公开(公告)号：US20150237738A1

公开(公告)日：2015-08-20

申请号：US14429070

申请日：2013-08-30

Applicant: JUMATECH GMBH

Inventor： Markus Wölfel

IPC: H05K3/10 ,  H05K1/09

CPC classification number: H05K3/10 ,  H05K1/09 ,  H05K3/103 ,  H05K3/385 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/1028 ,  H05K2201/10287 ,  Y10T29/302

Abstract: A method for producing a circuit board element, and a corresponding circuit board element, with which it is possible to suppress the risk of delamination in the region of a component (e.g. a wire or a plate-like shaped part) that is embedded in the circuit board element. To this end, the present invention suggests that the surface of the component should be roughened, at least partially, in order to ensure a better adhesive bond with the surrounding cover layer (e.g. a prepreg made of an insulating material compound). The component surface can be roughened by chemical methods such as etching or by purely mechanical methods such as sand blasting.

Abstract translation: 一种用于制造电路板元件的方法和相应的电路板元件，通过该方法可以抑制嵌入在该电路板元件中的部件（例如线或板状成形部）的区域中的分层的风险 电路板元件。 为此，本发明提出，至少部分地，组件的表面应该被粗糙化，以确保与周围的覆盖层（例如，由绝缘材料化合物制成的预浸料）的更好的粘合剂粘结。 组分表面可以通过诸如蚀刻的化学方法或通过纯机械方法如喷砂来粗糙化。

公开(公告)号：US20150022980A1

公开(公告)日：2015-01-22

申请号：US14370516

申请日：2013-01-04

Applicant: Access Business Group International LLC

Inventor： Joseph C. Van Den Brink ,  Sean T. Eurich ,  Neil W. Kuyvenhoven ,  Kaitlyn J. Turner ,  Benjamin C. Moes ,  Hai D. Nguyen

IPC: H05K7/02 ,  H05K13/00 ,  H05K1/16 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K7/02 ,  H01F27/2804 ,  H01F38/14 ,  H05K1/028 ,  H05K1/092 ,  H05K1/111 ,  H05K1/165 ,  H05K3/361 ,  H05K13/00 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/1028 ,  H05K2201/10386 ,  H05K2201/10401 ,  Y10T29/49117

Abstract: An item of print media (30) including an inductive secondary (50) for providing power to a load (32). The inductive secondary is responsive to an electromagnetic flux to generate a time-varying current or voltage therein. The current or voltage induced in the inductive secondary directly or indirectly powers the load to thereby enhance the functionality and/or the appeal of the item of print media without significantly adding to its cost. The load can provide a visual and/or auditory output, and can include an electroluminescent display, an e-ink display, a piezo speaker coil, an electrostatic speaker, an OLED, an LED or an LCD display. Embodiments of the invention can be utilized in connection with a wide variety of print media, including for example books, booklets, pamphlets, labels, magazines, manuals, brochures, maps, charts, posters, journals, newspapers or loose leaf pages.

Abstract translation: 一种包括用于向负载（32）提供电力的感应次级（50）的打印介质（30）的项目。 电感次级电流响应于电磁通量以在其中产生时变电流或电压。 感应次级中引起的电流或电压直接或间接地为负载供电，从而增强打印介质的功能和/或吸引力，而不会显着增加其成本。 负载可以提供视觉和/或听觉输出，并且可以包括电致发光显示器，电子墨水显示器，压电扬声器线圈，静电扬声器，OLED，LED或LCD显示器。 本发明的实施例可以用于各种各样的打印介质，包括例如书籍，小册子，小册子，标签，杂志，手册​​，小册子，地图，图表，海报，期刊，报纸或散页页。

公开(公告)号：US08931166B2

公开(公告)日：2015-01-13

申请号：US13881987

申请日：2012-05-21

Applicant: Tom Marttila

Inventor： Tom Marttila

IPC: H05K3/00 ,  H05K3/46 ,  G06K19/077 ,  H01L23/498

CPC classification number: H05K3/46 ,  G06K19/07749 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/1028 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A manufacturing method of electrical bridges, wherein a conductive pattern (2) from electroconductive material, such as metal foil, is applied over a substrate (1) made of electrically insulating material and the electroconductive material has at least one strip tongue (3) unattached to the substrate, one side of the tongue is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).

