公开(公告)号：US20080089037A1

公开(公告)日：2008-04-17

申请号：US11864065

申请日：2007-09-28

Applicant: Fumikazu NAIMI ,  Masami Takase ,  Akihisa Watanabe

Inventor： Fumikazu NAIMI ,  Masami Takase ,  Akihisa Watanabe

IPC: H05K7/00 ,  H05K7/02

CPC classification number: H05K7/026 ,  H05K1/056 ,  H05K1/144 ,  H05K3/0064 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10598 ,  H05K2201/2036

Abstract: [Problems to be Solved]The present invention provides a metal-core-board reinforcing structure which can simultaneously satisfy various requirements such as miniaturization, weight reduction, space-saving, heat radiation and provision of mechanically reinforced metal core board. [Means to Solve the Problems]The metal-core-board reinforcing structure according to the present invention has a metal core board 1 having a metal core and a resin plate 2 having substantially the same extent as that of the metal core board 1 and being fixedly attached to the metal core board 1 substantially parallel to one side of the metal core board 1 and spaced apart therefrom by a predetermined distance.

Abstract translation: [待解决的问题]本发明提供一种能够同时满足小型化，轻量化，节省空间，散热，提供机械强化金属芯板等各种要求的金属芯板加强结构体。 解决问题的手段根据本发明的金属芯板加强结构具有金属芯板1，金属芯板1具有与金属芯板1大致相同程度的金属芯和树脂板2，并且 固定地附接到金属芯板1，其基本上平行于金属芯板1的一侧并与之隔开预定距离。

公开(公告)号：US07345887B2

公开(公告)日：2008-03-18

申请号：US11116428

申请日：2005-04-28

Applicant: Kazuya Sudo ,  Takayuki Murakami

Inventor： Kazuya Sudo ,  Takayuki Murakami

IPC: H05K1/00

CPC classification number: G11B7/22 ,  H01R12/7076 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/055 ,  H05K2201/10121 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: A flexible printed board mounting structure includes a main body that has an attachment portion on its rear side surface, and a flexible printed board that is attached to the rear side surface and the attachment portion of the main body. The surface of the attachment portion is substantially perpendicular to the rear side surface. The flexible printed board includes a first area that is at least partially attached to the rear side surface of the main body, an attachment area to which a light-receiving IC is attached, the attachment area being attached to the attachment portion of the main body, and a connecting portion that is unitarily formed with the first area and the attachment area and connects the first area and the attachment area in a deflective manner. The position of the light-receiving IC can be easily adjusted relative to the attachment portion of the main body.

Abstract translation: 柔性印刷电路板安装结构包括在其后侧表面上具有附接部分的主体和附接到主体的后侧表面和安装部分的柔性印刷电路板。 附接部分的表面基本上垂直于后侧表面。 柔性印刷电路板包括至少部分地附接到主体的后侧表面的第一区域，附接有光接收IC的附接区域，附接区域附接到主体的附接部分 以及与第一区域和安装区域整体形成并且以偏转方式连接第一区域和附接区域的连接部分。 光接收IC的位置可以相对于主体的安装部分容易地调节。

公开(公告)号：US20080057743A1

公开(公告)日：2008-03-06

申请号：US11878895

申请日：2007-07-27

Applicant: Eri Sogabe

Inventor： Eri Sogabe

IPC: H01R12/00

CPC classification number: H01R43/0235 ,  H01R12/523 ,  H01R13/658 ,  H05K3/3442 ,  H05K3/363 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/10598 ,  H05K2201/10666 ,  Y10T29/49016

Abstract: A printed circuit board connection structure allowing facilitated connection of a plurality of printed circuit boards and cost reduction, a high-frequency unit, a method of connecting printed circuit boards, and a method of manufacturing a high-frequency unit are provided. A printed circuit board connection structure includes a plurality of printed circuit boards, having a connection portion pattern, formed on a surface, and at least one printed circuit board out of the plurality of printed circuit boards, is arranged with respect to another printed circuit board such that the connection portion patterns, are opposed to each other. In addition, the opposing connection portion patterns, are connected to each other by means of a reflow-hardened solder.

