Abstract:
The present invention includes a method and apparatus for attenuating flexible circuit resonance. The apparatus includes a flexible circuit assembly. The flexible circuit assembly has a flexible circuit having a flexible cable with first and second sides. The flexible circuit assembly also includes a circuit support. The circuit support includes a base having top and bottom surfaces. The bottom surface is attached to the first side of the flexible cable. The circuit support also includes a support wall extending substantially perpendicularly relative to the top surface of the base. The support wall has a first face, which is substantially oriented towards the top surface of the base. The first side of the flexible cable is attached to the first face and also faces a second face of the support wall to thereby reverse a direction in which the flexible cable faces.
Abstract:
According to the present invention, there is provided a holder having a pressure flange not to be easily disengaged from a small-sized electronic part in pressing and accommodating the holder having the small-sized electronic part in a mounting recess. A holder includes a projecting portion protruding from a pressing flange toward a cylinder axis of a holding portion, formed in a portion having a predetermined length of an inner edge of the pressing flange. With this construction, when the holder accommodating a small-sized electronic part is mounted to a casing of an apparatus, even if the pressing flange is rolled up and about to be disengaged from the small-sized electronic part, the projecting portion engages with the small-sized electronic part, thereby preventing the pressing flange from being rolled up.
Abstract:
A low profile structure is disclosed. The structure includes a printed circuit board (PCB), a bracket, three connectors and an extending module, wherein the bracket is connected to the PCB to form the body of the low profile structure. In addition, one of the connectors is an extending connector and the other two connectors are configured on the bracket and are directly connected with PCB. The extending module further includes an extending PCB so that the extending PCB is electrically connected to the extending connector and the extending PCB is electrically connected to PCB. Therefore, the extending connector can be electrically connected to PCB via the extending PCB.
Abstract:
An object is to provide an electronic equipment satisfying both compactness and resistance to a shock and a shake in spite of being equipped with a memory device such as an HDD or the like vulnerable to a shock. The electronic equipment 100 includes a memory device 13 that stores data and is vulnerable to a shock, and a circuit board 1 that has a control circuit for controlling the electronic equipment 100 and an opening portion 9. The memory device 13 is held at the opening portion 9 through a holding member 11.
Abstract:
An auxiliary device is used for assisting electrical connection between pins of an electronic component and corresponding contact portions of a printed circuit board. The auxiliary device includes a main body and a plurality of connection parts. The main body has a plurality of perforations for the pins to penetrate therethrough. The connection parts are coupled to the main body and penetrate through corresponding retaining holes of the printed circuit board such that the main body is fixed on the printed circuit board. The pins of the electronic component penetrate through corresponding perforations of the main body and are in contact with corresponding contact portions of the printed circuit board.
Abstract:
To provide a highly stable crystal oscillator having increased thermal efficiency. The highly stable crystal oscillator comprises; a thermostat mainframe which maintains the temperature of a crystal resonator including a resonator container for sealing a crystal piece constant, an oscillating element which constitutes an oscillation circuit together with said crystal resonator, a temperature control element which controls the temperature inside of said thermostat mainframe, and a circuit board mounted with said thermostat mainframe, said oscillating element, and said temperature control element. The construction is such that a heat generating chip resistor and a highly heat sensitive element having a higher temperature dependency, among said oscillating element and said temperature control element, are arranged on one principal plane of said circuit board, and said heat generating chip resistor, said highly heat sensitive element, and said thermostat mainframe are directly heat bonded by a thermo-conductive material.
Abstract:
A management system for wiring and/or cabling is disclosed. The wire management system comprises a mounting stud and an integral cable guide assembly. The cable guide assembly may include a base portion and an upper portion with at least two guide members that may be removably mounted to the mounting stud. The at least two guide members of the cable guide assembly orientates the wiring and/or cabling in a generally vertical direction with respect to a heat emitting device so as to minimize the surface area of the wiring and/or cabling that is exposed to a heat emitting device, thereby minimizing heat buildup within an enclosure. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Abstract:
An opto-electric apparatus includes a circuit board, an opto-electric converter module with a plurality of electrical leads, a holder rigidly holding the opto-electric converter module, and a connection structure. The holder is rigidly fixed to the circuit board, and the connection structure is rigidly connected to the holder. The leads of the module protrude into holes in the structure. The structure electrically connects the circuit board to the leads.
Abstract:
A method is provided for attaching components to a substrate to form an edge connector thereon. In particular, the invention is useful for attaching an edge connector to a printed circuit board. The connector components are provided in a form that can be mounted on one side of a substrate, such as in a pick-and-place operation. The connector components may include pins for male connectors or sockets for female connectors. The pins or sockets of the connector are removably coupled to a carrier, forming a carrier assembly. The carrier assembly is configured to operably engage a carrier support that is integrally formed with the printed circuit board substrate. After the connector components are fastened, as by soldering, to the printed circuit board, the carrier and carrier support can be removed to leave the connector attached to the printed circuit board. A shroud may be installed over the connector pins to provide a shrouded connector.
Abstract:
An electric lamp having a cap (10) of synthetic resin is suitable for use on a printed circuit board (6). The cap (10) has resilient arms (15) extending parallel to a plane (8) through the axis (2) of the lamp vessel (1). The holder portion (11) of the cap (10) holding the lamp vessel (1), and the arms (15) can clamp a p.c.b. (6) in between them. Means (19, 21) may be present to keep the lamp fixed in an opening (9) in the p.c.b. (6) or at an edge thereof. The lamp requires little space on a p.c.b.