公开(公告)号：US3644661A

公开(公告)日：1972-02-22

申请号：US3644661D

申请日：1970-12-07

Applicant: WESTERN ELECTRIC CO

Inventor： ASAR MADHU P ,  BOLIN JOHN E ,  MADDOX HARRY L

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K1/18

CPC classification number: H05K3/3405 ,  H05K1/0289 ,  H05K1/118 ,  H05K3/306 ,  H05K3/326 ,  H05K3/3447 ,  H05K3/403 ,  H05K7/08 ,  H05K2201/0367 ,  H05K2201/055 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/1034

Abstract: A flexible, semirigid substrate, composed of a nonconducting material, supports a plurality of spaced, longitudinal conductors on one side thereof and a plurality of parallel, spaced, transverse conductors on the other side thereof. Through-hole connections are made through the substrate between selected longitudinal conductors and selected transverse conductors. The transverse conductors extend to a common edge of the substrate, which is formed with a longitudinal fold. The portion of each of the transverse conductors which extends over the longitudinal fold in the substrate is formed with an elongated opening which is disposed symmetrically about the axis of the transverse conductor. The longitudinal opening provides a saddle for receiving a portion of a terminal which rests in the saddle and can be subsequently soldered with the transverse conductor associated with the saddle.

公开(公告)号：US20230164919A1

公开(公告)日：2023-05-25

申请号：US18094506

申请日：2023-01-09

Applicant: QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  Avary Holding (Shenzhen) Co., Limited.

Inventor： SHI-JIE ZHONG

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K1/147 ,  H05K1/119 ,  H05K3/36 ,  H05K2201/09063 ,  H05K2201/091

Abstract: A circuit board assembly includes a first circuit board and a second circuit board. The first circuit board includes a first contact pad and defines a stamped protrusion being correspondingly positioned relative to a position of the first contact pad, the first contact pad being outside the stamped protrusion. The second circuit board includes a second contact pad. The first contact pad on the stamping protrusion is in contact with the second contact pad to achieve electronic connections between the first circuit board and the second circuit board. A method for manufacturing the circuit board assembly is further disclosed.

公开(公告)号：US11657989B2

公开(公告)日：2023-05-23

申请号：US17029282

申请日：2020-09-23

Applicant: HARRIS CORPORATION

Inventor： Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Paul Brian Jaynes ,  Philip Anthony Marvin

IPC: H01H13/704 ,  H05K3/30 ,  H05K3/46 ,  H01H11/00 ,  H05K1/02

CPC classification number: H01H13/704 ,  H01H11/00 ,  H05K3/303 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4632 ,  H05K1/0284 ,  H05K2201/0141 ,  H05K2201/091 ,  Y10T29/4913 ,  Y10T29/49107

Abstract: A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

公开(公告)号：US20180166230A1

公开(公告)日：2018-06-14

申请号：US15890532

申请日：2018-02-07

Applicant: HARRIS CORPORATION

Inventor： LOUIS JOSEPH RENDEK, JR. ,  LAWRENCE WAYNE SHACKLETTE ,  PAUL BRIAN JAYNES ,  PHILIP ANTHONY MARVIN

IPC: H01H13/704 ,  H05K3/46 ,  H05K3/30 ,  H01H11/00

CPC classification number: H01H13/704 ,  H01H11/00 ,  H05K1/0284 ,  H05K3/303 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4632 ,  H05K2201/0141 ,  H05K2201/091 ,  Y10T29/49107 ,  Y10T29/4913

Abstract: A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with air, and positioning at least one biasing member in the membrane switch recess.

公开(公告)号：US09832889B2

公开(公告)日：2017-11-28

申请号：US14623769

申请日：2015-02-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui

IPC: H05K3/46 ,  B32B3/26 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K3/4697 ,  B32B3/263 ,  B32B2457/08 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/181 ,  H05K1/182 ,  H05K1/186 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0141 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/09909 ,  Y10T29/49126 ,  Y10T428/24612

Abstract: A circuit board includes a main portion and at least one uneven portion. The main portion is obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and subjecting the stacked base sheets to compression bonding. The at least one uneven portion is provided on one of the base sheets. The uneven portion includes a concave portion and a convex portion extending in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in the predetermined direction. The convex portion protrudes in an opposite direction to the predetermined direction.

公开(公告)号：US20170273186A1

公开(公告)日：2017-09-21

申请号：US15255150

申请日：2016-09-02

Applicant: Unimicron Technology Corp.

Inventor： Shih-Lian Cheng

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K3/064 ,  G03F7/0002 ,  G03F7/162 ,  G03F7/20 ,  H05K1/115 ,  H05K3/0023 ,  H05K3/06 ,  H05K3/108 ,  H05K3/4644 ,  H05K3/465 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/0369 ,  H05K2203/0502 ,  H05K2203/0548 ,  H05K2203/0562 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.

