Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer
    71.
    发明授权
    Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer 失效
    印刷电路板由具有埋入微带线的绝缘层和宽度窄到绝缘层中的导体组成

    公开(公告)号:US08294529B2

    公开(公告)日:2012-10-23

    申请号:US12361781

    申请日:2009-01-29

    Applicant: Heung-Kyu Kim

    Inventor: Heung-Kyu Kim

    Abstract: A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

    Abstract translation: 公开了一种具有微带线的印刷电路板,具有带状线的印刷电路板及其制造方法。 根据本发明实施例的具有微带线的印刷电路板包括第一绝缘层,埋在第一绝缘层的一个表面中的信号线,穿过第一绝缘层并被布置的多个导体 在与信号线并联的信号线的两侧,以及形成为与第一绝缘层的另一个表面上的导体电连接的接地层。

    Electronic component and electronic component module
    72.
    发明授权
    Electronic component and electronic component module 有权
    电子元件和电子元件模块

    公开(公告)号:US08294036B2

    公开(公告)日:2012-10-23

    申请号:US12410699

    申请日:2009-03-25

    Abstract: In a dielectric element, the side faces are roughened so that the surface roughness Ra is 15 nm or greater. By this means, the area of contact between a glass epoxy resin substrate and insulating material is increased, adhesion with resin substrates is improved, and strength and reliability can be enhanced when buried between two resin substrates. In the dielectric element, the surface roughness Ra of side surfaces is 5000 nm or less, so that when burying the dielectric element between a glass epoxy resin substrate and insulating material, the occurrence of air bubbles between the surface of the dielectric element and the resin can be prevented.

    Abstract translation: 在电介质元件中,侧面粗糙化,使得表面粗糙度Ra为15nm以上。 通过这种方式,玻璃环氧树脂基板和绝缘材料之间的接触面积增加,与树脂基板的粘合性提高,并且当埋在两个树脂基板之间时可以提高强度和可靠性。 在电介质元件中,侧面的表面粗糙度Ra为5000nm以下,因此当在玻璃环氧树脂基板和绝缘材料之间埋入电介质元件时,介电元件表面与树脂之间产生气泡 可以防止。

    Method and System for Performing Hole-Plugging Process on Circuit Board
    75.
    发明申请
    Method and System for Performing Hole-Plugging Process on Circuit Board 审中-公开
    电路板上进行孔堵工艺的方法与系统

    公开(公告)号:US20120174805A1

    公开(公告)日:2012-07-12

    申请号:US13383978

    申请日:2010-07-13

    Abstract: The present application discloses a method for performing a hole-plugging process on a circuit board. The method comprises: forming at least two locating holes on the circuit board; delivering the circuit board to a locating area of a hole-plugging screen printer, and adjusting a moving path of the circuit board in the locating area according to a locating device of the hole-plugging screen printer and the locating holes; and transporting the circuit board to a screen printing area of the hole plugging screen printer automatically according to the moving path, and adjusting a hole-plugging stencil of the hole-plugging screen printer to align an inking point of the hole-plugging stencil with a hole to be plugged on the circuit board, so as to plug ink dropped from the inking point of the hole-plugging stencil into the hole. The present application discloses a system for executing above method.

    Abstract translation: 本申请公开了一种在电路板上进行空穴堵塞处理的方法。 该方法包括:在电路板上形成至少两个定位孔; 将电路板输送到孔塞式丝网印刷机的定位区域,根据孔堵丝网印刷机的定位装置和定位孔调整定位区域中电路板的移动路径; 以及根据移动路径自动将电路板传送到孔堵丝网印刷机的丝网印刷区域,以及调整孔封丝网印刷机的孔塞模板以将孔塞模板的着色点与 要插入电路板上的孔,以将从插孔模板的着墨点滴落的墨水插入孔中。 本申请公开了一种用于执行上述方法的系统。

    Printed Circuit Board With Integral Radio-Frequency Shields
    77.
    发明申请
    Printed Circuit Board With Integral Radio-Frequency Shields 有权
    具有整体射频屏蔽的印刷电路板

    公开(公告)号:US20120140423A1

    公开(公告)日:2012-06-07

    申请号:US12958293

    申请日:2010-12-01

    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

    Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰,可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。

    CHIP-TYPE LED AND METHOD OF MANUFACTURING THE SAME
    79.
    发明申请
    CHIP-TYPE LED AND METHOD OF MANUFACTURING THE SAME 有权
    芯片型LED及其制造方法

    公开(公告)号:US20120115263A1

    公开(公告)日:2012-05-10

    申请号:US13353014

    申请日:2012-01-18

    Applicant: Makoto MATSUDA

    Inventor: Makoto MATSUDA

    Abstract: An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.

    Abstract translation: 本发明的实施例具有绝缘基板,其中形成用于安装LED芯片的第一凹孔和用于连接金属小规格金属丝的第二凹孔,其中形成用作第一布线图案的金属片 在包括第一凹孔的部分,在包括第二凹孔的部分处形成用作第二布线图案的金属片,将LED芯片安装在第一凹孔内的金属片上,LED芯片 通过金属小规格导线与第二凹孔内的金属片电连接,芯片型LED用透明树脂密封。

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