公开(公告)号：US09380697B2

公开(公告)日：2016-06-28

申请号：US14583358

申请日：2014-12-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshihiro Tomita ,  Mitsuhiro Kasahara

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/00 ,  H01L23/00 ,  H01L21/56 ,  H05K3/14 ,  H05K3/18

CPC classification number: H05K1/0283 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/146 ,  H05K3/18 ,  H05K3/28 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09263 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2203/0191 ,  H05K2203/1469 ,  H05K2203/308 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic device includes: electronic elements; expandable and contractible conductors each disposed between two of the electronic elements adjacent to each other; a seal which covers the electronic elements and the conductors except principal surfaces of the electronic elements and first surfaces of the conductors, the principal surfaces of the electronic elements and the first surfaces of the conductors being present on a same plane on which surfaces of the seal are present; and leading electrode films each of which is attached in a film-like form to three surfaces which are the surface of the seal positioned between one of the electronic elements and one of the conductors, the first surface of the conductor, and part of the principal surface of the electronic element, to electrically connect the electronic element and the conductor through the leading electrode film.

Abstract translation: 电子设备包括：电子元件; 每个电子元件彼此相邻放置在两个电子元件之间; 密封件，其覆盖电子元件和除电子元件的主表面和导体的第一表面之外的导体，电子元件的主表面和导体的第一表面存在于同一平面上，密封件的表面 存在; 以及引导电极膜，其各自以薄膜状形式连接到位于一个电子元件之间的密封件表面的三个表面，其中一个导体，导体的第一表面和主体的一部分 电子元件的表面，通过前导电极膜电连接电子元件和导体。

公开(公告)号：US20160120040A1

公开(公告)日：2016-04-28

申请号：US14921868

申请日：2015-10-23

Applicant: Nascent Objects, Inc.

Inventor： Baback Elmieh ,  Saurabh Palan ,  Rex Wenters Crossen ,  Alexandre Jais

IPC: H05K3/46 ,  G05B19/4099 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K3/4679 ,  B29C33/0016 ,  B29C33/448 ,  B29C64/00 ,  B29C64/10 ,  B29C2043/3668 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  G05B19/4099 ,  G05B2219/35134 ,  G05B2219/49007 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/097 ,  H05K1/111 ,  H05K1/162 ,  H05K1/183 ,  H05K3/0005 ,  H05K3/0014 ,  H05K3/0044 ,  H05K3/0088 ,  H05K3/101 ,  H05K3/103 ,  H05K3/1258 ,  H05K3/26 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0329 ,  H05K2201/098 ,  H05K2201/10265 ,  H05K2203/0126 ,  H05K2203/0228 ,  H05K2203/0292 ,  H05K2203/0514 ,  H05K2203/06 ,  H05K2203/0783 ,  H05K2203/082 ,  H05K2203/085 ,  H05K2203/1115 ,  H05K2203/1194 ,  H05K2203/128 ,  H05K2203/143 ,  H05K2203/163 ,  H05K2203/175 ,  H05K2203/302 ,  H05K2203/308

Abstract: A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.

Abstract translation: 用至少一个导电迹线形成三维物体的方法包括提供根据三维物体的模型设计从第一材料产生（例如，相加地或相减地产生）的中间结构。 中间结构可以具有用于至少一个导电迹线的至少一个预定位置。 模型设计包括至少一个预定位置。 接下来，可以在中间结构的至少一个预定位置附近生成至少一个导电迹线。 所述至少一个导电迹线可以由具有大于第一材料的电和/或热导率的第二材料形成。

公开(公告)号：US20150216037A1

公开(公告)日：2015-07-30

申请号：US14583358

申请日：2014-12-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YOSHIHIRO TOMITA ,  MITSUHIRO KASAHARA

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/00

CPC classification number: H05K1/0283 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/146 ,  H05K3/18 ,  H05K3/28 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09263 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2203/0191 ,  H05K2203/1469 ,  H05K2203/308 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic device includes: electronic elements; expandable and contractible conductors each disposed between two of the electronic elements adjacent to each other; a seal which covers the electronic elements and the conductors except principal surfaces of the electronic elements and first surfaces of the conductors, the principal surfaces of the electronic elements and the first surfaces of the conductors being present on a same plane on which surfaces of the seal are present; and leading electrode films each of which is attached in a film-like form to three surfaces which are the surface of the seal positioned between one of the electronic elements and one of the conductors, the first surface of the conductor, and part of the principal surface of the electronic element, to electrically connect the electronic element and the conductor through the leading electrode film.

