公开(公告)号：US11979989B2

公开(公告)日：2024-05-07

申请号：US18229181

申请日：2023-08-02

Applicant: Molex, LLC

Inventor： Yong Lin ,  Shang Xiu Zeng ,  Kian Heng Lim

IPC: H05K1/18 ,  H01M50/507 ,  H01M50/51 ,  H01M50/519 ,  H05K1/02

CPC classification number: H05K1/189 ,  H01M50/507 ,  H01M50/51 ,  H01M50/519 ,  H05K1/028 ,  H05K2201/09063 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10272

Abstract: The present disclosure relates to a battery connection module and a battery device. The battery connection module includes a carrying tray, a plurality of busbars and a flexible circuit board. The plurality of busbars are provided to the carrying tray. The flexible circuit board is provided to the carrying tray and includes a main board body and a plurality of connecting board bodies integrally connected to the main board body in a floatable manner and respectively electrically connected to the plurality of busbars, each connecting board body is provided to a side edge of the main board body, extends in a longitudinal direction and faces the corresponding busbar in a transverse direction, each connecting board body has a central portion and two cantilevered portions respectively extending from two opposite sides of the central portion in the longitudinal direction, each cantilevered portion has a proximal segment connected to the central portion, a distal segment opposite to the proximal segment and a curved segment positioned between the proximal segment and the distal segment, the curved segment extends along at least the longitudinal direction and the transverse direction, each connecting board body is connected to the main board body only by the distal segments of the two cantilevered portions, a gap is formed between the connecting board body and the main board body.

公开(公告)号：US11949295B2

公开(公告)日：2024-04-02

申请号：US17236432

申请日：2021-04-21

Applicant: MILWAUKEE ELECTRIC TOOL CORPORATION

Inventor： Lucas A. Rutowski ,  Maxwell L Merget ,  Douglas R. Fieldbinder

IPC: H02K11/21 ,  H02K5/22 ,  H02K11/00 ,  H02K11/215 ,  H05K1/18

CPC classification number: H02K11/215 ,  H02K5/225 ,  H02K11/0094 ,  H05K1/181 ,  H05K2201/1009 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A power tool that includes a motor and a printed circuit board (“PCB”). The motor includes a rotor and a stator. The stator includes a plurality of stator terminals. The PCB is electrically connected to the stator. The PCB includes a switch and an embedded busbar. A first end of the embedded busbar is electrically connected to the switch. The embedded busbar extends away from the PCB. A second end of the embedded busbar electrically connects to a stator terminal of the plurality of stator terminals for providing power to the motor using the switch. The embedded bus bar is embedded between two layers of the printed circuit board.

公开(公告)号：US11723168B2

公开(公告)日：2023-08-08

申请号：US17838653

申请日：2022-06-13

Applicant: GM Global Technology Operations LLC

Inventor： Muhammad H. Alvi ,  Rashmi Prasad ,  Chandra S. Namuduri

IPC: H05K7/00 ,  H05K7/14

CPC classification number: H05K7/1429 ,  H05K7/1472 ,  H05K2201/10272

Abstract: A busbar assembly includes a base having a width and a length. The base has a first surface and a second surface and has a first side and a second side. A distance between the first side and the second side comprises the width, and the base defines a slot centered between approximately 75% and approximately 79% of the width.

公开(公告)号：US20230156929A1

公开(公告)日：2023-05-18

申请号：US17916372

申请日：2021-04-01

Applicant: SAFRAN VENTILATION SYSTEMS ,  ELVIA PRINTED CIRCUIT BOARDS

Inventor： Jacques VINCENT ,  Marc RAGONNEAU ,  Pascal ROLLIN ,  Bertrand DUFFAUD ,  Oliver BELNOUE

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4691 ,  H05K1/0265 ,  H05K2201/10272

Abstract: The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4).

公开(公告)号：US20190215961A1

公开(公告)日：2019-07-11

申请号：US16325403

申请日：2017-08-15

Applicant: GE Aviation Systems Limited

Inventor： Alexander James Rainbow

IPC: H05K1/14 ,  H05K1/02 ,  H01R12/52 ,  H01R12/73

CPC classification number: H05K1/144 ,  H01R12/523 ,  H01R12/73 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/048 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A power distribution assembly includes a printed circuit board (PCB) having a power input and electrical components connected to PCB conductive trace. A power bus extends from the PCB and has a conductive core, a dielectric layer on an exterior surface of the conductive core, a conductive trace on the dielectric layer, and a power cut through the dielectric layer to the conductive core. The conductive core is connected to the power input by way of the power cut through and the at least one second conductive trace is connected to the PCB conductive trace.

