Abstract:
An apparatus for investigating and/or modifying a sample with charged particles, in particular a scanning electron microscope, is provided. The apparatus comprises a beam (1, 2) of charged particles, a shielding element (10) having an opening (30) for the beam of charged particles to pass through, wherein the opening (30) is sufficiently small and the shielding element (10) sufficiently closely positioned to the surface (20) of the sample to reduce the influence of charge accumulation effects at the surface on the beam of charged particles.
Abstract:
A means of neutralizing the excess charge on workpieces, such as semiconductor wafers, that results from ion-implantation processes, wherein the excess positive charge on a small area of the workpiece surface is locally sensed, and in response, an appropriate dose of charge-compensating electrons is delivered from an electron emission source to the area of excess charge on the workpiece. A charge-sensing probe and a voltage-controlled electron generator array are configurationally and operatively coupled in a closed feedback loop, and are made to scan the surface of the workpiece, in close but non-contacting proximity to the workpiece. Arrays of charge-sensing probes and electron generator arrays can be configured for rapid coverage of the implanted areas of the workpiece. The present invention has significant advantages over other methods, such as plasma and electron showers and plasma flood systems, for neutralizing the excess charge due to ion implantation.
Abstract:
An imaging and raster-mode scanning apparatus has a compensation device for compensating for ambient influences that may degrade the imaging, comprising an electrical filter, and at least one sensor for providing a first signal dependent on the ambient influences the first signal passes through the filter directly and drives an internal actuator and a internal control elements of the apparatus, which has an effect on the imaging and on the image display, in a calibrated state of the apparatus, which comprises a setting of a transfer characteristic of the filter, image degradations are greatly reduced or essentially compensated for. The filter for calibrating the apparatus, has a calibration input and a second signal is applied to the calibration input of the filter.
Abstract:
An ion implantation apparatus comprises an ion source section (18) for generating ions; an ion implantation section (14) for implanting the ions generated in the ion source section (18), in a substrate (92); a charged particle generator (62) for generating charged particles having a charge opposite to that of the ions; a beam guide section (24) having an inlet aperture (24a) for accepting the ions from the ion source section (18), an outlet aperture (24b) for delivering the ions into the ion implantation section (18), a guide tube (24c) extending from the inlet aperture (24a) to the outlet aperture (24b), and an introducing section (80) having an opening (82) thereof in an internal surface (24d) of the guide tube (24c), for introducing the charged particles from the charged particle generator (62) into the guide tube (24c); and a shield section (84) located between the opening (82) of the introducing section (80) and the outlet aperture (24b) inside the guide tube (24c). A shield surface (84a) of the shield section (84) blocks the charged particles' reaching the wafer.
Abstract:
A vibration damping apparatus includes a plurality of actuators for removing vibration of a table as an object of vibration damping, a detection device for detecting a vibration status of the table, an acquisition device for acquiring compensation amounts for a plurality of directional elements, from the vibration status detected by the detection device, and an allocation device for allocating an actuator-driving force corresponding to a compensation amount for a predetermined directional element, among the compensation amounts acquired by the acquisition device, to an actuator having a small amount of driving force, allocated based on a compensation amount for another directional element.
Abstract:
An ion implanting apparatus is capable of preventing occurrence of discharge flaws on a reverse side surface of a silicon wafer when the silicon wafer is ion-implanted at a temperature exceeding 300.degree. C. The ion implanting apparatus has an ion current of 10 mA to 100 mA, and an electron beam generating apparatus for irradiating an electron beam onto the reverse side surface of the silicon wafer. The electron beam is controlled so that current flowing between the wafer and the rotating disk supporting the wafer becomes substantially zero.
Abstract:
An Electron flood apparatus for neutralizing positive charge build-up on substrate during implantation of ions in a substrate by ion beam implantation apparatus. The electron flood apparatus comprises a tube for axially receiving and passing an ion beam to a substrate, an opening in a sidewall of the tube, a plasma chamber having an exit aperture in communication with said opening of said tube, a supply of inert gas to said plasma chamber, a high frequency power generator, and means to deliver high frequency power from said generator to maintain a plasma in said chamber to produce low energy electrons, whereby a flux of said low energy electrons emerges from said chamber through said exit aperture into said tube to merge with the ion beam.
Abstract:
The electron microscope provides sufficient leg space for an observer sitting in a chair in a working posture and allows concentrated observation and swift operation of the electron microscope without burdening the observer. An electron gun column is supported on a support structure formed in a rectangular parallelepiped. The electron gun column, a column evacuation device and a viewing chamber are mounted on the dampers on the support structure through a vibration plate. The table is mounted on the support structure through table supports provided on the top surface of the support structure. Further, the table has an opening at a location corresponding to the viewing chamber so that the table and the viewing chamber, both mounted on the support structure, are not in contact with each other. The layout of the operation panel divides the operation devices of the electron microscope into a group of devices that are frequently reached by touch and operated during observation and a group of devices that are not frequently used during observation. The former group is arranged in arc areas within reach of the operator's arms when pivoted about the elbows as the operator rests his arms naturally on the operation table. The latter group is classified according to the functions performed and is arranged in positions that are behind the arc areas of pivoting arms and are easily recognized visually.
Abstract:
An improved ion beam neutralizer (22) is provided for neutralizing the electrical charge of an ion beam (28) output from an extraction aperture (50). The neutralizer comprises a source of water (52); a vaporizer (54) connected to the source of water; a mass flow controller (56) connected to the vaporizer; and an inlet (60) connected to the mass flow controller. The vaporizer (54) converts water from the source (52) from a liquid state to a vapor state. The mass flow controller (56) receives water vapor from the vaporizer (54) and meters the volume of water vapor output by a mass flow controller outlet (66). The inlet (60) is provided with an injection port (68) located proximate the ion beam extraction aperture (50) and receives the metered volume from the outlet (66). The injection port (68) is positioned near the extraction aperture so that the ion beam and the water vapor interact to neutralize the ion beam. The improved ion beam neutralizer (22) is especially effective in low energy (less than ten kilo-electron volts (10 KeV)) beam applications.
Abstract:
When a charged beam is irradiated on a sample, charge up of electric charge of the same polarity as that of the charged beam is built up on the sample surface. In order to neutralize the charge up electric charge, an apparatus for suppressing electrification of sample in charged beam irradiation apparatus is provided in which electric charge of opposite polarity to that of the charged beam is generated near the sample surface to neutralize the charged beam or charge up electric charge on the sample surface. The electric charge for neutralization is generated by admitting electric charge from a plasma generation unit to the vicinity of the sample surface ionizing gas generated from the sample surface by causing the charged beam to collide the gas or by irradiating electrons from an electron source on the sample surface. Especially when there is a possibility that impurities other than the electric charge for neutralization affect the sample adversely, an impurity generation source is blind folded with a cover so as not to be seen through from the sample and charged beam so that the impurities may be prevented from impinging upon the sample surface or intersecting the charged beam path.