公开(公告)号：US09969001B2

公开(公告)日：2018-05-15

申请号：US14964451

申请日：2015-12-09

Applicant: Washington State University

Inventor： Rahul P. Panat ,  Deuk H. Heo

IPC: B22F3/105 ,  G06F1/16 ,  H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/04 ,  H01G4/12 ,  H01P11/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/14 ,  H05K3/22 ,  H05K3/46 ,  H01G4/002 ,  B22F3/00 ,  B33Y10/00 ,  B33Y50/02 ,  H05K1/16 ,  B33Y80/00 ,  B22F1/00

CPC classification number: B22F3/1055 ,  B22F1/0018 ,  B22F3/008 ,  B22F2003/1058 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y80/00 ,  C22C2202/02 ,  G06F1/163 ,  H01F17/0006 ,  H01F17/0033 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/0206 ,  H01F41/046 ,  H01G4/002 ,  H01G4/1218 ,  H01P11/001 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/165 ,  H05K3/14 ,  H05K3/22 ,  H05K3/4644 ,  H05K2201/0162

Abstract: Three-dimensional inductors may comprise a passivation layer disposed on a substrate, a three-dimensional pillar comprising a ferromagnetic material disposed on the substrate or the passivation layer, and a conductive trace wound at least partially around the pillar. Three-dimensional capacitors may comprise a passivation layer disposed on a substrate, at least two support pillars comprising a polymeric material disposed on the passivation layer or the substrate, at least two electrodes disposed between the support pillars, a dielectric disposed between the electrodes, and a metal trace. Methods of manufacturing the three-dimensional passives, such as inductors and capacitors, may comprise direct writing the components and curing them for on-chip applications.

公开(公告)号：US20180103536A1

公开(公告)日：2018-04-12

申请号：US15289426

申请日：2016-10-10

Applicant: Nidec Motor Corporation

Inventor： William Pickering ,  Bruce A. Nielsen

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  H05K1/18 ,  H05K5/00 ,  H01L25/07 ,  H05K1/03 ,  H01M10/42

CPC classification number: H05K1/0206 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/49827 ,  H01L23/49844 ,  H01L25/072 ,  H01M10/425 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K5/0008 ,  H05K5/0026 ,  H05K7/1432 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10295

Abstract: An electrical device configuration enables heat to be dissipated from a multi-layer printed circuit board (PCB) while handling electrical currents in excess of 200 amps. The semiconductor devices that convert input DC current to output AC current are mounted to a side of the PCB that is opposite the side of the PCB that receives the input DC current. A base plate that acts as a heat sink includes recessed areas to receive the semiconductor devices and enable the PCB to be positioned close to the base plate. Thermal vias are provided in the PCB to conductive heat from the semiconductor devices to the side of the PCB that receives the input current. Also, the busbars for receiving the input current are positioned to provide short resistive paths to the current to reduce the generation of heat by the current flowing in the PCB.

公开(公告)号：US20180090035A1

公开(公告)日：2018-03-29

申请号：US15710565

申请日：2017-09-20

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Akihiko HANYA ,  Kosaburo ITO ,  Yoshiyuki ABE

IPC: G09F7/00 ,  F21V33/00 ,  E04D13/10

CPC classification number: G09F7/002 ,  B60S1/026 ,  E04D13/103 ,  F21V33/00 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/10106

Abstract: A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided.The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.

公开(公告)号：US20180084635A1

公开(公告)日：2018-03-22

申请号：US15554251

申请日：2016-02-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy

IPC: H05K1/02 ,  H01L33/64 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0209 ,  H01L33/642 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/09681 ,  H05K2201/09827 ,  H05K2201/10106 ,  Y02P70/611

Abstract: A flexible multilayer substrate for attaching a light emitting semiconductor device includes a first dielectric layer, a circuit layer on the first dielectric layer; a first thermally conductive layer on the circuit layer; a discontinuous metal support layer having a plurality of openings therethrough disposed on the first thermally conductive layer, and a second thermally conductive layer on the support layer. The flexible multilayer substrate further includes a plurality of conductive vias extending through the first dielectric layer such that the circuit layer is in communication with the plurality of conductive vias. The first and second thermally conductive layers are in contact within said openings.

公开(公告)号：US20180083662A1

公开(公告)日：2018-03-22

申请号：US15382241

申请日：2016-12-16

Applicant: Syed Taymur Ahmad ,  Bruce Acton

Inventor： Syed Taymur Ahmad ,  Bruce Acton

IPC: H04B1/3888 ,  H05K3/28 ,  H05K3/10 ,  H05K5/00 ,  H05K1/03 ,  H05K1/09 ,  H01R13/648

CPC classification number: H04B1/3888 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: Methods for protecting an electronic device from contaminants by applying different insulating and conducting materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying an electrically insulating material, such as isobutylene isoprene rubber, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with different materials. Electronic devices that are protected by such coatings are also disclosed, such as smart phones, computers, head phones, and gaming devices, all of which show improve protection from contaminants, especially liquid contaminants.

公开(公告)号：US09863584B2

公开(公告)日：2018-01-09

申请号：US14946012

申请日：2015-11-19

Applicant: ROHM CO., LTD.

