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公开(公告)号：US20170311088A1
公开(公告)日：2017-10-26
申请号：US15497366
申请日：2017-04-26
Applicant: DONGBU HITEK CO., LTD.
Inventor： Jong Won SUN , Han Choon LEE
CPC classification number: H04R19/04 , B81B7/0061 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81C1/00158 , B81C2201/0109 , B81C2201/013 , H04R7/18 , H04R19/005 , H04R31/003 , H04R2201/003
Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and an anchor extending from a circumference of the diaphragm to be connected with an end portion of the diaphragm. The diaphragm is spaced apart from the substrate and the back plate to covers the cavity, and the diaphragm senses an acoustic pressure to generate a displacement. The anchor extends from a circumference of the diaphragm to be connected with an end portion of the diaphragm, and is connected with the substrate to support the diaphragm. Thus, the MEMS microphone can prevent a portion of an insulation layer located around the anchor from remaining and can prevent a buckling phenomenon of the diaphragm from occurring.
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公开(公告)号：US09796580B2
公开(公告)日：2017-10-24
申请号：US14738745
申请日：2015-06-12
Applicant: InvenSense, Inc.
Inventor： Peter Smeys , Martin Lim
IPC: B81B7/00
CPC classification number: B81B7/007 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/0278 , B81B2203/0315 , B81B2207/012 , B81C1/00238 , B81C2203/0785 , B81C2203/0792 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2924/00014 , H01L2924/00012
Abstract: A sensor chip combining a substrate comprising at least one CMOS circuit, a MEMS substrate and another substrate comprising at least one CMOS circuit in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit. Where the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate. The second surface of the MEMS substrate is attached to the second substrate. The first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical inter-connects.
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公开(公告)号：US09788124B2
公开(公告)日：2017-10-10
申请号：US15244347
申请日：2016-08-23
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling , Stefan Singer , Jochen Zoellin
CPC classification number: H04R19/005 , B81B7/0041 , B81B2201/0257 , H01L29/84 , H04R19/04 , H04R2201/003
Abstract: Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a component is implemented in a layer construction on a semiconductor substrate and includes at least one acoustically active diaphragm, which spans a sound hole on the substrate backside, and a stationary acoustically penetrable counterelement having through hole openings, which is situated above/below the diaphragm in the layer construction. At least one outflow channel is developed which makes possible a rapid pressure equalization between the two sides of the diaphragm. In addition, at least one controllable closing element is provided, with which the at least one outflow channel is optionally able to be opened or closed.
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公开(公告)号：US20170275153A1
公开(公告)日：2017-09-28
申请号：US15080356
申请日：2016-03-24
Inventor： Chih-Ming Chen , Ping-Yin Liu , Chung-Yi Yu , Yeur-Luen Tu
CPC classification number: B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/052 , B81C1/00269 , B81C1/00357 , B81C2201/013 , B81C2203/0109 , B81C2203/019 , B81C2203/036 , H01L24/03 , H01L24/09 , H01L2224/02163 , H01L2224/05082 , H01L2224/05109 , H01L2224/05117 , H01L2224/05124 , H01L2224/05138 , H01L2224/05144 , H01L2224/05147 , H01L2924/01014 , H01L2924/01032 , H01L2924/1461
Abstract: An embodiment method includes forming a first plurality of bond pads on a device substrate, depositing a spacer layer over and extending along sidewalls of the first plurality of bond pads, and etching the spacer layer to remove lateral portions of the spacer layer and form spacers on sidewalls of the first plurality of bond pads. The method further includes bonding a cap substrate including a second plurality of bond pads to the device substrate by bonding the first plurality of bond pads to the second plurality of bond pads.
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公开(公告)号：US20170260040A1
公开(公告)日：2017-09-14
申请号：US15066741
申请日：2016-03-10
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Johann Strasser , Gerhard Metzger-Brueckl
CPC classification number: B81B3/0086 , B81B2201/0257 , B81B2203/0127 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003
Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.
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Patent Agency Ranking
公开(公告)号：US20170257687A1
公开(公告)日：2017-09-07
申请号：US15600148
申请日：2017-05-19
Applicant: ANALOG DEVICES, INC.
Inventor： Oliver J. Kierse , Christian Lillelund
CPC classification number: H04R1/02 , B81B7/0061 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C2201/0185 , H01L23/053 , H01L29/84 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/13062 , H01L2924/1461 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.
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公开(公告)号：US09756430B2
公开(公告)日：2017-09-05
申请号：US15148375
申请日：2016-05-06
Inventor： Anthony Bernard Traynor , Richard Ian Laming , Tsjerk H. Hoekstra
CPC classification number: H04R19/04 , B81B3/0021 , B81B3/0072 , B81B3/0094 , B81B2201/00 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , H01L27/00 , H04R19/00 , H04R19/005 , H04R23/00 , H04R31/00 , H04R2499/11
Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume. The cross-sectional area of the second back-volume portion can be made greater than the cross-sectional area of the membrane, thereby enabling the back-volume to be increased without being constrained by the cross-sectional area of the membrane. The back-volume may comprise a third back-volume portion. The third back-volume portion enables the effective diameter of the membrane to be formed more accurately.
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公开(公告)号：US09756429B2
公开(公告)日：2017-09-05
申请号：US15470107
申请日：2017-03-27
Inventor： Colin Robert Jenkins , Tsjerk Hans Hoekstra , Euan James Boyd
CPC classification number: H04R19/005 , B81B3/0021 , B81B3/0075 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00158 , H01L41/09 , H01L41/0926 , H01L2224/16225 , H01L2224/48091 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H04R1/222 , H04R23/006 , H04R2201/003 , Y10T29/49005 , H01L2924/00014
Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.
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公开(公告)号：US20170195814A1
公开(公告)日：2017-07-06
申请号：US15463291
申请日：2017-03-20
Applicant: Robert Bosch GmbH
Inventor： Jay Scott Salmon
CPC classification number: H04R31/006 , B81B7/007 , B81B2201/0257 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0109 , B81C2203/019 , B81C2203/0792 , H01L2224/48137 , H01L2224/73265 , H04R1/04 , H04R19/04 , H04R2201/003
Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.
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90.发明申请公开(公告)号：US20170190571A1
公开(公告)日：2017-07-06
申请号：US15468066
申请日：2017-03-23
Applicant: INVENSENSE, Inc.
Inventor： Julius Ming-Lin Tsai , Baris Cagdaser , Martin Lim , Aleksey S. Khenkin
CPC classification number: B81B7/02 , B81B2201/0214 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/16152 , H04R1/04 , H04R19/04 , H04R29/004 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
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