Abstract translation: 电桥的制造方法，其中将导电材料（例如金属箔）的导电图案（2）施加在由电绝缘材料制成的基板（1）上，并且导电材料具有至少一个带状舌（3）未连接 在所述基板上，所述舌片的一侧与所述导电图案（2）连接，并且所述带状舌片（3）折叠在与所述导电图案（2）电绝缘的区域上，并且所述带状舌片（3）为 电连接到导电图案（2）的预定的另一部分（5）。

公开(公告)号：US20140264424A1

公开(公告)日：2014-09-18

申请号：US13948640

申请日：2013-07-23

Applicant: Grote Industries, LLC.

Inventor： Timothy Webster Brooks ,  Scott J. Jones ,  Martin J. Marx ,  Cesar Perez-Bolivar ,  James E. Roberts ,  George M. Richardson, II

IPC: H01L33/64

CPC classification number: H01L33/644 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/10977 ,  H01L2924/00

Abstract: A lighting element, comprising: a first substrate; a first and second conductive elements located on the first substrate; a light-emitting element having first and second contacts that are both on a first surface of the light-emitting element, the first contact being electrically connected to the first conductive element, the second contact being electrically connected to the second conductive element, and the light-emitting element emitting light from a second surface opposite the first surface; a top layer adjacent to the second surface; and an affixing layer located between the first substrate and the top layer, the affixing layer affixing the top layer to the first substrate; and a heat spreading layer having a third surface and a fourth surface opposite the third surface, the heat spreading layer being affixed beneath the first flexible substrate at the third surface, wherein the flexible top layer is substantially transparent to light.

Abstract translation: 1.一种照明元件，包括：第一基板; 位于所述第一基板上的第一和第二导电元件; 具有在所述发光元件的第一表面上的第一和第二触点的发光元件，所述第一触点电连接到所述第一导电元件，所述第二触点电连接到所述第二导电元件， 从与第一表面相对的第二表面发射光的发光元件; 与第二表面相邻的顶层; 以及位于所述第一基板和所述顶层之间的固定层，所述固定层将所述顶层固定到所述第一基板; 以及具有与所述第三表面相对的第三表面和第四表面的散热层，所述热扩散层在所述第三表面处固定在所述第一柔性基板下方，其中所述柔性顶层对于光基本上是透明的。

公开(公告)号：US20140232511A1

公开(公告)日：2014-08-21

申请号：US14236851

申请日：2012-08-03

Applicant: Rainer Durth ,  Thomas Meyer

Inventor： Rainer Durth ,  Thomas Meyer

IPC: H01H37/76

CPC classification number: H01H37/764 ,  H01H37/761 ,  H01T1/14 ,  H05K1/0201 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/1028 ,  H05K2203/047 ,  H05K2203/176

Abstract: Systems and methods are disclosed relating to a thermal overload protection apparatus and processes for protecting an electrical component. In one illustrative implementation, a thermal overload protection apparatus includes a switching element for short-circuiting connections of the component or for isolating an electrically conductive connection between at least one of the connections and a current-carrying element of the overload protection apparatus, an actuator for switching the switching element into a corresponding short-circuiting position or isolating position, and a tripping element that thermosensitively trips the actuator apparatus. and is formed as a separating element. According to further implementations, various other arrangements and methods for producing devices are disclosed.

Abstract translation: 公开了关于热过载保护装置和用于保护电气部件的方法的系统和方法。 在一个说明性实施例中，热过载保护装置包括用于使部件的连接短路或用于隔离至少一个连接件和过载保护装置的载流元件之间的导电连接的开关元件，致动器 用于将开关元件切换到相应的短路位置或隔离位置以及热敏地跳闸致动器装置的脱扣元件。 并形成为分离元件。 根据进一步的实施方式，公开了用于制造装置的各种其它布置和方法。

公开(公告)号：US08705246B2

公开(公告)日：2014-04-22

申请号：US13246903

申请日：2011-09-28

Applicant: Akitaka Kanamori ,  Takahiro Kadowaki

Inventor： Akitaka Kanamori ,  Takahiro Kadowaki

IPC: H05K1/18 ,  H05K7/00

CPC classification number: H05K1/18 ,  H01F27/292 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/1003 ,  H05K2201/1028 ,  H05K2203/0285

Abstract: An electronic part includes an electronic part body, an electrode terminal that protrudes from the electronic part body, and that electrically connects the electronic part to an external electrode when a flexible conductor is joined to an electrode surface, and a holder made of an insulating material, and joined to the electronic part body. The holder is interposed between a mounting plate and the electronic part body when the electronic part is mounted to the mounting plate, and the holder is in contact with a surface of the electrode terminal opposite from the electrode surface.