公开(公告)号：US20190208659A1

公开(公告)日：2019-07-04

申请号：US15922202

申请日：2018-03-15

Applicant: Deere & Company

Inventor： Brij N. Singh ,  Thomas J. Roan ,  Michael J. Zurn ,  Brad G. Palmer ,  Robert K. Kinyanjui ,  Jeff K. Hansen

IPC: H05K7/14 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H02M7/00 ,  H05K1/02

CPC classification number: H05K7/1422 ,  H02M7/003 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0265 ,  H05K1/0272 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/111 ,  H05K1/144 ,  H05K1/181 ,  H05K3/4697 ,  H05K7/20927 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2203/167

Abstract: An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.

公开(公告)号：US20180261930A1

公开(公告)日：2018-09-13

申请号：US15907107

申请日：2018-02-27

Applicant: Yazaki Corporation ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Hayato Iizuka ,  Satoshi Nakai ,  Kazuma Kayo ,  Hiroshi Aihara

IPC: H01R4/04 ,  H05K3/32 ,  H01B1/22

CPC classification number: H01R4/04 ,  H01B1/22 ,  H01R11/09 ,  H01R13/03 ,  H01R13/405 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/10272

Abstract: A conductor unit includes: a plurality of conductors each including a conducting portion covered with an insulating coating; an annular core that includes a first core constituent portion and a second core constituent portion combined with the first core constituent portion, and that interposes the conductors between the first core constituent portion and the second core constituent portion; and a holding member that makes the first core constituent portion and the second core constituent portion press and hold the conductors therebetween.

公开(公告)号：US20180184544A1

公开(公告)日：2018-06-28

申请号：US15724349

申请日：2017-10-04

Applicant: Eaton Corporation

Inventor： James Gerard Maloney ,  James Lee Gehlbach

IPC: H05K7/20 ,  H02B1/21 ,  H02B1/06 ,  H02G3/14 ,  F28F21/08 ,  H02B1/056 ,  F28F21/04

CPC classification number: H05K7/2039 ,  F28F21/04 ,  F28F21/084 ,  F28F21/085 ,  H02B1/056 ,  H02B1/06 ,  H02B1/21 ,  H02B1/56 ,  H02G3/14 ,  H05K2201/10272

Abstract: Thermally conductive assemblies that provide a heat conduction path include at least one thermally conductive wedge block that can be held in a receptacle with a wall having sufficient flexibility to be able to expand outward in response to an outward force applied by the at least one thermally conductive wedge block. The wedge block can also be electrically resistive.

公开(公告)号：US20180151820A1

公开(公告)日：2018-05-31

申请号：US15578153

申请日：2016-07-20

Applicant: KANEKA CORPORATION

Inventor： Hidemaro Saiki

IPC: H01L51/50 ,  F21V23/00 ,  F21K9/278 ,  F21K9/238 ,  H05K1/18 ,  H05B33/06

CPC classification number: H01L51/5012 ,  F21K9/238 ,  F21K9/278 ,  F21S2/00 ,  F21V23/00 ,  H01L51/5008 ,  H01L51/5203 ,  H05B33/06 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/189 ,  H05K2201/049 ,  H05K2201/10106 ,  H05K2201/10272

Abstract: Provided is a planar light emitting device which is highly productive employing inexpensive FPCs capable of being easily electrically connected, and which has a light emitting region with reduced unevenness in luminance and hence is highly reliable. The planar light emitting device, which has a light emitting surface and a back surface, includes a planar light emitting tile including a planar light emitting element and a plurality of flexible printed circuits (FPCs) disposed on the back surface. The planar light emitting tile includes a non-pad region where none of an anode pad and a cathode pad are disposed. In an overlapped region where part of two circuit boards overlap each other, an electrical connection site where an equipotential region of the two circuit boards are directly electrically connected to each other is formed. The non-pad region forms a connecting-part disposed region that overlaps with the electrical connection site.

公开(公告)号：US09967991B2

公开(公告)日：2018-05-08

申请号：US15288137

申请日：2016-10-07

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Hiroaki Ichikawa

IPC: H05K7/02 ,  H01L25/07 ,  H01L25/18 ,  H05K7/06 ,  H01L23/50 ,  H01L23/538 ,  H02B1/20 ,  H01L25/11 ,  H02M7/00

CPC classification number: H05K7/026 ,  H01L23/49844 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/5384 ,  H01L25/07 ,  H01L25/115 ,  H01L25/18 ,  H01L2924/0002 ,  H02B1/205 ,  H02M7/003 ,  H05K7/06 ,  H05K2201/10272 ,  H01L2924/00

Abstract: A semiconductor device, including a plurality of semiconductor modules, each including a semiconductor element, a main terminal and a wiring portion that connects the semiconductor element and the main terminal, and at least one busbar that each includes a terminal portion, and a plurality of attachment portions, the attachment portions being respectively connected to the main terminals of the semiconductor modules, such that the at least one busbar connects the semiconductor modules in parallel. The largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 10% or less of a resistance of the wiring portion in each semiconductor module. The largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 10% or less of an inductance of the wiring portion in each semiconductor module.