Abstract translation: 电子设备包括：电子元件; 每个电子元件彼此相邻放置在两个电子元件之间; 密封件，其覆盖电子元件和除电子元件的主表面和导体的第一表面之外的导体，电子元件的主表面和导体的第一表面存在于同一平面上，密封件的表面 存在; 以及引导电极膜，其各自以薄膜状形式连接到位于一个电子元件之间的密封件表面的三个表面，其中一个导体，导体的第一表面和主体的一部分 电子元件的表面，通过前导电极膜电连接电子元件和导体。

公开(公告)号：US20150171531A1

公开(公告)日：2015-06-18

申请号：US14615152

申请日：2015-02-05

Applicant: Amazon Technologies, Inc.

Inventor： Nidhi Rathi ,  Edward A. Lilgegren

IPC: H01R12/71 ,  H05K1/18

CPC classification number: H01R12/714 ,  H05K1/18 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/0311 ,  H05K2201/09063 ,  H05K2201/09981 ,  H05K2201/10037 ,  H05K2201/10265 ,  H05K2201/10416 ,  H05K2201/10962

Abstract: An electronic device includes a printed circuit board (PCB) with a first conductive element and having a first side opposite a second side. The electronic device includes a wall disposed on the first side of the PCB and having a channel through the wall. The electronic device includes a supporting structure disposed on the second side of the PCB. The electronic device includes a connector which includes an electrically conductive based configured to provide a conductive path between the first conductive element and the channel and also includes a spring structure disposed between the electrically conductive base and the supporting structure.

Abstract translation: 电子设备包括具有第一导电元件并且具有与第二侧相对的第一侧的印刷电路板（PCB）。 电子设备包括设置在PCB的第一侧上并具有通过壁的通道的壁。 电子设备包括设置在PCB的第二侧上的支撑结构。 电子设备包括连接器，该连接器包括被配置为在第一导电元件和沟道之间提供导电路径的导电基底，并且还包括布置在导电基底和支撑结构之间的弹簧结构。

公开(公告)号：US09013869B2

公开(公告)日：2015-04-21

申请号：US14145584

申请日：2013-12-31

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Gregory Tice

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H05K3/30 ,  H05K7/12 ,  H01L23/473 ,  H01L23/427

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract translation: 公开了一种适用于去除在紧凑的计算环境中工作的集成电路产生的多余热量的低轮廓散热系统。

公开(公告)号：US20150064966A1

公开(公告)日：2015-03-05

申请号：US14017318

申请日：2013-09-04

Applicant: HTC Corporation

Inventor： I-Cheng Chuang ,  Yu-Jing Liao ,  Ying-Yen Cheng ,  Chih-Wei Tu

IPC: H01R13/516

CPC classification number: H01R12/778 ,  G06F1/16 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1658 ,  H01R4/28 ,  H01R4/4809 ,  H01R12/592 ,  H01R12/62 ,  H01R12/722 ,  H01R13/516 ,  H01R43/002 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10265

Abstract: A connector assembly adapted to be disposed in a casing of an electronic device is provided. The connector assembly includes a connector and a locking member. The locking member includes a supporting portion and a holding portion connected to the supporting portion. The connector is disposed on the supporting portion. The locking member is adapted to clamp at an end of a substrate disposed in the casing, and the supporting portion and the holding portion lean against an upper side and a lower side of the end of the substrate respectively. An electronic device including the connector assembly aforementioned is also provided.

Abstract translation: 提供一种适于设置在电子设备的壳体中的连接器组件。 连接器组件包括连接器和锁定构件。 锁定构件包括支撑部分和连接到支撑部分的保持部分。 连接器设置在支撑部分上。 锁定构件适于夹持在设置在壳体中的基板的端部，并且支撑部分和保持部分分别靠在基板的端部的上侧和下侧。 还提供了包括上述连接器组件的电子设备。

公开(公告)号：US20140335705A1

公开(公告)日：2014-11-13

申请号：US13934238

申请日：2013-07-03

Applicant: Unimicron Technology Corp.

