公开(公告)号：US20060068216A1

公开(公告)日：2006-03-30

申请号：US10957196

申请日：2004-09-30

Applicant: Fay Hua ,  C. Garner

Inventor： Fay Hua ,  C. Garner

IPC: B23K35/36 ,  C22C1/05 ,  C22C5/02

CPC classification number: C22C5/02 ,  B22F1/025 ,  B23K35/0244 ,  H01B1/02 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K3/3484 ,  H05K2201/0257 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A nano-sized metal particle composition includes a first metal that has a particle size of about 20 nanometer or smaller. The nano-sized metal particle can include a second metal that forms a shell about the first metal. A microelectronic package is also disclosed that uses the nano-sized metal particle composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the nano-sized metal particle composition.

公开(公告)号：US06921626B2

公开(公告)日：2005-07-26

申请号：US10400714

申请日：2003-03-27

Applicant: Kevin Barry Ray ,  Ken-Ichi Shimazu ,  Anthony Paul Kitson

Inventor： Kevin Barry Ray ,  Ken-Ichi Shimazu ,  Anthony Paul Kitson

IPC: G03F7/004 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/12 ,  G03C5/00 ,  G11B7/24

CPC classification number: H05K3/1283 ,  G03F7/0047 ,  H05K1/095 ,  H05K3/0082 ,  H05K3/02 ,  H05K3/125 ,  H05K2201/0257 ,  H05K2203/013 ,  H05K2203/0514 ,  H05K2203/1105 ,  Y10S430/145 ,  Y10S430/165

Abstract: The present invention provides methods of making an electronic part in which a nanopaste composed of inorganic nanoparticles and a carrier is applied onto a surface of a substrate. The composition is then processed to form an electrically conductive pattern area that adheres to the surface of the substrate. Optionally, the conductivity of the pattern area may be improved by heating.

Abstract translation: 本发明提供了制造电子部件的方法，其中将由无机纳米颗粒组成的纳米糊料和载体涂覆在基材的表面上。 然后将组合物处理以形成粘附到基底表面的导电图案区域。 可选地，可以通过加热来改善图案区域的导电性。

公开(公告)号：US20050150684A1

公开(公告)日：2005-07-14

申请号：US11024992

申请日：2004-12-29

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L21/60 ,  H05K3/10 ,  H05K3/32 ,  H05K1/09

CPC classification number: H01L24/81 ,  B82Y30/00 ,  H01L24/11 ,  H01L2224/11332 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/102 ,  H05K3/321 ,  H05K2201/0257 ,  H05K2201/10674

Abstract: An electronic device includes a plurality of components, nanoparticles to bond the components, and a receiving layer for holding the nanoparticles, the receiving layer being disposed on at least one of the bonded components. The electronic device may further include an electrode disposed on at least one of the plurality of components. The receiving layer is disposed on the surface of the electrode. Conductive particles etc. are mixed in the receiving layer.

Abstract translation: 电子器件包括多个组分，用于结合组件的纳米颗粒和用于保持纳米颗粒的接收层，接收层设置在至少一个接合部件上。 电子设备还可以包括设置在多个部件中的至少一个上的电极。 接收层设置在电极的表面上。 导电粒子等在接收层中混合。

公开(公告)号：US20040109298A1

公开(公告)日：2004-06-10

申请号：US10644386

申请日：2003-08-19

Inventor： William F. Hartman ,  Kirk M. Slenes ,  Kristen J. Law

IPC: C04B035/468

CPC classification number: H05K1/162 ,  B32B27/00 ,  H05K3/4611 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0317 ,  H05K2201/09309

Abstract: A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140null C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from null55 to 125null C. Additionally, a method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture that is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

Abstract translation: 公开了一种用于制造印刷线路板的电介质基片，其中电介质基片包括Tg大于140℃的至少一种有机聚合物和至少一种填料。 本发明的电介质基板的介电常数在-55〜125℃的温度范围内变化小于15％。另外，制造用于包含在印刷电路板内的积分电容元件的方法。 水热制备的纳米粉末允许制造非常薄的介电层，其提供增加的介电常数并且容易被微孔穿透。 公开了制备水热制备的纳米粉末和溶剂的浆料或悬浮液的方法。 将合适的粘合材料，例如聚合物与纳米粉末浆料混合，以产生形成介电层的复合混合物。 介电层可以在固化之前放置在导电层上，或者可以通过层压或通过金属化工艺，例如气相沉积或溅射将导电层施加在固化的介电层上。