Abstract translation: 提供了一种允许多个印刷电路板的便于连接和降低成本的印刷电路板连接结构，高频单元，连接印刷电路板的方法以及制造高频单元的方法。 印刷电路板连接结构包括多个印刷电路板，其具有形成在表面上的连接部分图案和多个印刷电路板中的至少一个印刷电路板，相对于另一个印刷电路板 使得连接部分图案彼此相对。 此外，相对的连接部分图案通过回流硬化的焊料彼此连接。

公开(公告)号：US20070278647A1

公开(公告)日：2007-12-06

申请号：US11838431

申请日：2007-08-14

Applicant: Yoshihiro MORITA

Inventor： Yoshihiro MORITA

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L23/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/0061 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/10598 ,  H05K2201/10734 ,  H05K2201/2009

Abstract: A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

Abstract translation: 一种封装板模块，其中诸如LSI的半导体芯片安装在封装板的顶侧表面上，以及封装安装模块，其中封装板安装在大型计算机等的主板上。 用于支撑包装板的加强件和/或用于支撑母板的加强件各自具有双金属结构，其中具有相互不同的热膨胀系数的第一构件和第二构件分别彼此粘合，以便使加强件翘曲 与由温度变化引起的封装板和母板的翘曲一致，从而防止在焊接部分中产生应力。

公开(公告)号：US20070207644A1

公开(公告)日：2007-09-06

申请号：US11706851

申请日：2007-02-15

Applicant: Robert Pollmann ,  Harald Weber ,  Walter Wimmer

Inventor： Robert Pollmann ,  Harald Weber ,  Walter Wimmer

IPC: H01R13/44

CPC classification number: H05K3/103 ,  B29C45/14639 ,  B29K2995/0005 ,  H05K3/107 ,  H05K7/06 ,  H05K2201/10287 ,  H05K2201/10598

Abstract: For a conductor structure component with plastics material injection-molded therearound, a fixing member for electric conductors is inserted, which fixing member is formed by a prefabricated carrier body comprising receptacles for the retention of individual wires as said electric conductors.

Abstract translation: 对于具有注塑成型的塑料材料的导体结构部件，插入用于电导体的固定构件，该固定构件由预制的载体主体形成，该载体主体包括用于保持作为所述电导体的各个导线的插座。

公开(公告)号：US07234217B2

公开(公告)日：2007-06-26

申请号：US11038050

申请日：2005-01-21

Applicant: Bong Kyu Choi ,  Chun Ho Choi

Inventor： Bong Kyu Choi ,  Chun Ho Choi

IPC: B23P19/04

CPC classification number: B01F11/0074 ,  B01F5/10 ,  B01F11/0071 ,  B01F13/00 ,  B01F2215/0037 ,  G01N35/10 ,  G01N2035/106 ,  H01L21/485 ,  H01L21/67144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/10598 ,  H05K2203/0165 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/4973 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53196

Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2′ is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2′, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2′ is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

Abstract translation: 公开了一种用于连接PCB片的方法和装置。 如果在制造连续布置的电路图案后发现有缺陷的PCB，则去除有缺陷的PCB片部分以用新的PCB片部分替换它。 也就是说，从第一PCB片4a的连续布置的电路图案中去除了有缺陷的电路图案片2'。 在去除有缺陷的电路图案片2'之后，第一PCB片材4a通过位置定位装置12定位。 然后，通过去除缺陷电路图案片2'形成的空间填充有印刷良好质量电路图案2b的第二PCB片4b。 然后，第一PCB片材4a和第二PCB片材4b通过使用粘合剂装置14连接在一起。

公开(公告)号：US20070127218A1

公开(公告)日：2007-06-07

申请号：US11607922

申请日：2006-12-04

Applicant: Masashi Yamasaki ,  Mutsumi Yoshino

Inventor： Masashi Yamasaki ,  Mutsumi Yoshino

IPC: H05K5/00

CPC classification number: H05K7/142 ,  H05K3/202 ,  H05K3/341 ,  H05K2201/091 ,  H05K2201/10598 ,  H05K2203/175 ,  Y10T29/49144

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract translation: 电子设备包括在同一平面上放置在一起以提供布线电路的金属布线板，通过焊料安装到布线板的电子设备，具有从基部延伸的基部和柱状部分的壳体。 布线板固定在柱状部分上，使得布线电路与基部间隔开。 布线板具有足够的厚度以抵抗用于操作电子设备的大电流并且释放由电子设备产生的热量。 布线电路与壳体的基部间隔开，使得由电子设备产生的热量有效地释放在空间中。 电子器件在热回流工艺中立即焊接到布线板上。

公开(公告)号：US20070121304A1

公开(公告)日：2007-05-31

申请号：US11604336

申请日：2006-11-27

Applicant: Naofumi Okayama ,  Yoshiyuki Miyajima ,  Kiyozumi Gotou

Inventor： Naofumi Okayama ,  Yoshiyuki Miyajima ,  Kiyozumi Gotou

IPC: H05K7/00

CPC classification number: H05K7/02 ,  H01R12/7023 ,  H01R12/7058 ,  H05K1/119 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10598 ,  H05K2201/10863 ,  H05K2201/2027