Abstract translation: 电子部件包括电子部件体，从电子部件体突出的电极端子，并且当柔性导体接合到电极表面时将电子部件电连接到外部电极，以及由绝缘材料制成的保持器 并加入电子零件体。 当电子部件安装到安装板上时，保持器插入在安装板和电子部件主体之间，并且保持器与电极端子的与电极表面相对的表面接触。

公开(公告)号：US20140021640A1

公开(公告)日：2014-01-23

申请号：US13937546

申请日：2013-07-09

Applicant: ABB Technology AG

Inventor： Gontran PÂQUES ,  Dominik Trüssel ,  Waldemar Groot ,  Stefan Ellenbroek ,  David Hajas

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/32 ,  H01L25/071 ,  H01L25/074 ,  H01L25/162 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H05K1/0254 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/09163 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2045 ,  H01L2924/00

Abstract: A method and arrangement are disclosed for electrically connecting a contact of a first substrate to a contact of a second substrate, whereby the first substrate is positioned relative the second substrate. The method includes providing the first substrate with its contact facing towards the second substrate, providing the second substrate with its contact facing away from the first substrate, bonding a bonding medium to the contact of the first substrate, bonding the bonding medium to the first substrate thereby forming a loop, electrically connecting the contact of the second substrate to the bonding medium, and providing the second substrate with the contact on a nose or tongue extending from an edge of the second substrate. The first substrate can be positioned below the second substrate, with a contact of the first substrate connected to a contact of the second substrate.

Abstract translation: 公开了一种用于将第一基板的触点电连接到第二基板的触点的方法和装置，由此第一基板相对于第二基板定位。 该方法包括提供其第一基底的接触面朝向第二基底，使第二基底的接触面远离第一基底，将接合介质粘合到第一基底的接触面上，将接合介质粘合到第一基底 从而形成环路，将第二基板的接触电连接到接合介质，以及将第二基板提供在从第二基板的边缘延伸的鼻或舌上的接触。 第一基板可以位于第二基板的下方，第一基板的接触连接到第二基板的接触。

公开(公告)号：US08572840B2

公开(公告)日：2013-11-05

申请号：US12895623

申请日：2010-09-30

Applicant: Michael A Christo ,  Julio A Maldonado ,  Roger D Weekly ,  Tingdong Zhou

Inventor： Michael A Christo ,  Julio A Maldonado ,  Roger D Weekly ,  Tingdong Zhou

IPC: H05K3/20

CPC classification number: H05K1/112 ,  H05K1/0263 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/1028 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

Abstract translation: 可以根据各种技术向电子模块供电。 在一般的实施方案中，例如，用于向电子模块供电的系统可以包括印刷电路板，电子模块和导电箔。 板可以包括在第一侧上的多个接触位置，其中至少一个接触位置电耦合到通孔到板的第二侧。 电子模块可以电耦合到板的第一侧上的接触位置，并且通过电耦合到通孔的至少一个接触位置接收电力。 箔可以适于传送用于电子模块的电力并且电耦合到电路板的第二侧上至少通过电气耦合到接收用于电子模块的电力的接触位置的通孔。

公开(公告)号：US20130118783A1

公开(公告)日：2013-05-16

申请号：US13429450

申请日：2012-03-26

Applicant: Chih Sheng Huang

Inventor： Chih Sheng Huang

IPC: H05K1/00

CPC classification number: H01R12/718 ,  H05K1/117 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/09854 ,  H05K2201/1028

Abstract: A circuit board includes a first pinout set of USB 2.0 standard provided on the circuit board; a second pinout set provided on the circuit board; and a flexible metal strip having a jut and four pinouts corresponding to StdA_SSRX−, StdA_SSRX+, StdA_SSTX−, and StdA_SSTX+ of USB 3.0 standard.

Abstract translation: 电路板包括电路板上提供的第一个USB 2.0标准引脚， 设置在电路板上的第二引脚排列; 以及具有对应于USB 3.0标准的StdA_SSRX-，StdA_SSRX +，StdA_SSTX-和StdA_SSTX +的突出和四个引脚的柔性金属条。

公开(公告)号：US08431830B2

公开(公告)日：2013-04-30

申请号：US12884701

申请日：2010-09-17

Applicant: Akira Tamura

Inventor： Akira Tamura

IPC: H05K1/03

CPC classification number: H05K3/32 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/1316 ,  H01L2224/14131 ,  H01L2224/81101 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H05K2201/0314 ,  H05K2201/09681 ,  H05K2201/09854 ,  H05K2201/1028 ,  H05K2201/10348 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/01024 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole.

Abstract translation: 用于连接半导体和电路板的插入件包括绝缘材料片，形成在绝缘材料片中的通孔和由弹性导电片形成并设置在通孔中的弹性导电接触。