公开(公告)号：US20040082189A1

公开(公告)日：2004-04-29

申请号：US10680116

申请日：2003-10-08

Inventor： Masashi Totokawa

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K3/4632 ,  H05K1/167 ,  H05K3/125 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/013

Abstract: A multi-layer circuit board is manufactured by laminating and bonding together a plurality of resin films, on each of which a circuit pattern is directly drawn by injecting ink. The ink includes metal particles, having a diameter in the order of nanometers, dispersed therein. At the same time when the laminated resin films are bonded together under pressure and heat, the metal particles in the ink are sintered, thereby forming a solid electrical circuit printed on the resin film. Since the circuit pattern is directly drawn on the resin film, the process of manufacturing the multi-layer circuit board is simplified.

Abstract translation: 多层电路板通过将多个树脂膜层压并粘接在一起而制造，其中每个树脂膜通过注入油墨而直接绘制电路图案。 油墨包括分散在其中的直径为数量级的金属颗粒。 同时当压力和热量将层压树脂膜粘合在一起时，油墨中的金属颗粒被烧结，从而形成印刷在树脂膜上的固体电路。 由于电路图案直接绘制在树脂膜上，因此简化了多层电路板的制造工艺。

公开(公告)号：US06710261B2

公开(公告)日：2004-03-23

申请号：US10173053

申请日：2002-06-18

Applicant: Toru Takebe ,  Yoshio Watanabe ,  Kentaro Fujii

Inventor： Toru Takebe ,  Yoshio Watanabe ,  Kentaro Fujii

IPC: H05K102

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/423 ,  H05K3/4623 ,  H05K2201/0257 ,  H05K2201/0355 ,  H05K2203/063 ,  H05K2203/0733 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49156

Abstract: A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates, each having a conductive pattern on at least one face thereof. Any adjacent two of the substrates are separated by an insulating layer, and the conductive pattern of a first substrate of the two substrates faces the conductive pattern of a second substrate of the two substrate. The conductive pattern of a first substrate has one or more bumps for electrical connection to the second substrate. The bump and the conductive pattern of the second substrate are bonded to each other with the conductive bond applied to the tip of the bump.

Abstract translation: 导电键包括导电胶体颗粒和用于分散导电胶体颗粒的分散剂。 多层印刷电路板包括多个基板，每个基板在其至少一个面上具有导电图案。 任何相邻的两个基板被绝缘层分开，并且两个基板的第一基板的导电图案面对两个基板的第二基板的导电图案。 第一基板的导电图案具有用于与第二基板电连接的一个或多个凸块。 第二基板的凸起和导电图案通过施加到凸块的尖端的导电接合而彼此接合。

公开(公告)号：US20040035605A1

公开(公告)日：2004-02-26

申请号：US10646146

申请日：2003-08-22

Applicant: Massachusetts Institute of Technology

Inventor： Saul Griffith ,  Joseph M. Jacobson ,  Scott Manalis

IPC: H05K001/09 ,  H05K001/00 ,  G03F007/20 ,  G03F007/16 ,  G03F007/26

CPC classification number: B81C1/00373 ,  B81B2207/07 ,  B82Y30/00 ,  G03F7/00 ,  G03F7/002 ,  G03F7/0042 ,  H01L21/288 ,  H01L51/0004 ,  H05K3/102 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/1131

Abstract: Electrically (and, possibly, mechanically) active patterns are applied using a colloidal suspension of nanoparticles that exhibit a desired electrical characteristic. The nanoparticles are surrounded by an insulative shells that may be removed by therefrom by application of energy (e.g., in the form of electromagnetic radiation or heat). The nanoparticle suspension is applied to a surface, forming a layer that is substantially insulative owing to the nanoparticle shells. The applied suspension is exposed to energy to remove the capping groups and fuse the particles into cohesion. If the nanoparticle suspension was deposited as a uniform film, the energy is applied in a desired pattern so that unexposed areas remain insulative while exposed areas exhibit the electrical behavior associated with the nanoparticles. If the nanoparticle suspension was deposited in a desired pattern, it may be uniformly exposed to energy. Additional layers may be applied in the same manner, one over the other, to form a multilayer device.

