,  H01L23/5383 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2203/0307

Abstract: A package structure for connection with an output/input module is disclosed. The package structure can be applied to conventional multi-chip packages and system in packages. The package structure defines at least one insertion cavity that is vertically or horizontally disposed. By simply inserting an output/input module into the insertion cavity, an electrical connection can be established between the output/input module and the package structure. Accordingly, the package structure thus constructed can address the repairing, replacement and upgrading problems of electronic components encountered by a package structure that adopts the conventional soldering connection method.

Abstract translation: 公开了一种用于与输出/输入模块连接的封装结构。 封装结构可以应用于传统的多芯片封装和封装中的系统。 包装结构限定了垂直或水平设置的至少一个插入腔。 通过简单地将输出/输入模块插入到插入腔中，可以在输出/输入模块和封装结构之间建立电连接。 因此，如此构造的封装结构可以解决采用常规焊接连接方法的封装结构所遇到的电子部件的修理，更换和升级问题。

公开(公告)号：US20100240248A1

公开(公告)日：2010-09-23

申请号：US12793379

申请日：2010-06-03

Applicant: CHIH-CHENG CHEN

Inventor： CHIH-CHENG CHEN

IPC: H01R12/24

CPC classification number: H01R12/62 ,  H01R12/58 ,  H01R12/65 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/10303 ,  H05K2201/1059

Abstract: A three-dimensional connector, which is used by a coordinate input device of a touch pad, has a flat conductor cable with an end being connected to the touch pad and another end forming a soldered conductive contact head perpendicular to the flat conductor cable to pass through a support to shorten a length of said conductor cable and enhance electro-conductibility of the connector.

Abstract translation: 由触摸板的坐标输入装置使用的三维连接器具有扁平导体电缆，其端部连接到触摸板，另一端形成垂直于扁平导体电缆的焊接导电接触头以通过 通过支撑件缩短所述导体电缆的长度并增强连接器的导电性。