Abstract: The invention provides a printed circuit board capable of preventing an electronic component from tilting or uplifting without adopting special structures in an existing electronic component. The printed circuit board has an engagement portion and terminal holes and for mounting an electronic component, comprising narrowed portions and having substantially the same width as the mounting leg portions and connecting terminals of the electronic component, and guidance portions having a width wider than the narrowed portion, wherein the mounting leg portions and connecting terminals are inserted to the guidance portion, and the electronic component is moved via sliding motion, by which the mounting leg portions and the connecting terminals are supported tightly in the narrowed portion. Thus, it becomes possible to prevent the displacement or tilt of the electronic component.

Abstract translation: 本发明提供一种印刷电路板，其能够防止电子部件在现有电子部件中不采用特殊结构而倾斜或抬起。 印刷电路板具有接合部分和端子孔，并且用于安装电子部件，包括狭窄部分，并且具有与电子部件的安装腿部和连接端子基本相同的宽度，以及宽度比狭窄宽度的引导部分 其中安装脚部分和连接端子被插入到引导部分中，并且电子部件通过滑动运动移动，安装脚部分和连接端子紧紧地被支撑在狭窄部分中。 因此，可以防止电子部件的位移或倾斜。

公开(公告)号：US20070120219A1

公开(公告)日：2007-05-31

申请号：US11563311

申请日：2006-11-27

Applicant: Eiichi ITO ,  Koji TSUDA ,  Tadashi MINAKUCHI ,  Mitsuhiro MATSUMOTO

Inventor： Eiichi ITO ,  Koji TSUDA ,  Tadashi MINAKUCHI ,  Mitsuhiro MATSUMOTO

IPC: H01L29/00

CPC classification number: H05K3/103 ,  H05K1/0287 ,  H05K2201/0715 ,  H05K2201/09263 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10598

Abstract: There is provided a method of manufacturing a conductive layer of in a signal transmission substrate. The method includes sewing conductive thread in sheet-like material having an insulating property so as to form one of a plurality of low resistance regions using the conductive thread in a high resistance region formed by the sheet-like material, moving the conductive thread from an end point of a previously sewed low resistance region to a start point of a low resistance region to be sewed subsequently, repeating the sewing and moving steps to form the plurality of low resistance regions in the high resistance region, and forming a plurality of holes in the conductive layer by press working so that an electrical component attached to at least one of the plurality of holes is able to transmit a signal between neighboring ones of the plurality of low resistance regions.

Abstract translation: 提供了一种在信号传输基板中制造导电层的方法。 该方法包括将具有绝缘性的片状材料中的导电线缝合，以便在由片状材料形成的高电阻区域中使用导电线形成多个低电阻区域中的一个，将导电线从 先前缝合的低电阻区域的终点到随后要缝制的低电阻区域的起始点，重复缝合和移动步骤以在高电阻区域中形成多个低电阻区域，并且形成多个孔 所述导电层通过冲压加工使得附接到所述多个孔中的至少一个孔的电气部件能够在所述多个低电阻区域中的相邻电阻区域之间传输信号。

公开(公告)号：US20070013824A1

公开(公告)日：2007-01-18

申请号：US11275291

申请日：2005-12-21

Applicant: Chuan-Pei Yu ,  Chung-Liang Hsiao

Inventor： Chuan-Pei Yu ,  Chung-Liang Hsiao

IPC: G02F1/1333 ,  G02F1/1345

CPC classification number: G02F1/133308 ,  G02F1/13452 ,  G02F2201/46 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/10598

Abstract: A method for fixing a flexible circuit board (FPC) of a display module includes providing a housing having at least a fixing pin, providing a display panel and an FPC having at least a fixing hole corresponding to the fixing pin, disposing the display panel and the FPC on the housing and folding back the FPC on another side of the housing such that the fixing pin passes through the fixing hole, and performing a hot mounting process to the fixing pin to enlarge the top end of the fixing pin to press the FPC onto the housing.

Abstract translation: 一种用于固定显示模块的柔性电路板（FPC）的方法包括提供至少具有固定销的壳体，提供显示面板和至少具有与固定销相对应的固定孔的FPC，将显示面板和 FPC上的FPC并将FPC折叠在壳体的另一侧，使得固定销穿过固定孔，并且对固定销执行热安装处理以扩大固定销的顶端以压紧FPC 到房子上