Inventor： Tomoharu Horio ,  Teruki Ono

IPC: F21K99/00 ,  H01L25/075 ,  H05K3/28 ,  F21V15/00 ,  F21K9/232 ,  F21S8/02 ,  F21V3/02 ,  F21V23/00 ,  H01L33/64 ,  H05K1/03 ,  F21V29/74 ,  F21V29/89 ,  F21Y105/10 ,  F21Y115/10 ,  F21K9/238

CPC classification number: F21K9/232 ,  F21K9/238 ,  F21S8/026 ,  F21V3/02 ,  F21V15/00 ,  F21V23/002 ,  F21V23/006 ,  F21V29/74 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/644 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0373 ,  H05K3/282 ,  H05K2201/0162 ,  H05K2201/2054 ,  H01L2924/00012

Abstract: An LED lighting apparatus is disclosed. The LED lighting apparatus includes a board having a principal surface, a plurality of LED chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of LED chips. Further, the LED lighting apparatus includes a frame-like bank which is provided on the principal surface of the board and surrounds the plurality of LED chips. In this case, the wiring pattern has one or more pads having a first portion interposed between the bank and the plurality of LED chips. The LED lighting apparatus further includes a protective layer covering at least a portion of the pads.

公开(公告)号：US09848497B2

公开(公告)日：2017-12-19

申请号：US15343759

申请日：2016-11-04

Applicant: GiMer Medical Co., Ltd.

Inventor： Chi-Heng Chang ,  Chan-Yi Cheng ,  Chen-Tun Wu

IPC: H05K1/00 ,  H05K3/28 ,  H05K3/00 ,  H05K1/03 ,  A61B5/145 ,  A61N1/36 ,  A61N1/362 ,  A61N1/375 ,  A61B5/00

CPC classification number: H05K3/285 ,  A61B5/14503 ,  A61B5/14532 ,  A61B5/686 ,  A61B2503/40 ,  A61B2562/12 ,  A61B2562/18 ,  A61N1/3605 ,  A61N1/362 ,  A61N1/375 ,  H05K1/0326 ,  H05K3/0011 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/09063 ,  H05K2203/1327 ,  H05K2203/1338 ,  H05K2203/1377

Abstract: A waterproof structure for an implanted electronic device is capable of preventing the liquid or moist from entering and damaging the circuit board of the electronic device. The waterproof structure includes a shell, a first material layer, a second material layer, and a third material layer. The first material layer covers at least a part of the implanted electronic device. The second material layer covers the first material layer. The internal space of the shell is configured for accommodating the implanted electronic device. The shell is made of PEEK (polyether ether ketone). The third material layer is disposed between the second material layer and the shell.

公开(公告)号：US09834686B2

公开(公告)日：2017-12-05

申请号：US14537250

申请日：2014-11-10

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Kyungjae Shin ,  Kiwoong Kim

IPC: H05K7/00 ,  C09D5/00 ,  H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  C08L83/04 ,  C08J3/24 ,  C08K5/00 ,  H01L23/29 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

CPC classification number: C09D5/00 ,  C08J3/243 ,  C08K5/0025 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2231 ,  C08K2003/2296 ,  C08K2003/282 ,  C08K2003/385 ,  C08L83/04 ,  H01L23/296 ,  H05K1/0259 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10181

Abstract: An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.

公开(公告)号：US20170253765A1

公开(公告)日：2017-09-07

申请号：US15059665

申请日：2016-03-03

Applicant: Motorola Mobility LLC

Inventor： Richard W. Brotzman ,  Ernest Sirois ,  Deborah Paskiewicz

IPC: C09D183/04 ,  H05K1/18

CPC classification number: C09D183/04 ,  C08G77/24 ,  C08G77/80 ,  C09D183/08 ,  H05K1/18 ,  H05K3/282 ,  H05K3/285 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2203/095

Abstract: A polysiloxane film comprises Si—O bonds and has a thickness of 0.3 to 1.5 microns. Adjacent electrodes coated with the polysiloxane film have a leakage current of at most 0.01 mA at 10 V after contact with water. An electrode coated with the polysiloxane film has a contact resistance of at least 0.01 ohms at 1.0 mm of pogo pin compression under a 1.0 N load. The polysiloxane film provides IPx7 protection from ingress of water.

公开(公告)号：US20170199323A1

公开(公告)日：2017-07-13

申请号：US15472980

申请日：2017-03-29

Applicant: Funai Electric Co., Ltd.

Inventor： Akira YOKAWA ,  Yuki KITA ,  Akihiro FUJIKAWA ,  Yasuyuki FUKUMOTO ,  Yasuhiro MORI ,  Yuto SUZUKI ,  Hirofumi HORIUCHI ,  Hirohiko TSUJI ,  Takahito YAMANAKA ,  Hideo YONEZAWA

IPC: F21V8/00

CPC classification number: G02B6/0088 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  G02F1/133615 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/133328 ,  G02F2001/133628 ,  G06F1/20 ,  H05K1/0209 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/09909

Abstract: This display includes a light source portion, a first heat radiation member for radiating heat generated by the light source portion, a rear housing covering the first heat radiation member in a state in contact with the first heat radiation member, and a cover member covering a rear surface of the rear housing so that the rear surface of the rear housing is partially exposed outward. The first heat radiation member is arranged on a region corresponding to a region of the rear housing exposed outward from the cover member as viewed from the side of the rear surface.