公开(公告)号：US20170136944A1

公开(公告)日：2017-05-18

申请号：US14940241

申请日：2015-11-13

Applicant: The Boeing Company

Inventor： Jeff Duce ,  James Schalla ,  Ashley House ,  Jason Turner

IPC: B60Q3/02 ,  H01L33/62 ,  H01L33/48 ,  B64D47/02

CPC classification number: B60Q3/745 ,  B60Q3/43 ,  B60Q3/47 ,  B60Q3/51 ,  B64D47/02 ,  F21S43/00 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/18 ,  H01L2933/0025 ,  H01L2933/0066 ,  H05K1/0274 ,  H05K1/181 ,  H05K1/189 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/14 ,  H05K3/284 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2203/0278

Abstract: Lighting panels and methods of manufacturing lighting panels are described. An example lighting panel includes a substrate that has a planar surface, electrically conductive traces printed onto the planar surface of the substrate, and light sources mounted onto the electrically conductive traces at mounting positions such that the electrically conductive traces form an electrical interconnection between selected ones of the electrically conductive traces and associated ones of the light sources. The lighting panel also includes a polymer sheet provided over the light sources, and a composite base upon which a stack-up of the substrate with the printed electrically conductive traces, the light sources, and the polymer sheet is applied. The light sources are embedded into the composite base and are also flush with a top surface of the stack-up, and the substrate is also embedded into the composite base underneath the light sources at the mounting positions.

公开(公告)号：US09196277B2

公开(公告)日：2015-11-24

申请号：US13856094

申请日：2013-04-03

Applicant: NHK SPRING CO., LTD.

Inventor： Akira Omachi

IPC: G11B5/48 ,  G11B21/16 ,  H01R4/00 ,  G01L9/00 ,  H01R12/55 ,  H05K3/32 ,  H05K3/40 ,  H05K3/30

CPC classification number: G11B5/4833 ,  G01L9/00 ,  G11B5/486 ,  G11B5/4873 ,  H01R4/00 ,  H01R12/55 ,  H05K3/30 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/091 ,  H05K2201/10083 ,  H05K2201/10446

Abstract: A terminal includes a terminal wiring part extending from a flexure and having an insulating layer and a wiring layer formed on the insulating layer, a terminal main part formed at a front end of the terminal wiring part and connected to a piezoelectric element arranged to face the terminal main part, and a terminal bender that is made of a supportive metal layer, is arranged along a part of the terminal wiring part in an extending direction thereof, and is plastically deformed to form a bend in the part of the terminal wiring part so as to bring the terminal main part closer to the piezoelectric element.

Abstract translation: 端子包括从弯曲部延伸并具有形成在绝缘层上的绝缘层和布线层的端子布线部分，形成在端子布线部分的前端并连接到压电元件的端子主体部分，该压电元件布置成面对 端子主体部分和由支撑金属层制成的端子弯曲器沿着端子布线部分的一部分沿其延伸方向布置，并且塑性变形以在端子布线部分的部分中形成弯曲部 使端子主体靠近压电元件。

公开(公告)号：US20150163927A1

公开(公告)日：2015-06-11

申请号：US14623769

申请日：2015-02-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H05K3/46 ,  H05K1/11 ,  B32B3/26 ,  H05K1/18

CPC classification number: H05K3/4697 ,  B32B3/263 ,  B32B2457/08 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/181 ,  H05K1/182 ,  H05K1/186 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0141 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/09909 ,  Y10T29/49126 ,  Y10T428/24612

Abstract: A circuit board includes a main portion and at least one uneven portion. The main portion is obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and subjecting the stacked base sheets to compression bonding. The at least one uneven portion is provided on one of the base sheets. The uneven portion includes a concave portion and a convex portion extending in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in the predetermined direction. The convex portion protrudes in an opposite direction to the predetermined direction.

Abstract translation: 电路板包括主要部分和至少一个不平坦部分。 主要部分是通过在预定方向上堆叠由柔性材料制成的多个基片并对堆叠的基片进行压接而获得的。 至少一个不平坦部分设置在基片之一上。 凹凸部包括在垂直于或大致垂直于预定方向的方向上延伸的凹部和凸部。 凹部沿预定方向凹陷。 凸部沿与预定方向相反的方向突出。

公开(公告)号：US08376787B2

公开(公告)日：2013-02-19

申请号：US13123029

申请日：2009-10-07

Applicant: Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

Inventor： Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

IPC: H01R24/00

CPC classification number: H04Q1/136 ,  H01R4/2433 ,  H01R13/2421 ,  H01R13/4538 ,  H01R13/465 ,  H01R13/6473 ,  H01R13/6616 ,  H01R13/6625 ,  H01R24/64 ,  H01R2201/04 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A termination unit (144) for use with a system that permits the monitoring of a computer network to perform network inventories. The termination unit takes the form of a cap that engages the termination face of a network jack and has a sensing circuit (246) integrated therewith so that, once engaged with the jack, the sensing circuit is connected to two terminals of the jack. The sensing circuit may include a resistor, capacitor or inductor, any of which provide a known sensing value that is different than a sensed value of an end-user device used on the network, but less than infinity so that the system senses when an end-user device is connected to or disconnected from the network.

Abstract translation: 一种与允许监视计算机网络执行网络清单的系统一起使用的终端单元（144）。 终端单元采用与网络插座的端接面接合的帽的形式，并且具有与其一体化的感测电路（246），使得一旦与插座接合，感测电路连接到插座的两个端子。 感测电路可以包括电阻器，电容器或电感器，其中任一个提供与网络上使用的终端用户设备的感测值不同但已经小于无穷远的已知感测值，使得系统感测何时结束 用户设备连接到网络或与网络断开连接。