Abstract:
Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.
Abstract:
A cathode ray tube has a thin flexible circuit (48) comprising one or more films of polyimide with a plurality of conductive tracks deposited directly thereon for establishing electrical connection between a multi-pin lead through (45) passing through the wall of the tube's envelope (31) and terminals of electrically operable components within the envelope, e.g. electron gun (35) and beam-deflection electrodes (36,39 and 40). A number of track-carrying films may be stacked together to form a laminate structure. Such a flexible circuit avoids outgassing problems and, being thin and flexible, occupies minimal space and is easily routed around internal components to ease assembly.
Abstract:
A portable machine is disclosed for setting eyelets and the like in printed circuit boards and includes an upper tool connected to a mandrel mounted in a frame and movable into and out of engagement with a lower tool by a toggle means. The lower tool is resiliently mounted in the frame beneath the upper tool and has a support structure beneath it which includes a slidable pressure control means for predetermining the maximum setting pressure applied to a workpiece by the upper and lower tools.
Abstract:
A method of manufacturing an electrical circuit wiring assembly comprises the steps of preparing a first sub-assembly having a metal board chassis and a first circuit element provided with hard stiff leads, preparing a second sub-assembly having a second circuit element provided with soft thin leads and an eyelet terminal for connecting the soft thin lead to the hard lead by means of a soldered junction, and assembling the first and second sub-assemblies by a soldering operating to form a main wiring assembly. In the second sub-assembly the second circuit element and the eyelet terminal are carried temporarily on an unsolderable mounting tool. The first and second sub-assemblies are temporarily coupled to each other during the forming of the main assembly by means of a coupling tool or jig for applying molten solder to an exposed connecting portion of the eyelet terminal and to portions of the hard and soft leads extending from the eyelet terminal. After soldering, the unsolderable mounting tool and the coupling tool are removed from the soldered main wiring assembly so that a three-dimensional wiring assembly is obtained.
Abstract:
A method of manufacturing an electrical circuit wiring assembly comprises the steps of preparing a first sub-assembly having a metal board chassis and a first circuit element provided with hard stiff leads, preparing a second sub-assembly having a second circuit element provided with soft thin leads and an eyelet terminal for connecting the soft thin lead to the hard lead by means of a soldered junction, and assembling the first and second sub-assemblies by a soldering operation to form a main wiring assembly. In the second sub-assembly the second circuit element and the eyelet terminal are carried temporarily on an unsolderable mounting tool. The first and second sub-assemblies are temporarily coupled to each other during the forming of the main assembly by means of a coupling tool or jig for applying molten solder to an exposed connecting portion of the eyelet terminal and to portions of the hard and soft leads extending from the eyelet terminal. After soldering, the unsolderable mounting tool and the coupling tool are removed from the soldered main wiring assembly so that a three-dimensional wiring assembly is obtained.