Inventor： Chih-Peng Fan ,  Yin-Hwa Cheng ,  Ching-Ho Hsieh ,  Ling-Kai Su ,  Yung-Hao Hsueh

IPC: H01R12/55

CPC classification number: H01R12/718 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01R13/2442 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/10265 ,  H05K2201/10719

Abstract: An electrical connector includes a base an elastic terminal and an elastic terminal. The base has a recess. The elastic terminal is connected to the base and extends to the recess. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to bend towards the bottom of the recess. In addition, the electrical connector may further include a contact protrusion connected to the elastic terminal. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to make the elastic terminal bend towards the bottom portion of the recess.

Abstract translation: 电连接器包括基座，弹性端子和弹性端子。 底座有一个凹槽。 弹性端子连接到基座并延伸到凹部。 当接触件朝向凹部移动时，触头能够推动接触突起朝向凹部的底部弯曲。 此外，电连接器还可以包括连接到弹性端子的接触突起。 当接触件朝向凹部移动时，触头能够推动接触突起，以使弹性端子朝向凹部的底部弯曲。

公开(公告)号：US20140159990A1

公开(公告)日：2014-06-12

申请号：US13711190

申请日：2012-12-11

Applicant: OPTICON SENSORS EUROPE B.V.

Inventor： Alexander Azhari

IPC: H01Q1/22 ,  H01P11/00

CPC classification number: H01Q1/088 ,  H01Q1/38 ,  H01Q9/0421 ,  H05K3/303 ,  H05K3/3415 ,  H05K2201/0311 ,  H05K2201/10098 ,  H05K2201/10265 ,  H05K2201/10568 ,  H05K2201/10621 ,  Y02P70/613 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: An electronic circuit that needs to transmit or receive radio waves achieves that goal by using an antenna. This disclosure teaches an antenna that can be mounted on an edge of a circuit board. This disclosure teaches antenna shapes that, when mounted on an edge of a circuit board, can advantageously make contact with circuits on both sides of the board. Some antenna shapes have protruding portions with springiness that facilitates affixing the antenna to the board and facilitates reliable electrical contacts with the circuits. The disclosure also teaches methods for mounting an antenna on an edge of a circuit board.

Abstract translation: 需要发送或接收无线电波的电子电路通过使用天线来实现该目的。 本公开教导了可以安装在电路板的边缘上的天线。 本公开教导了当安装在电路板的边缘上时可以有利地与电路两侧的电路接触的天线形状。 一些天线形状具有弹性的突出部分，其有利于将天线固定到板上并且促进与电路的可靠的电接触。 本公开还教导了将天线安装在电路板的边缘上的方法。

公开(公告)号：US08651877B2

公开(公告)日：2014-02-18

申请号：US13588585

申请日：2012-08-17

Applicant: Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

IPC: H01R12/00

CPC classification number: H01L24/14 ,  H01L21/486 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/81101 ,  H01L2224/81208 ,  H01L2224/81899 ,  H01L2225/06513 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01R13/02 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/064 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in minor image relationship to each other.

Abstract translation: 一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。 将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。 用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。 具有第一和第二部分的螺旋形接触件彼此具有小的图像关系。

公开(公告)号：US08350567B2

公开(公告)日：2013-01-08

申请号：US12649425

申请日：2009-12-30

Applicant: Klaus Huber ,  Stefan Pott

Inventor： Klaus Huber ,  Stefan Pott

IPC: G01V3/00

CPC classification number: H05K1/141 ,  G01R33/34007 ,  G01R33/36 ,  H01F17/02 ,  H01F21/04 ,  H01F27/292 ,  H01F41/045 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/10265 ,  H05K2203/162 ,  H05K2203/171 ,  Y10T29/4902

Abstract: In a device and method to install a coil in a circuit, the coil is installed on a substrate and the inductance value of the coil installed on the substrate is adjusted with a test circuit board. The substrate is then installed in the circuit. This enables an efficient installation of the coil.

Abstract translation: 在将线圈安装在电路中的装置和方法中，将线圈安装在基板上，并且用测试电路板调整安装在基板上的线圈的电感值。 然后将衬底安装在电路中。 这使得能够有效地安装线圈。