Abstract translation: 使用具有所需电特性的纳米粒子的胶态悬浮液来施加电（并且可能是机械）活性图案。 纳米颗粒由可通过施加能量（例如，以电磁辐射或热的形式）由其除去的绝缘壳围绕。 将纳米颗粒悬浮液施加到表面，由于纳米颗粒壳形成基本上绝缘的层。 将所施加的悬浮液暴露于能量以除去封盖组并将颗粒融合为内聚力。 如果纳米颗粒悬浮液作为均匀膜沉积，则能量以期望的图案施加，使得未曝光区域保持绝缘，而暴露的区域表现出与纳米颗粒相关的电性能。 如果纳米颗粒悬浮液以期望的图案沉积，则其可以均匀地暴露于能量。 附加的层可以以相同的方式一个一个地施加以形成多层器件。

公开(公告)号：US06664027B2

公开(公告)日：2003-12-16

申请号：US10060151

申请日：2002-01-30

Applicant: Saul Griffith ,  Joseph M. Jacobson ,  Scott Manalis

Inventor： Saul Griffith ,  Joseph M. Jacobson ,  Scott Manalis

IPC: G03F700

CPC classification number: B81C1/00373 ,  B81B2207/07 ,  B82Y30/00 ,  G03F7/00 ,  G03F7/002 ,  G03F7/0042 ,  H01L21/288 ,  H01L51/0004 ,  H05K3/102 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/1131

Abstract: Electrically (and, possibly, mechanically) active patterns are applied using a colloidal suspension of nanoparticles that exhibit a desired electrical characteristic. The nanoparticles are surrounded by an insulative shells that may be removed by therefrom by application of energy (e.g., in the form of electromagnetic radiation or heat). The nanoparticle suspension is applied to a surface, forming a layer that is substantially insulative owing to the nanoparticle shells. The applied suspension is exposed to energy to remove the capping groups and fuse the particles into cohesion. If the nanoparticle suspension was deposited as a uniform film, the energy is applied in a desired pattern so that unexposed areas remain insulative while exposed areas exhibit the electrical behavior associated with the nanoparticles. If the nanoparticle suspension was deposited in a desired pattern, it may be uniformly exposed to energy. Additional layers may be applied in the same manner, one over the other, to form a multilayer device.

公开(公告)号：US12101893B2

公开(公告)日：2024-09-24

申请号：US17596920

申请日：2020-07-28

Applicant: XTPL S.A.

Inventor： Mateusz Zając ,  Urszula Nowak ,  Piotr Kowalczewski ,  Filip Granek ,  Jan Kotarski ,  Maciej Tybel ,  Szymon Zięba

IPC: H05K3/12 ,  B05D1/26

CPC classification number: H05K3/1241 ,  B05D1/26 ,  B05D1/265 ,  H05K2201/0257 ,  H05K2203/0126

Abstract: A method of dispensing a metallic nanoparticle composition along a trajectory on a substrate is disclosed. The composition is dispensed from a nozzle through its outlet. The outlet is characterized by an outlet size. First, an initial pressure is applied to the composition in the nozzle to cause the composition to flow from the outlet. The nozzle is positioned at a height such that the composition does not flow onto the substrate. Second, the nozzle is lowered toward the substrate such that a fluid bridge forms between the outlet and the substrate and an adjusted pressure is applied to the composition in the nozzle. The adjusted pressure is lower than needed for the composition to continue to flow from the outlet. Third, the fluid is dispensed from the nozzle. A dispensing pressure is applied to the fluid while the nozzle is laterally displaced along the trajectory on the substrate.

公开(公告)号：US12096554B2

公开(公告)日：2024-09-17

申请号：US17900309

申请日：2022-08-31

Applicant: XEROX CORPORATION

Inventor： Naveen Chopra ,  Barkev Keoshkerian ,  Chad Steven Smithson ,  Kurt I. Halfyard ,  Michelle N. Chretien

IPC: H05K1/05 ,  B60R1/06 ,  B60R1/25 ,  C09D11/02 ,  C09D11/03 ,  C09D11/037 ,  C09D11/30 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  G02F1/153 ,  G02F1/155 ,  G02F1/157 ,  G02F1/161 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H01L23/00 ,  H01L23/498 ,  H05K1/09 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/097 ,  C09D11/03 ,  C09D11/037 ,  C09D11/30 ,  C09D11/52 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H05K3/3457 ,  H01L2224/29239 ,  H01L2224/32227 ,  H01L2224/75155 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/14 ,  H05K3/3431 ,  H05K3/3485 ,  H05K3/3494 ,  H05K2201/0257

Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.